Patents by Inventor Ju-Hong Lin

Ju-Hong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation system with a spray cooling device
    Publication number: 20110277491
    Abstract: A heat dissipation system includes a cooling device, a condenser, a vapor conveying duct and a cooling liquid conveying duct. The cooling device includes a housing, and an orifice plate dividing an inner space of the housing into a liquid supply chamber and an evaporation chamber proximate to the heat source, and formed with multiple micro orifices each having a diameter ranging from 5 to 1000 micrometers. The condenser includes a fluid inlet, a condensing chamber and a fluid outlet. The vapor conveying duct connects a vapor outlet of the housing and the fluid inlet of the condenser. The cooling liquid conveying duct connects a cooling liquid inlet of the housing and a fluid outlet of the condenser.
    Type: Application
    Filed: February 3, 2011
    Publication date: November 17, 2011
    Applicant: MicroBase Technology Group
    Inventors: Ching-Ping Wu, Kai-An Cheng, Chun-Hsien Wu, Ju-Hong Lin, Chia-Chen Liao, Hsien Meng, Hsien-Chun Meng