Patents by Inventor Ju-Hwan Yang

Ju-Hwan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180199420
    Abstract: A common mode filter includes a body including a filter portion and an electrostatic protection portion, first to fourth external electrodes disposed on an external surface of the body, a ground electrode disposed on the external surface of the body, a first coil included in the filter portion and electrically connected to the first and second external electrodes, and a second coil included in the filter portion and electrically connected to the third and fourth external electrodes. The electrostatic protection portion includes discharge electrodes electrically connected to at least one of the first to fourth external electrodes and the ground electrode, a discharge part including conductive particles, a first organic-inorganic composite insulating layer disposed on the discharge electrodes and the discharge part, a magnetic cover layer disposed on the first organic-inorganic composite insulating layer, and a first inorganic insulating layer.
    Type: Application
    Filed: October 24, 2017
    Publication date: July 12, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jik Lee, Sang Moon Lee, Hye Hun Park, Ju Hwan Yang, Jung Wook Seo
  • Publication number: 20180175591
    Abstract: A composite electronic component includes an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes first and second discharge electrodes having a gap formed therebetween, a discharge layer disposed between the first and second discharge electrodes and in the gap, and a multilayer insulating layer covering the discharge layer and including at least two insulating layers having different breakdown voltage (BDV) values.
    Type: Application
    Filed: October 9, 2017
    Publication date: June 21, 2018
    Inventors: Hye Hun PARK, Kwang Jik LEE, Ju Hwan YANG, Jung Wook SEO, Sang Moon LEE
  • Patent number: 9986640
    Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: May 29, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Jin Hyuck Yang, Jong Yun Lee, Won Chul Sim
  • Patent number: 9911530
    Abstract: A coil component includes: a coil part including a first coil layer and a second coil layer disposed above the first coil layer, wherein the first coil layer includes a first insulating layer having a first opening pattern and a first conductive layer disposed in the first opening pattern, and the second coil layer includes a second insulating layer having a second opening pattern, a seed layer covering inner side surfaces and a lower surface of the second opening pattern, and a second conductive layer disposed in the second opening pattern.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: March 6, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Seok Il Hong, Doo Young Kim, Jae Yeol Choi
  • Publication number: 20180061552
    Abstract: A thin film type coil component that includes a body having a coil embedded therein and including a composite of magnetic powder particles and a polymer, and external electrodes disposed on at least portions of external surfaces of the body. The body includes an upper body portion disposed on an upper surface of the coil, a lower body portion disposed on a lower surface of the coil, and a central body portion disposed between the upper body portion and the lower body portion and including a central portion of the coil. The upper body portion and the lower body portion include a stacked structure of a plurality of magnetic sheets, each magnetic sheet including the composite of the magnetic powder particles and the polymer.
    Type: Application
    Filed: March 30, 2017
    Publication date: March 1, 2018
    Inventors: Ju Hwan YANG, Young Seuck YOO, Seok Il HONG
  • Publication number: 20180047493
    Abstract: A coil component includes a body including coil patterns and a plurality of trenches; and external electrodes electrically connected to the coil patterns. The plurality of trenches include a magnetic material, and at least one edge of a trench disposed outside of an outermost coil pattern among the coil patterns has a same shape as an outside boundary portion of the outermost coil pattern adjacent thereto.
    Type: Application
    Filed: March 23, 2017
    Publication date: February 15, 2018
    Inventors: Ju Hwan YANG, Seok Il HONG, Young Seuck YOO
  • Publication number: 20180033535
    Abstract: A method of manufacturing a coil component includes preparing a coil unit including a coil surrounded by an insulating film. The coil unit further has a through hole in a center thereof and has a first surface and a second surface opposing each other. A first magnetic sheet and a second magnetic sheet containing magnetic particles are prepared, and the first magnetic sheet is pressed onto the first surface of the coil unit to cause the first magnetic sheet to fill the through hole therewith. The second magnetic sheet is pressed onto the second surface of the coil unit. The second magnetic sheet may be pressed onto a portion of the first magnetic sheet that extends through the through hole and outwardly from the second surface of the coil unit.
    Type: Application
    Filed: April 14, 2017
    Publication date: February 1, 2018
    Inventors: Seok Il HONG, Ju Hwan YANG, Young Seuck YOO, Won Chul SIM
  • Publication number: 20180033541
    Abstract: A coil component includes a coil part having a through hole in a center, including a coil covered by an insulating film, and having a first surface and a second surface opposing each other, a core disposed in the through hole and including a nonmagnetic layer, and cover portions disposed on the first surface and the second surface of the coil part.
    Type: Application
    Filed: April 12, 2017
    Publication date: February 1, 2018
    Inventors: Seok Il HONG, Ju Hwan YANG, Young Seuck YOO, Won Chul SIM
  • Publication number: 20180033550
    Abstract: A coil component includes an insulating layer and a coil pattern provided inside the insulating layer. A lower surface and a side surface of the coil pattern form an acute angle, in a longitudinal cross section of the coil pattern. In particular, a side surface of the coil pattern includes a foot part located in a lower portion of the side surface and an upper part located above the foot part in the side surface, and an angle between the lower surface and the upper part of the side surface of the coil pattern is larger than the acute angle between the lower surface and the foot part of the side surface of the coil pattern. A method of manufacturing the coil component is also provided.
    Type: Application
    Filed: July 20, 2017
    Publication date: February 1, 2018
    Inventors: Seok Il HONG, Ju Hwan YANG, Young Seuck YOO
  • Publication number: 20170338792
    Abstract: A common mode filter includes: a body disposed on a substrate, wherein the body includes: a coil part including one or more coils and a through-hole formed in a central portion thereof; and a core part including a magnetic powder, disposed on the coil part, and filling the through-hole. A content of the magnetic powder in the core part has a gradient in a stacking direction. Impedance characteristics may be improved by reducing unfilled defect in the core part and securing permeability thereof at the same time.
    Type: Application
    Filed: January 19, 2017
    Publication date: November 23, 2017
    Inventors: Kwang Jik LEE, Ju Hwan YANG, Jung Wook SEO
  • Patent number: 9786428
    Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: October 10, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Hyuck Yang, Young Seuck Yoo, Sung Kwon Wi, Hye Won Bang, Geon Se Chang, Young Do Kweon, Ju Hwan Yang
  • Publication number: 20170140866
    Abstract: A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.
    Type: Application
    Filed: July 1, 2016
    Publication date: May 18, 2017
    Inventors: Seok Il HONG, Jae Yeol CHOI, Jong Bong LIM, Ju Hwan YANG
  • Publication number: 20170133145
    Abstract: A coil component includes a substrate and a coil part disposed on the substrate. The coil part includes an insulating layer having an opening, and one or more coil patterns disposed in the opening. The coil patterns include first seed layers disposed on a portion of a side surface and a portion of a bottom surface of an interior of the opening, a second seed layer disposed to cover the first seed layers, and a metal layer disposed on the second seed layer.
    Type: Application
    Filed: July 1, 2016
    Publication date: May 11, 2017
    Inventors: Seok Il HONG, Jae Yeol CHOI, Jong Bong LIM, Ju Hwan YANG
  • Patent number: 9633773
    Abstract: Disclosed herein are a thin film common mode filter and a method of manufacturing the same. The thin film common mode filter according to the exemplary embodiment of the present invention includes a magnetic substrate made of a magnetic ceramic material; and coil patterns formed on the magnetic substrate, wherein external electrodes connected with the coil patterns are sequentially stacked and insulating layers formed on and beneath the coil pattern are made of a composite of ferrite powder and thermosetting resin.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: April 25, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Min Cho, Won Chul Sim, Ho Jin Yun, Ju Hwan Yang, Young Seuck Yoo
  • Publication number: 20170062121
    Abstract: A coil component includes a substrate and a coil pattern disposed on the substrate. The coil pattern includes a vertical region having a side surface perpendicular with respect to the substrate and a tapered region connected to the vertical region and having a side surface inclined with respect to the substrate.
    Type: Application
    Filed: March 17, 2016
    Publication date: March 2, 2017
    Inventors: Ju Hwan YANG, Jong Bong LIM, Seok Il HONG, Jae Yeol CHOI, Hai Joon LEE
  • Publication number: 20170032882
    Abstract: A coil component includes: a coil part including a first coil layer and a second coil layer disposed above the first coil layer, wherein the first coil layer includes a first insulating layer having a first opening pattern and a first conductive layer disposed in the first opening pattern, and the second coil layer includes a second insulating layer having a second opening pattern, a seed layer covering inner side surfaces and a lower surface of the second opening pattern, and a second conductive layer disposed in the second opening pattern.
    Type: Application
    Filed: March 24, 2016
    Publication date: February 2, 2017
    Inventors: Ju Hwan YANG, Seok Il HONG, Doo Young KIM, Jae Yeol CHOI
  • Publication number: 20170004917
    Abstract: A thin film type coil component including coil patterns in a cross section shape having an undercut in lower portions thereof is provided. The coil patterns may reduce parasitic capacitance between the coil patterns, thereby minimizing electrical loss. The volume of the coil patterns may be increased, thereby improving inductance and resistance characteristics.
    Type: Application
    Filed: January 6, 2016
    Publication date: January 5, 2017
    Inventors: Ju Hwan YANG, Young Seuck YOO, Jae Yeol CHOI, Jong Bong LIM
  • Publication number: 20160293318
    Abstract: A coil component includes a core member and coil conductors. The core member has an insulation layer in which a cavity having a stepped profile is provided in a central portion thereof, and a composite magnetic layer filling the cavity. The coil conductors are provided in the insulation layer. The stepped profile of the cavity increases a filling area or volume of the composite magnetic layer, such that common mode impedance may be improved by an increase in inductance under the same magnetic permeability condition.
    Type: Application
    Filed: January 6, 2016
    Publication date: October 6, 2016
    Inventors: Ju Hwan Yang, Jong Bong Lim
  • Patent number: 9444250
    Abstract: Disclosed herein is a common mode filter, including: first and second coil layers electromagnetically coupled to each other; a pair of external terminals connected to ends of the first coil layer and a pair of external terminals connected to ends of the second coil layer; a first ESD prevention member connecting between the pair of external terminals carrying electric current with the first coil layer and a second ESD prevention member connecting between the pair of external terminals carrying electric current with the second coil layer; and a ground electrode connecting the first ESD prevention member to the second ESD prevention member, wherein the ground electrode has a stepped portion formed at the center.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: September 13, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Won Chul Sim, Kwang Mo Kim, Jin Hyuck Yang, Hye Won Bang, Sung Kwon Wi
  • Publication number: 20160217905
    Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.
    Type: Application
    Filed: October 29, 2015
    Publication date: July 28, 2016
    Inventors: Ju Hwan YANG, Jin Hyuck YANG, Jong Yun LEE, Won Chul SIM