Abstract: A display device includes a substrate having a light emitting area and a non-light emitting area; a first anode electrode on the light emitting area of the substrate; a pixel defining layer on the non-light emitting area of the substrate and defining a first opening; an organic separator layer on the pixel defining layer and defining a second opening; a first light emitting layer on the first anode electrode; a common electron layer on the first light emitting layer and the organic separator layer; and a common electrode on the common electron layer, wherein the organic separator layer does not overlap the light emitting area, and overlaps the non-light emitting area to be in contact with the pixel defining layer, the first light emitting layer, and the common electron layer.

Abstract: A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.