Patents by Inventor Ju-hwan LIM

Ju-hwan LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12161999
    Abstract: In the present disclosure, a dehydrogenation catalyst in which cobalt in the form of single atom is supported on an inorganic oxide (specifically, silica) support in which an alkali metal in the form of single atom is fixed by alkali metal pretreatment and a method for producing the same, and a method for producing olefins by dehydrogenating corresponding paraffins, specifically light paraffins in the presence of the dehydrogenation catalyst are described.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: December 10, 2024
    Assignees: SK Innovation Co., Ltd., SK Geo Centric Co., Ltd.
    Inventors: Ho Won Lee, Je Mi Lim, Hee Soo Kim, Ju Hwan Im, Dae Hyun Choo, Ka Young Kim, Jae Suk Choi
  • Patent number: 12153214
    Abstract: An optical device for realizing augmented reality comprises a lens comprising a first surface and side surfaces, a display device disposed on a first side surface among the side surfaces of the lens and displaying a first image in a first area and a second image in a second area, a first reflector disposed in the lens and reflecting the first image incident on the first side surface of the lens to the first surface, a second reflector disposed in the lens and reflecting the second image incident on the first side surface of the lens to the first surface, a first condenser disposed between the lens and the first area of the display device and focusing the first image on the first reflector, and a second condenser disposed between the lens and the second area of the display device and focusing the second image on the second reflector.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: November 26, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyun Sup Lee, Yong Seok Kim, Jeong Woo Park, Dong Chul Shin, Gye Hwan Lim, Ju Hwa Ha
  • Patent number: 12126043
    Abstract: A method for manufacturing a lower case of a battery module includes an extrusion molding operation in which a metal material is extruded to mold a cooling plate member and a sidewall member of a battery module; a forging operation in which an internal surface of the cooling plate member is pressed with a punch, having an edge of a lower end provided vertically to form an accommodation groove; and a forming operation in which an embossed piece, protruding to an external surface of the cooling plate member by forming the accommodation groove, is removed.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: October 22, 2024
    Assignee: SK On Co., Ltd.
    Inventors: Ji Hoon Lim, Myeong Hwan Ma, Ju Yong Park, Ji Hoon Park
  • Publication number: 20240326027
    Abstract: In the present disclosure, a heterogeneous nickel-based oligomerization catalyst in which nickel in the form of single atom is loaded on an Al-mesoporous silicate support by ion exchange and a method for producing the same, and a method for oligomerizing light olefins, specifically C4 olefins using the catalyst are described.
    Type: Application
    Filed: June 10, 2024
    Publication date: October 3, 2024
    Inventors: Jae Suk Choi, Ka Young Kim, Hee Soo Kim, Ju Hwan Im, Dae Hyun Choo, Ho Won Lee, Je Mi Lim
  • Patent number: 12103392
    Abstract: Disclosed herein a user interface device includes a levitating knob configured to detect an input by a user's manipulation; a knob holder configured to be held when the levitating knob does not levitate; a lifting driver provided below the knob holder so that the levitating knob rises from the knob holder and levitates; and an anti-separation section disposed to be spaced apart from the levitating knob by a predetermined distance so that the raised levitating knob does not deviate from an upper side of the knob holder; and wherein the levitating knob is provided with a first magnet, the lift driver is provided with a second magnet arranged to face the first magnet, the second magnet having the same pole as the first magnet on facing surface thereagainst, the lift driver is configured to levitate or hold the levitating knob by driving up or down the second magnet.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: October 1, 2024
    Assignee: SEOYONE E-HWA CO., LTD.
    Inventors: Ju Hwan Cho, Dong-Cheol Lim
  • Patent number: 12062484
    Abstract: A coil component includes a body having one surface, and one end surface and the other end surface connected to the one surface and opposing each other; a coil portion including lead-out patterns within the body; slit portions respectively disposed in an edge portion between the one end surface and the one surface of the body and an edge portion between the other end surface and the one surface of the body to expose the lead-out patterns; external electrodes disposed to be spaced apart from each other on the one surface and respectively extending to the slit portions to be connected to the lead-out patterns; and surface insulating layers, respectively disposed on the one end surface and the other end surface of the body. The surface insulating layers include a first insulating thin film including silicon dioxide (SiO2), and a second insulating thin film including aluminum oxide (Al2O3).
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: August 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Seung Mo Lim, Tae Jun Choi, Byung Soo Kang, Boum Seock Kim
  • Publication number: 20240258182
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Application
    Filed: April 12, 2024
    Publication date: August 1, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 12042787
    Abstract: In the present disclosure, a heterogeneous nickel-based oligomerization catalyst in which nickel in the form of single atom is loaded on an Al-mesoporous silicate support by ion exchange and a method for producing the same, and a method for oligomerizing light olefins, specifically C4 olefins using the catalyst are described.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: July 23, 2024
    Assignees: SK Innovation Co., Ltd., SK Geo Centric Co., Ltd.
    Inventors: Jae Suk Choi, Ka Young Kim, Hee Soo Kim, Ju Hwan Im, Dae Hyun Choo, Ho Won Lee, Je Mi Lim
  • Patent number: 10855114
    Abstract: Disclosed is a wireless power transmission system including a microstrip patch antenna. More particularly, a microstrip patch antenna according to an embodiment of the present disclosure includes a substrate, a patch disposed on the substrate, and a plurality of protrusions with a conical shape disposed on the patch.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: December 1, 2020
    Assignee: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Bom Son Lee, Sang Woong Yoon, Ju Hwan Lim, Gun Young Kim
  • Publication number: 20190199138
    Abstract: Disclosed is a wireless power transmission system including a microstrip patch antenna. More particularly, a microstrip patch antenna according to an embodiment of the present disclosure includes a substrate, a patch disposed on the substrate, and a plurality of protrusions with a conical shape disposed on the patch.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Applicant: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Bom Son LEE, Sang Woong YOON, Ju Hwan LIM, Gun Young KIM
  • Patent number: 9576916
    Abstract: A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit, where at least one of a trench and a via is defined under the graphene interconnection unit.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: February 21, 2017
    Assignees: SAMSUNG ELECTRONICS CO., LTD., INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Hyeon-jin Shin, Jae-young Choi, Seong-chan Jun, Whan-kyun Kim, Hyung-seo Yoon, Ju-yeong Oh, Ju-hwan Lim
  • Publication number: 20130176698
    Abstract: A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit including graphene and which connects the first and second electronic devices, where an interlayer distance of the graphene is greater than or equal to about 0.34 nanometer.
    Type: Application
    Filed: July 6, 2012
    Publication date: July 11, 2013
    Applicants: Industry-Academic Cooperation Foundation, Yonsei University, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyeon-jin SHIN, Jae-young CHOI, Seong-chan JUN, Whan-kyun KIM, Hyung-seo YOON, Ju-yeong OH, Ju-hwan LIM
  • Publication number: 20130175676
    Abstract: A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit, where at least one of a trench and a via is defined under the graphene interconnection unit.
    Type: Application
    Filed: July 6, 2012
    Publication date: July 11, 2013
    Applicants: Industry-Academic Cooperation Foundation, Yonsei University, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyeon-jin SHIN, Jae-young CHOI, Seong-chan JUN, Whan-kyun KIM, Hyung-seo YOON, Ju-yeong OH, Ju-hwan LIM