Abstract: Disclosed are a backside illuminated image sensor and a method of manufacturing the same. More particularly, a backside illuminated image sensor and a method of manufacturing the backside illuminated image sensor include a light scattering portion in a substrate configured to converge a path of incident light to a photoelectric conversion structure, thereby preventing cross-talk between adjacent pixels and increasing light sensitivity.

Abstract: Disclosed are a frontside illuminated image sensor and a method of manufacturing the same. More particularly, a frontside illuminated image sensor and a method of manufacturing the frontside illuminated image sensor include a light scattering portion in a substrate, configured to increase a path of incident light, thereby preventing cross-talk between adjacent pixels and increasing light sensitivity.

Abstract: Disclosed are a backside illuminated image sensor and a method of manufacturing the same. More particularly, a backside illuminated image sensor and a method of manufacturing the backside illuminated image sensor include a plurality of sequential layers have different refractive indexes to extend a path of incident light passing through a lens, thereby increasing sensitivity.

Abstract: The present invention discloses a back contact solar cell. The back contact solar cell includes a semiconductor substrate having a front surface and a rear surface; a first conductive type semiconductor region having a first conductive type and a second conductive type semiconductor region having a second conductive type at an interval on the rear surface of the semiconductor substrate. Furthermore, the rear surface of the semiconductor substrate has a texturing structure at the interval between the first conductive type semiconductor region and the second conductive type semiconductor region.

Abstract: The present invention discloses a back contact solar cell comprising: a first conductive type semiconductor substrate having a front surface and a rear surface of a texturing structure; an oxide layer formed on the front surface of the substrate; at least one first conductive type semiconductor region and second conductive type semiconductor region alternatively formed at predetermined intervals on the rear surface of the substrate; an oxide layer formed on the remaining rear surface of the substrate except for the first conductive type semiconductor region and the second conductive type semiconductor region; and electrodes formed on each of the first conductive type semiconductor region and the second conductive type semiconductor region.

Abstract: A mobile terminal and manufacture of same are provided. The mobile terminal includes: an antenna; a first case at which the antenna is disposed; a second case coupled to the first case; a main PCB disposed at one side of the second case; and a sub-PCB disposed at an opposite side of the second case, the sub-PCB being connected to the main PCB through a cable, wherein the sub-PCB is electrically coupled with the antenna when the first case and the second case are coupled together.

Abstract: A mobile terminal and manufacture of same are provided. The mobile terminal includes: an antenna; a first case at which the antenna is disposed; a second case coupled to the first case; a main PCB disposed at one side of the second case; and a sub-PCB disposed at an opposite side of the second case, the sub-PCB being connected to the main PCB through a cable, wherein the sub-PCB is electrically coupled with the antenna when the first case and the second case are coupled together.

Abstract: A mobile terminal and manufacture of same are provided. The mobile terminal includes: an antenna; a first case at which the antenna is disposed; a second case coupled to the first case; a main PCB disposed at one side of the second case; and a sub-PCB disposed at an opposite side of the second case, the sub-PCB being connected to the main PCB through a cable, wherein the sub-PCB is electrically coupled with the antenna when the first case and the second case are coupled together.

Abstract: A mobile terminal and manufacture of same are provided. The mobile terminal includes: an antenna; a first case at which the antenna is disposed; a second case coupled to the first case; a main PCB disposed at one side of the second case; and a sub-PCB disposed at an opposite side of the second case, the sub-PCB being connected to the main PCB through a cable, wherein the sub-PCB is electrically coupled with the antenna when the first case and the second case are coupled together.

Abstract: The present invention discloses a back contact solar cell. The back contact solar cell includes a semiconductor substrate having a front surface and a rear surface; a first conductive type semiconductor region having a first conductive type and a second conductive type semiconductor region having a second conductive type at an interval on the rear surface of the semiconductor substrate. Furthermore, the rear surface of the semiconductor substrate has a texturing structure at the interval between the first conductive type semiconductor region and the second conductive type semiconductor region.

Abstract: The present invention discloses a back contact solar cell. The back contact solar cell includes a semiconductor substrate having a front surface and a rear surface; and a first conductive type semiconductor region having a first conductive type and a second conductive type semiconductor region having a second conductive type, the first conductive type semiconductor region and the second conductive type semiconductor region being disposed with an interval on the rear surface of the semiconductor substrate. In addition, the rear surface of the semiconductor substrate has a texturing structure at the interval between the first conductive type semiconductor region and the second conductive type semiconductor region.

Abstract: A mobile terminal and manufacture of same are provided. The mobile terminal includes: an antenna; a first case at which the antenna is disposed; a second case coupled to the first case; a main PCB disposed at one side of the second case; and a sub-PCB disposed at an opposite side of the second case, the sub-PCB being connected to the main PCB through a cable, wherein the sub-PCB is electrically coupled with the antenna when the first case and the second case are coupled together.

Abstract: A mobile terminal and manufacture of same are provided. The mobile terminal includes: an antenna; a first case at which the antenna is disposed; a second case coupled to the first case; a main PCB disposed at one side of the second case; and a sub-PCB disposed at an opposite side of the second case, the sub-PCB being connected to the main PCB through a cable, wherein the sub-PCB is electrically coupled with the antenna when the first case and the second case are coupled together.

Abstract: Discussed is a fabrication method of a solar cell according to an embodiment of the invention, which includes forming an electrode material on a semiconductor substrate for the solar cell; and forming an electrode by heat treating the electrode material by laser irradiation, wherein the electrode material comprises at least one of an electrode paste, electrode ink and aerosol for the electrode.

Abstract: With the present invention, two wafers for a solar cell only whose light receiving surfaces are selectively etched can be simultaneously obtained by overlapping the two wafers and performing a single-sided etching or an asymmetric etching thereon. The present invention provides a method of etching a wafer comprising: performing a single-sided etching or an asymmetric etching on the wafer, wherein the performing the single-sided etching or the asymmetric etching comprises: overlapping two wafers whose one sides face each other; and etching the overlapped two wafers, and a solar cell including the etched wafers.

Abstract: An automatic liquid dispenser is disclosed wherein a liquid adjustor is disposed to prevent liquid from splashing outside of a receptacle, thereby saving the automatic liquid dispenser from being polluted with splashed liquid. A receptacle and level detector emits ultrasound to the receptacle and detects the ultrasound reflected from the receptacle to generate a signal. A controller receives the signal from the receptacle and level detector to control the liquid adjusting unit, and an identifying mark at the receptacle accommodator facilitates the correct arranging of the receptacle.

Abstract: Disclosed are a laser firing apparatus for a high efficiency solar cell including laser generating unit and a fabrication method thereof. The laser firing apparatus for a high efficiency solar cell includes at least one laser generating unit that irradiates a laser irradiation on to an electrode region formed on a semiconductor substrate for the solar cell and heat-treats the electrode region. In addition, the fabrication method of a solar cell includes forming an electrode material on a semiconductor substrate for the solar cell; and forming an electrode by heat treating the electrode material by laser irradiation.

Abstract: The present invention relates to a solar cell and a method for manufacturing the same. More specifically, the present invention provides a silicon solar cell capable of minimizing defects and recombination of electrons-holes by removing a damaged layer formed by a laser edge isolation process to isolate a silicon substrate and covering a protective layer on a surface thereof and a method for manufacturing the same.

Abstract: The present invention relates to a solar cell and a method for manufacturing the same. More specifically, the present invention provides a silicon solar cell capable of minimizing defects and recombination of electrons-holes by removing a damaged layer formed by a laser edge isolation process to isolate a silicon substrate and covering a protective layer on a surface thereof and a method for manufacturing the same.

Abstract: The present invention discloses a back contact solar cell comprising: a first conductive type semiconductor substrate having a front surface and a rear surface of a texturing structure; an oxide layer formed on the front surface of the substrate; at least one first conductive type semiconductor region and second conductive type semiconductor region alternatively formed at predetermined intervals on the rear surface of the substrate; an oxide layer formed on the remaining rear surface of the substrate except for the first conductive type semiconductor region and the second conductive type semiconductor region; and electrodes formed on each of the first conductive type semiconductor region and the second conductive type semiconductor region.