Patents by Inventor Ju-Hoon Yoon

Ju-Hoon Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210020679
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Application
    Filed: June 22, 2020
    Publication date: January 21, 2021
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20200203331
    Abstract: Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.
    Type: Application
    Filed: August 20, 2019
    Publication date: June 25, 2020
    Inventors: Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee
  • Patent number: 10692918
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: June 23, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20190393258
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Application
    Filed: May 28, 2019
    Publication date: December 26, 2019
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Patent number: 10388643
    Abstract: Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: August 20, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee
  • Patent number: 10304890
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: May 28, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20190057919
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 21, 2019
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Publication number: 20190043793
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: October 1, 2018
    Publication date: February 7, 2019
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 10177117
    Abstract: In one embodiment, a method for fabricating a semiconductor package includes providing a multi-layer molded conductive structure. The multi-layer molded conductive structure includes a first conductive structure disposed on a surface of a carrier and a first encapsulant covering at least portions of the first conductive structure while other portions are exposed in the first encapsulant. A second conductive structure is disposed on the first encapsulant and electrically connected to the first conductive structure. A second encapsulant covers a first portion of the second conductive structure while a second portion of the second conductive structure is exposed to the outside, and a third portion of the second conductive structure is exposed in a receiving space disposed in the second encapsulant. The method includes electrically connecting a semiconductor die to the second conductive structure and in some embodiments removing the carrier.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: January 8, 2019
    Assignee: Amkor Technology Inc.
    Inventors: Won Bae Bang, Ju Hoon Yoon, Ji Young Chung, Byong Jin Kim, Gi Jeong Kim, Choon Heung Lee
  • Patent number: 10090230
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: October 2, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 10062626
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: August 28, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Publication number: 20180083061
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Application
    Filed: November 28, 2017
    Publication date: March 22, 2018
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20180033708
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Application
    Filed: July 26, 2016
    Publication date: February 1, 2018
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Patent number: 9831282
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: November 28, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20170271315
    Abstract: Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.
    Type: Application
    Filed: April 18, 2017
    Publication date: September 21, 2017
    Inventors: Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee
  • Publication number: 20170200686
    Abstract: Disclosed are a semiconductor device and a manufacturing method thereof, which can easily increase the number of input/output pads by increasing regions for forming the input/output pads such that a redistribution layer is formed to extend up to an encapsulant.
    Type: Application
    Filed: May 6, 2016
    Publication date: July 13, 2017
    Inventors: Sung Geun Kang, Ju Hoon Yoon, In Rak Kim
  • Patent number: 9633966
    Abstract: A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor package in which an upper interposer and/or package are electrically and mechanically coupled to a lower package utilizing an adhesive member comprising conductive particles.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: April 25, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Dong Joo Park, Jae Sung Park, Jin Seong Kim, Ju Hoon Yoon
  • Patent number: 9627348
    Abstract: Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: April 18, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon, Chan Ha Hwang, Yang Gyoo Jung
  • Patent number: 9627368
    Abstract: Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: April 18, 2017
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee
  • Publication number: 20160365379
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Application
    Filed: August 26, 2016
    Publication date: December 15, 2016
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon