Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A battery module including at least one battery cell; a module case in which the at least one battery cell is accommodated, and including a lower plate and a side plate forming an internal space; and a thermally conductive coating layer formed on an internal surface of the lower plate or an internal surface of the lower plate and an internal surface of the side plate, and having a thickness of 70 ?m to 130 ?m, wherein the thermally conductive coating layer includes a polymeric binder resin and an inorganic filler, is disclosed.

Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.

Abstract: Disclosed is a wireless power transmission system including a microstrip patch antenna. More particularly, a microstrip patch antenna according to an embodiment of the present disclosure includes a substrate, a patch disposed on the substrate, and a plurality of protrusions with a conical shape disposed on the patch.

Abstract: Disclosed is a wireless power transmission system including a microstrip patch antenna. More particularly, a microstrip patch antenna according to an embodiment of the present disclosure includes a substrate, a patch disposed on the substrate, and a plurality of protrusions with a conical shape disposed on the patch.

Abstract: A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit, where at least one of a trench and a via is defined under the graphene interconnection unit.

Abstract: A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit, where at least one of a trench and a via is defined under the graphene interconnection unit.

Abstract: A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit including graphene and which connects the first and second electronic devices, where an interlayer distance of the graphene is greater than or equal to about 0.34 nanometer.