Abstract: An embodiment of the present application discloses a display module and a display terminal, and the display module and the display terminal include a display panel and a cover plate. The cover plate has an attaching curved surface facing the display panel, a portion of the attaching curved surface is attached with a display side of the display panel through a transparent glue, and the attaching curved surface fully covers a display main body and a bending portion. The bending portion includes a wiring and at least one groove, and the groove extends along a bending direction of the bending portion and is positioned outside the wiring.

Abstract: Among the various aspects of the present disclosure is the provision of MHC-independent T cell receptor (miTCR) compositions and methods of making and using the same.

Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.

Abstract: Non-slip toilet training devices are disclosed which include a layer of resilient material positioned at all contact surfaces between the training device and a conventional toilet. A raised resilient front portion serves to prevent potential urine flow from spraying outside of the confines of the training device.

Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.

Abstract: A container assembly having a container, a lid having a spout, and a partition to separate the container into multiple subcompartments. The partition has a flexible edge which is in contact with an inner surface of the lid. When the lid rotates about the container, the flexible edge is biased against the lid and is capable of being deformed.

Abstract: A barrier latch assembly having a housing including a first locking element, a second locking element, a trigger and a swing plate. The swing plate is coupled to the trigger and to the first and second locking elements. When the trigger is depressed, the swing plate pivots from an unlock position to a lock position over a rear side of the first and second locking element thereby blocking and preventing the first and second locking elements from being depressed inward.

Abstract: A composite thermistor material, a preparation method and an application thereof. The perovskite structure oxide and the pyrochlorite structure oxide are composite by solid state reaction method, which comprise process of ball milling, drying, and calcining. Then the thermistor ceramics with high temperature resistance and controllable B value are sintered at high temperature after mould forming, then the thermistor disks are coated by platinum paste, and then the platinum wire is welded as the lead wire to form thermistor element. The thermistor of the invention can realize temperature measurement from room temperature to 1000° C. and has good negative temperature coefficient thermistor characteristics. The thermistor coefficient B can be adjusted by changing the two-phase ratio to meet the requirements of different systems.

Abstract: A compressible pacifier is described having a flexible neck portion connecting a nipple to a base portion. The flexible neck portion allows for the nipple to be extended for use as needed, and compressed within the planar surface of the base portion when the pacifier is not in use or is being transported.

Abstract: A low profile, modular container is described having two cylindrical compartments which connect together at a center portion. The ends of each compartment include a pair of pivoting jaws which are adapted to open to accommodate a pacifier within the body of each compartment.

Abstract: A composite thermistor material, a preparation method and an application thereof. The perovskite structure oxide and the pyrochlorite structure oxide are composite by solid state reaction method, which comprise process of ball milling, drying, and calcining. Then the thermistor ceramics with high temperature resistance and controllable B value are sintered at high temperature after mould forming, then the thermistor disks are coated by platinum paste, and then the platinum wire is welded as the lead wire to form thermistor element. The thermistor of the invention can realize temperature measurement from room temperature to 1000° C. and has good negative temperature coefficient thermistor characteristics. The thermistor coefficient B can be adjusted by changing the two-phase ratio to meet the requirements of different systems.

Abstract: A pressure fit mesh gate having an outer casing and a mesh barrier door. The outer casing has a pair of upright frame elements connected to a lower cross element. The mesh barrier door is positioned within the outer casing. The mesh barrier door is hingedly connected to one of the upright frame elements. The barrier door has a frame including a first side member and a second side member friction fit connected at their ends by corner joints to an upper member and a lower member. At least one of the corner joints is a two-part corner joint. The two-part corner joint has a first extension that is friction fit into a first end of one of the members, and a second extension friction fit into an adjacent end of another one of the members.

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

Abstract: A handle device for a strap having a clip and a receiving element disposed within a grip. The clip lockingly engages the grip. The combined structure of the clip and grip forms a slightly curved handle adapted for a user to carry a container by comfortably clasping the handle.

Abstract: A compressible pacifier is described having a flexible neck portion connecting a nipple to a base portion. The flexible neck portion allows for the nipple to be extended for use as needed, and compressed within the planar surface of the base portion when the pacifier is not in use or is being transported.

Abstract: A low profile, modular container is described having two cylindrical compartments which connect together at a center portion. The ends of each compartment include a pair of pivoting jaws which are adapted to open to accommodate a pacifier within the body of each compartment.

Abstract: A barrier assembly is disclosed having a middle door portion that pivots about a vertical axis on one side of the frame. A linear extending actuator provides widening ability to the barrier assembly, and allows a more secure grip on opposing walls.

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

Abstract: Non-slip toilet training devices are disclosed which include a layer of resilient material positioned at all contact surfaces between the training device and a conventional toilet. A raised resilient front portion serves to prevent potential urine flow from spraying outside of the confines of the training device.

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.