Abstract: The present invention relates to a 6-(isooxazolidin-2-yl)-N-phenylpyrimidin-4-amine derivative, and a pharmaceutical composition for preventing or treating cancer comprising the compound as an effective component. The compound exhibits high inhibitory activity against an epidermal growth factor receptor (EGFR) variant, or wild-type or variants of one or more of ERBB2 and ERBB4, and thus may be usefully used in the treatment of cancers in which same are expressed. In particular, the compound exhibits excellent inhibitory activity on proliferation of lung cancer cell lines, and thus can be usefully used in the treatment of lung cancer.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens sequentially arranged in numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system and each having a refractive power, wherein an entire field of view of the optical imaging system is 50° or greater, and TTL/f<1.0, where TTL is a distance from an object-side surface of the first lens to the imaging plane, and f is an overall focal length of the optical imaging system.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A display device includes a display portion including a first surface, from which light is emitted in a first direction, and a second surface opposite to the first surface, a first optical portion disposed on the first surface, and a second optical portion disposed on the first surface to be spaced apart from the first optical portion in a second direction crossing the first direction. Each of the first and second optical portions includes a multi-channel lens through which the light from the first surface passes, a first infrared light source, a first camera, and a first lens frame coupled to the multi-channel lens in the first direction to support at least a portion of the multi-channel lens. The first lens frame may include a first recess structure in which the first infrared light source is disposed and a second recess structure in which the first camera is disposed.

Abstract: An optical imaging system includes a first lens having a convex image-side surface, a second lens having a concave object-side surface, a third lens, a fourth lens, and a fifth lens disposed sequentially from an object side. The optical imaging system satisfies 4.8<f/IMG_HT<9.0, where f is a focal length of the optical imaging system, and IMG_HT is half a diagonal length of an imaging surface of an image sensor.

Abstract: Disclosed herein is a multi-layered light diffusion plate, in which the multi-layered light diffusion plate is manufactured by coextruding a transparent layer comprising an amorphous transparent thermoplastic resin and a light diffusion layer comprising an amorphous transparent thermoplastic resin and transparent particles, so that the manufacturing process thereof is simple and efficient, and which has excellent light transmissivity and light diffusivity, high brightness, and high brightness uniformity, thereby improving viewing angle characteristics, and to a liquid crystal display device comprising the same.

Abstract: Disclosed herein is a multi-layered light diffusion plate, in which the multi-layered light diffusion plate is manufactured by coextruding a transparent layer comprising an amorphous transparent thermoplastic resin and a light diffusion layer comprising an amorphous transparent thermoplastic resin and transparent particles, so that the manufacturing process thereof is simple and efficient, and which has excellent light transmissivity and light diffusivity, high brightness, and high brightness uniformity, thereby improving viewing angle characteristics, and to a liquid crystal display device comprising the same.

Abstract: Disclosed herein is a multi-layerd light diffusion plate, in which the multi-layered light diffusion plate is manufactured by coextruding a transparent layer comprising an amorphous transparent thermoplastic resin and a light diffusion layer comprising an amorphous transparent thermoplastic resin and transparent particles, so that the manufacturing process thereof is simple and efficient, and which has excellent light transmissivity and light diffusivity, high brightness, and high brightness uniformity, thereby improving viewing angle characteristics, and to a liquid crystal display device comprising the same.

Abstract: The present invention relates to a heat resistant light diffusion blend composition, and more precisely, a heat resistant light diffusion blend composition which is composed of a substrate resin prepared by blending styrene-maleic anhydride copolymer resin and polymethylmethacrylate resin and a light-diffusing agent composed of acrylic organic particles with a mean diameter of 1˜20 ?m alone or together with silicon organic particles with a mean diameter of 0.5˜20 ?m. Therefore, the heat resistant light diffusion blend composition of the present invention not only has high diffusivity and brightness but also excellent heat resistance, dimensional stability and mechanical properties with a low water absorption rate, so that this composition can be effectively used as a light diffusion plate and also be applied to a backlight for LCDs, lighting apparatus, signboards or glass showcases.

Abstract: A semiconductor package includes a semiconductor package substrate having a frame type insulator which has a penetrating portion in a center portion of the substrate and a plurality of lead bars exposed to upper and lower surfaces of the insulator, a semiconductor chip on the semicondcutor package substrate, an upper surface of the semiconductor chip being attached to the lead bars, a plurality of pads on a center portion of an upper surface of the semiconductor chip, a plurality of wires respectively connecting the pads with an upper surface of the lead bars, and an upper cover protecting the wires, the pads and an upper surface of the semiconductor chip.

Abstract: A ball grid array (BGA) semiconductor package includes a paddle, a semiconductor chip on the paddle, a plurality of first leads around a periphery of the paddle, a plurality of second leads attached to a lower surface of each of the first leads, a plurality of conductive wires electrically connecting the semiconductor chip and the first leads, a molding unit sealing the paddle, the semiconductor chip, the first leads, the second leads, and the conductive wires, except for a lower portion of the second leads, and a plurality of solder balls attached to the lower portion of the second leads.

Abstract: A semiconductor package includes a semiconductor package substrate having a frame type insulator which has a penetrating portion in a center portion of the substrate and a plurality of lead bars exposed to upper and lower surfaces of the insulator, a semiconductor chip on the semicondcutor package substrate, an upper surface of the semiconductor chip being attached to the lead bars, a plurality of pads on a center portion of an upper surface of the semiconductor chip, a plurality of wires respectively connecting the pads with an upper surface of the lead bars, and an upper cover protecting the wires, the pads and an upper surface of the semiconductor chip.

Abstract: An improved package is thinner with increased memory capacity and improved heat emission effect. The package includes a plurality of leads, where each lead comprises a first connection lead and a second connection lead with upper and lower surfaces. An integrated chip, such as a semiconductor chip, is attached to a portion of the upper surface of the first connection lead. The chip and leads are molded such that the lower surface of the first connection leads and upper surface of the second connection leads are exposed.