Abstract: A system and a method for providing a sign language service are provided. The system includes a first terminal that generates at least one piece of first message data corresponding to a message to be delivered by a first user. The system also includes a server that converts the first message data received from the first terminal into first operation data corresponding to an operation of a robot. The system also includes the robot that performs an operation according to the first operation data received from the server. The server sorts two or more pieces of first operation data based on a transmission order according to a predetermined criterion, when identifying the two or more pieces of first operation data, and transmits the pieces of sorted first operation data to the robot. The robot performs the operation, based on the pieces of sorted first operation data.

Abstract: A quantum dot device including an anode and a cathode, a light emitting layer disposed between the anode and the cathode, the light emitting layer comprising quantum dots, a first hole auxiliary layer disposed on the anode, the first hole auxiliary layer including poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate or a derivative thereof (PEDOT:PSS), a second hole auxiliary layer disposed on the first hole auxiliary layer and including a hole transport material different from the PEDOT:PSS, wherein the light emitting layer is disposed on the second hole auxiliary layer, wherein the first hole auxiliary layer has a first surface facing the anode and a second surface facing the second hole auxiliary layer, and the second surface includes a surface modification region including a surface modification material having a carboxylic acid group, a phosphonic acid group, a sulfonic acid group, or a salt thereof. An electronic device that includes the quantum dot device.

Abstract: A semiconductor device with multiple zero differential transconductance includes: a conductive substrate; a first insulating layer and a second insulating layer disposed on the conductive substrate; a first semiconductor and a second semiconductor disposed on first portions of the first insulating layer and the second insulating layer, respectively; a first buffer layer and a second buffer layer disposed on electrode contact areas of the first semiconductor and the second semiconductor, respectively; and an anode electrode and a cathode electrode disposed on second portions, which are different from the first portions, of the first insulating layer and the second insulating layer and on the first buffer layer and the second buffer layer, respectively, wherein the first semiconductor and the second semiconductor are disposed in parallel with each other and connected by the anode electrode and the cathode electrode.

Abstract: An object synchronization apparatus includes a memory storing computer-executable instructions and at least one processor that accesses the memory and executes the instructions. The at least one processor: creates a virtual object corresponding to a source code of a user in a virtual space, in response to a compiling request based on the source code; performs verification for the created virtual object; performs synchronization between the verified virtual object and a real object, in response to a control request for the verified virtual object; and creates a sub-virtual object corresponding to a detected target object in the virtual space when the synchronized real object detects the target object.

Abstract: A mount base for a rearview mirror includes: a base body including a first material; and an insert embedded in the base body and including a second material. The base body has a first surface and a second surface opposing the first surface, the insert has a first surface and a second surface opposing the first surface, the first material is softer than the second material, and the second material has higher stiffness than the first material.

Abstract: A mount base for a rearview mirror includes: a base body including a first material; and an insert embedded in the base body and including a second material. The base body has a first surface and a second surface opposing the first surface, the insert has a first surface and a second surface opposing the first surface, the first material is softer than the second material, and the second material has higher stiffness than the first material.

Abstract: Disclosed is a glass fiber composite material composition having further improved compatibility between glass fibers and polypropylene and thus maximized interfacial adhesion between the resin and the glass fibers in a glass fiber composite material. The present invention provides a glass fiber composite material composition comprising: (A) 60-93% by weight of polypropylene; (B) 1-30% by weight of glass fiber sized with a silane-based compound; and (C) 1-10% by weight of a polypropylene resin modified with maleic anhydride and a methacryloxysilane-based compound.

Abstract: The present invention relates to a novel protein transduction domain (PTD), which is a peptide having an amino acid sequence represented by SEQ ID NO: 1, and a use thereof. When the peptide represented by SEQ ID NO: 1 of the present invention is used as a PTD, biological molecules (target materials) such as proteins, peptides, DNA and the like can be easily introduced into cells in a high yield.

Abstract: Disclosed is a glass fiber composite material composition having further improved compatibility between glass fibers and polypropylene and thus maximized interfacial adhesion between the resin and the glass fibers in a glass fiber composite material. The present invention provides a glass fiber composite material composition comprising: (A) 60-93% by weight of polypropylene; (B) 1-30% by weight of glass fiber sized with a silane-based compound; and (C) 1-10% by weight of a polypropylene resin modified with maleic anhydride and a methacryloxysilane-based compound.

Abstract: A host controller that controls a storage device includes an encryption unit that is selectively configured in response to file encryption information and disk encryption information to encrypt data. The encryption unit encrypts the data using a file encryption operation based on the file encryption information and/or a disk encryption operation based on the disk encryption information.

Abstract: Carbohydrate functionalized catanionic vesicles that include a glycoconjugate and/or peptidoconjugate for vaccination or drug delivery, methods for forming these, and methods of using these.

Abstract: Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal.

Abstract: A host controller that controls a storage device includes an encryption unit that is selectively configured in response to file encryption information and disk encryption information to encrypt data. The encryption unit encrypts the data using a file encryption operation based on the file encryption information and/or a disk encryption operation based on the disk encryption information.

Abstract: There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a second insulating layer formed beneath the first insulating layer; a capacitor embedded in the first insulating layer and including a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; circuit layers formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layers or between the circuit layers formed on the first insulating layer and the second insulating layer to electrically connect thererbetween, wherein an upper surface of the first electrode is formed to be exposed from the first insulating layer.

Abstract: A package substrate, a package, a package on package, and a manufacturing method of a package substrate. A package substrate according to one exemplary embodiment includes: an insulating layer; a circuit layer formed on the insulating layer; and a capacitor including a lower electrode, an upper electrode, and a dielectric layer formed between the lower electrode and the upper electrode, the lower electrode and the dielectric layer being buried in the insulating layer and the upper electrode being formed on an upper portion of the insulating layer.