Patents by Inventor Ju Eok Park

Ju Eok Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including antenna and method of manufacturing the semiconductor package
    Patent number: 12614850
    Abstract: A semiconductor package includes: a lower package; and an upper package stacked on the lower package, wherein the lower package includes: a first redistribution structure; a semiconductor chip mounted on the first redistribution structure; a first molding layer surrounding the semiconductor chip on the first redistribution structure; and first vertical connection conductors disposed on the first redistribution structure and vertically passing through the first molding layer, wherein the upper package includes: a second molding layer disposed on the lower package; second vertical connection conductors vertically passing through the second molding layer and electrically connected to the first vertical connection conductors; and an antenna structure disposed on the second molding layer.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: April 28, 2026
    Assignee: NEPES CO., LTD.
    Inventors: Jung Won Lee, Ju Eok Park, In Soo Kang
  • SEMICONDUCTOR PACKAGE INCLUDING ANTENNA AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
    Publication number: 20230216201
    Abstract: A semiconductor package includes: a lower package; and an upper package stacked on the lower package, wherein the lower package includes: a first redistribution structure; a semiconductor chip mounted on the first redistribution structure; a first molding layer surrounding the semiconductor chip on the first redistribution structure; and first vertical connection conductors disposed on the first redistribution structure and vertically passing through the first molding layer, wherein the upper package includes: a second molding layer disposed on the lower package; second vertical connection conductors vertically passing through the second molding layer and electrically connected to the first vertical connection conductors; and an antenna structure disposed on the second molding layer.
    Type: Application
    Filed: December 22, 2022
    Publication date: July 6, 2023
    Inventors: Jung Won LEE, Ju Eok Park, In Soo Kang