Patents by Inventor Ju Hoon KIM

Ju Hoon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250062929
    Abstract: A method for performing sidelink groupcast transmission by a transmission terminal includes the steps of: classifying reception terminals belonging to a subject group into two or more subgroups; allocating different groupcast feedback schemes to the two or more subgroups; performing groupcast transmission to the reception terminals; and receiving feedback information from terminals belonging to at least one subgroup among the two or more subgroups according to the different groupcast feedback schemes.
    Type: Application
    Filed: November 5, 2024
    Publication date: February 20, 2025
    Inventors: Jung Hoon LEE, Ju Ho PARK, Jun Hwan LEE, Il Gyu KIM, Jun Hyeong KIM, Go San NOH, Hee Sang CHUNG
  • Patent number: 12230661
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: April 12, 2024
    Date of Patent: February 18, 2025
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20250051093
    Abstract: Provided is a secondary battery reel storage rack to which a secondary battery reel is loaded for storage, the secondary battery reel storage rack including: a loading column perpendicular to the ground; a cantilever protruding parallel to the ground from one side surface of the loading column to support the loaded secondary battery reel; and a cover provided below the cantilever.
    Type: Application
    Filed: July 30, 2024
    Publication date: February 13, 2025
    Inventors: Jae Hoon JEONG, Yeon Ho PARK, Ju Yeon KIM
  • Publication number: 20250040140
    Abstract: A semiconductor memory device comprises a cell structure and a peripheral circuit structure electrically connected to the cell structure. The peripheral circuit structure comprises an active region, a first gate structure comprising a first gate insulating layer intersecting the active region and in contact with the active region, a second gate structure comprising a second gate insulating layer spaced apart from the first gate structure, and in contact with the active region, and a source/drain region between the first gate structure and the second gate structure. A thickness of the first gate insulating layer is less than a thickness of the second gate insulating layer. The source/drain region comprises a first region adjacent to the first gate structure and a second region adjacent to the second gate structure. A depth of the first region is equal to a depth of the second region.
    Type: Application
    Filed: March 13, 2024
    Publication date: January 30, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ju Seong MIN, Jun Gyeom KIM, Hyun Min KIM, Kang-Oh YUN, Taek Kyu YOON, Dong Jin LEE, Jae Duk LEE, Jee Hoon HAN
  • Publication number: 20250022784
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Publication number: 20240011097
    Abstract: The present invention relates to a composition for diagnosing or predicting a metabolic syndrome and a composition for predicting a group at high risk of expression of blood ceramide and to a single nucleotide polymorphism (SNP), derived through a genome wide association study (GWAS), capable of predicting metabolic syndrome and a group at high risk of expression of blood ceramide, which is a risk factor for metabolic syndrome. When used, a SNP marker derived by the present invention makes it possible to diagnose or predict metabolic syndrome and to predict a group at high risk of expression of blood ceramide, whereby patients suffering from the metabolic syndrome caused by a high expression of blood ceramide can be effectively diagnosed and managed. On the basis of these effects, the present invention can find wide applications in the pharmaceutical industry, etc.
    Type: Application
    Filed: September 16, 2021
    Publication date: January 11, 2024
    Inventors: Sang Hoo LEE, Ye Jin KIM, Ju Hoon KIM, Jeong Hoon HONG, Yi Seul KIM, Sae Yun BAIK, Kyoung Ryul LEE
  • Patent number: 10852068
    Abstract: A heat exchanger for a vehicle includes a heat exchange unit in which a plurality of plates are layered to alternately form a first flow channel and a second flow channel therein and heat exchange unit having one surface fixedly mounted in an expansion valve. First and second inflow holes are formed separately at both surfaces of the heat exchange unit and connected to the first flow channel and the second flow channel, respectively. First and second exhaust holes are formed separately in a diagonal direction of the first and second inflow holes at both surfaces of the heat exchange unit and connected to the first flow channel and the second flow channel, respectively. A noise reducer is integrally connected to the heat exchange unit at another surface of the heat exchange unit and reduces noise and vibration occurring when an operation fluid that is injected through the second inflow hole moves.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: December 1, 2020
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, HANON SYSTEMS
    Inventors: Jae Yeon Kim, Ju Hoon Kim, Hyun Keun Shin
  • Publication number: 20190078843
    Abstract: A heat exchanger for a vehicle includes a heat exchange unit in which a plurality of plates are layered to alternately form a first flow channel and a second flow channel therein and heat exchange unit having one surface fixedly mounted in an expansion valve. First and second inflow holes are formed separately at both surfaces of the heat exchange unit and connected to the first flow channel and the second flow channel, respectively. First and second exhaust holes are formed separately in a diagonal direction of the first and second inflow holes at both surfaces of the heat exchange unit and connected to the first flow channel and the second flow channel, respectively. A noise reducer is integrally connected to the heat exchange unit at another surface of the heat exchange unit and reduces noise and vibration occurring when an operation fluid that is injected through the second inflow hole moves.
    Type: Application
    Filed: November 7, 2018
    Publication date: March 14, 2019
    Inventors: Jae Yeon KIM, Ju Hoon KIM, Hyun Keun SHIN
  • Patent number: 10151541
    Abstract: A heat exchanger for a vehicle includes a heat exchange unit in which a plurality of plates are layered to alternately form a first flow channel and a second flow channel therein and heat exchange unit having one surface fixedly mounted in an expansion valve. First and second inflow holes are formed separately at both surfaces of the heat exchange unit and connected to the first flow channel and the second flow channel, respectively. First and second exhaust holes are formed separately in a diagonal direction of the first and second inflow holes at both surfaces of the heat exchange unit and connected to the first flow channel and the second flow channel, respectively. A noise reducer is integrally connected to the heat exchange unit at another surface of the heat exchange unit and reduces noise and vibration occurring when an operation fluid that is injected through the second inflow hole moves.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: December 11, 2018
    Assignees: HYUNDAI MOTOR COMPANY, HALLA VISTEON CLIMATE CONTROL CORP.
    Inventors: Jae Yeon Kim, Ju Hoon Kim, Hyun Keun Shin
  • Publication number: 20160161192
    Abstract: A heat exchanger for a vehicle includes a heat exchange unit in which a plurality of plates are layered to alternately form a first flow channel and a second flow channel therein and heat exchange unit having one surface fixedly mounted in an expansion valve. First and second inflow holes are formed separately at both surfaces of the heat exchange unit and connected to the first flow channel and the second flow channel, respectively. First and second exhaust holes are formed separately in a diagonal direction of the first and second inflow holes at both surfaces of the heat exchange unit and connected to the first flow channel and the second flow channel, respectively. A noise reducer is integrally connected to the heat exchange unit at another surface of the heat exchange unit and reduces noise and vibration occurring when an operation fluid that is injected through the second inflow hole moves.
    Type: Application
    Filed: June 11, 2015
    Publication date: June 9, 2016
    Inventors: Jae Yeon KIM, Ju Hoon KIM, Hyun Keun SHIN