Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a gate structure over the substrate, a layer of dielectric material over the gate structure, a source/drain (S/D) contact layer formed through and adjacent to the gate structure, and a trench conductor layer over and in contact with the S/D contact layer. The S/D contact layer can include a layer of platinum-group metallic material and a silicide layer formed between the substrate and the layer of platinum-group metallic material. A top width of a top portion of the layer of platinum-group metallic material can be greater than or substantially equal to a bottom width of a bottom portion of the layer of platinum-group metallic material.

Abstract: An optical system including an enclosure including a front end and a rear end, a first pair of apertures configured to be disposed on a front plane on the front end of the enclosure and a single optical lens system disposed between the front end and the rear end of the enclosure, wherein the first pair of apertures are configured to allow sets of light rays into the enclosure through the single optical lens system to be cast on an image plane as first and second spots, the image plane being parallel to the front plane, if the first and second spots are concentrically disposed, the sets of light rays are determined to be parallelly disposed with respect to one another, otherwise the sets of light rays are determined to not be parallelly disposed with one another.

Abstract: A sample analyzing method and a sample preparing method are provided. The sample analyzing method includes a sample preparing step, a placing step, and an analyzing step. The sample preparing step includes an obtaining step implemented by obtaining an identification information; and a marking and placing step implemented by placing a sample carrying component having a sample disposed thereon into a marking equipment, allowing the marking equipment to utilize the identification information to form an identification structure on the sample carrying component, and placing the sample carrying component into one of the accommodating slots according to the identification information. The placing step is implemented by taking out the sample carrying component from one of the accommodating slots and placing the sample carrying component into an electron microscope equipment. The analyzing step is implemented by utilizing the electron microscope equipment to photograph the sample to generate an analyzation image.

Abstract: A defect detection method includes: obtaining an image of a first defective block output by the SPI machine; wherein the first defective block is a solder paste block that is not qualified for printing after being detected by the SPI machine; processing the image of the first defective block; detecting whether solder paste printing in the first defective block is qualified; and determining that the first defective block is a second defective block and determining a defect type of the first defective block when the solder paste printing of the first defective block is not qualified. A terminal device and a non-volatile storage medium therein, for performing the above-described method, are also disclosed.

Abstract: Techniques pertaining to seamless switching control for foldable or flip devices are described. A processor implemented in a multi-display apparatus having a primary display and a secondary display executes a status change with respect to the primary display and the secondary display by: (1) maintaining a power supplied to the secondary display during the status change; and (2) switching the primary display and the secondary display from a first state to a second state.

Abstract: A light control module including a first substrate, a second substrate, a medium layer, a polarizing element and an electrical connection element is provided. The first substrate has an outer surface and an inner surface opposite to the outer surface. The second substrate is opposite to the first substrate. The medium layer is disposed between the inner surface of the first substrate and the second substrate. The polarizing element is disposed on the outer surface of the first substrate and includes an adhesive layer. The electrical connection element is at least partially disposed on the outer surface of the first substrate and connected to the adhesive layer. A three-dimensional printing device and an operation method thereof are also provided.

Abstract: A sense circuit includes memory cell characterization circuitry, storage circuitry, switching circuitry, and bit line biasing circuitry. The sense circuit is configured to perform a sense operation to sense a characterization of a memory cell. During a pre-charge phase, the memory cell characterization circuitry and the bit line biasing circuitry set differential voltages in the storage circuitry to levels dependent on input offset voltages according to certain polarities. The storage circuitry maintains the differential voltages during the sense phase, allowing the memory cell characterization circuitry to cancel output the input offset voltages when generating output voltages used to identify a characterization of the memory cell. The memory cell characterization circuitry also generates its output voltage based on a reference current through a reference bit line.

Abstract: A sense circuit includes memory cell characterization circuitry, storage circuitry, switching circuitry, and bit line biasing circuitry. The sense circuit is configured to perform a sense operation to sense a characterization of a memory cell. During a pre-charge phase, the memory cell characterization circuitry and the bit line biasing circuitry set differential voltages in the storage circuitry to levels dependent on input offset voltages according to certain polarities. The storage circuitry maintains the differential voltages during the sense phase, allowing the memory cell characterization circuitry to cancel output the input offset voltages when generating output voltages used to identify a characterization of the memory cell. The memory cell characterization circuitry also generates its output voltage based on a reference current through a reference bit line.

Abstract: A magnetic attraction socket structure includes a socket body and a magnetic attraction assembly mounted inside the socket body. The socket body includes an installation section formed therein at a top of which a stepped surface is formed. A circumferential groove is formed in an inner circumference of the socket body to correspond to a bottom of the installation section for receiving and holding an elastic ring clip therein. The magnetic attraction assembly has a top positioned against the stepped surface of the socket body. The magnetic attraction assembly includes an insulation jacket and an annular magnetic body, in which the insulation jacket having no permeability includes a receiving hole to receive the annular magnetic body to fit therein. The insulation jacket includes a stop on an inner circumference of the receiving hole for retaining the annular magnetic body in position.

Abstract: A horizontal semiconductor device includes an electrically conductive substrate having a first surface, a buffer layer disposed on the first surface of the substrate, an epitaxial unit disposed on the buffer layer opposite to the substrate, a first electrode unit disposed on the epitaxial unit, and a second electrode unit. The substrate has an exposed region that is exposed from the buffer layer and the epitaxial unit. The second electrode unit includes a first conductive member disposed on the epitaxial unit and spaced apart from the first electrode unit, and a second conductive member extending from the first conductive member to the exposed region.

Abstract: A dye-sensitized solar cell includes a first substrate, a first electrode, a semiconductor layer, a thin photosensitive dye layer, an electrolyte layer, a second electrode and a second substrate. The first electrode is formed on the first substrate as a working electrode, the semiconductor layer is formed on the first electrode and the thin photosensitive dye layer is formed on the semiconductor layer by ultrasound-treating the semiconductor layer which is immersed in a photosensitive dye solution. The second electrode is formed on the second substrate as a counter electrode and the electrolyte layer is disposed between the semiconductor layer and the second electrode.

Abstract: Method for automatically determining a planar event such as a bedding plane from azimuthal wellbore log data (501). The image log may optionally first be filtered using a smoothing filter (502). Then, the image log is inputted to a gradient (first-derivative) filter (503). The image log is also used to find the optimal local sinusoidal trend (or orientation) on the image by determining the best sine wave at each depth among all azimuthal curves from the image using a minimum-variance method (504). Finally, bed boundaries are located based on highest contrast (506) calculated along the sinusoidal lines on the gradient image (505).

Abstract: Method for automatically determining a planar event such as a bedding plane from azimuthal wellbore log data (501). The image log may optionally first be filtered using a smoothing filter (502). Then, the image log is inputted to a gradient (first-derivative) filter (503). The image log is also used to find the optimal local sinusoidal trend (or orientation) on the image by determining the best sine wave at each depth among all azimuthal curves from the image using a minimum-variance method (504). Finally, bed boundaries are located based on highest contrast (506) calculated along the sinusoidal lines on the gradient image (505).

Abstract: A connector assembly has a plug and socket; the plug includes an insulative body, at least one first power contact, at least one second power contact and a metal shield. The insulative body has a base portion and a tongue portion extending from the base portion. The tongue portion includes a plurality of power contact grooves and penetrates through the base portion, and at least one first convex portion defined in a periphery of the tongue portion. The first power contact and the second power contact are respectively formed on the power contact grooves of the insulative body for connection to a power source in a socket of host device. The metal shield encloses the tongue portion of the insulative body to cover the tongue portion. Consequently, the charging speed can be increased, reducing charging time.

Abstract: A power supply system with an automatic transfer function includes a main-power-loop apparatus, a backup-power-loop apparatus, and a control unit. The main-power-loop apparatus has a first primary relay switch and a first SCR switch. The backup-power-loop apparatus has a second primary relay switch and a second SCR switch. The control unit turns on the first primary relay switch and the first SCR switch when a main power source can normally supply power, thus supplying power to a load via the main-power-loop apparatus by the main power source. The control unit turns on the second primary relay switch and the second SCR switch when the main power source cannot normally supply power, thus supplying power to the load via the backup-power-loop apparatus by a backup power source.

Abstract: A biochemical reactor involves an online cell examination microscope thereon. The online cell examination microscope comprises a main body, an objective lens, an observation entrance window, a sampling device, an external light source system. Said observation entrance window lies in front of said main body and the sampling device lies in front of said observation entrance window. An objective lens and said external light source system lie behind the observation entrance window in the main body. A reflector prism is installed between the external light source system and the objective lens. A reflector lies behind the objective lens and in front of the observation entrance window. An annular diaphragm is placed in front of the reflecting prism. A CCD or an area image sensor is arranged on the upper side of the reflectance prism.

Abstract: A connector assembly has a plug and socket; the plug includes an insulative body, at least one first power contact, at least one second power contact and a metal shield. The insulative body has a base portion and a tongue portion extending from the base portion. The tongue portion includes a plurality of power contact grooves and penetrates through the base portion, and at least one first convex portion defined in a periphery of the tongue portion. The first power contact and the second power contact are respectively formed on the power contact grooves of the insulative body for connection to a power source in a socket of host device. The metal shield encloses the tongue portion of the insulative body to cover the tongue portion. Consequently, the charging speed can be increased, reducing charging time.

Abstract: A data storage device includes a memory, a controller, a first module, a first interface, and a second interface. The first interface and the second interface are coupled to the controller. The controller is used to access data in the memory, the first module is used to perform a first predetermined function. The second interface is inaccessible to the first module. The first interface may gain access to at least one additional module in the data storage device to perform at least one additional predetermined function which the second interface may not gain access to and may not perform.

Abstract: An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221); and linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical de