Patents by Inventor Ju Hyeon OH

Ju Hyeon OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device package and light source device
    Patent number: 11417804
    Abstract: The light emitting device package disclosed in the embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting devices disposed on the first and second frames. The first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, the first end portion includes a first protrusion protruding toward the second frame, and the second end portion includes a second protrusion protruding toward the first frame. The light emitting device includes first and second bonding portions disposed on the first and second protrusions. The body includes first and second reflective portions extending toward both sides of the first protrusion toward the first frame, and third and fourth reflective portions extending toward both sides of the second protrusion toward the second frame.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: August 16, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Young Shin Kim, Soon Yong Kang, Sung Min Kong, Ju Hyeon Oh
  • LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE DEVICE
    Publication number: 20210066552
    Abstract: The light emitting device package disclosed in the embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting devices disposed on the first and second frames. The first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, the first end portion includes a first protrusion protruding toward the second frame, and the second end portion includes a second protrusion protruding toward the first frame. The light emitting device includes first and second bonding portions disposed on the first and second protrusions. The body includes first and second reflective portions extending toward both sides of the first protrusion toward the first frame, and third and fourth reflective portions extending toward both sides of the second protrusion toward the second frame.
    Type: Application
    Filed: December 18, 2018
    Publication date: March 4, 2021
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Young Shin KIM, Soon Yong KANG, Sung Min KONG, Ju Hyeon OH
  • Light emitting device and light emitting device package
    Patent number: 10600945
    Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: March 24, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Man Lim, Ki Seok Kim, Young Shin Kim, June O Song, Ju Hyeon Oh, Chang Hyeong Lee, Tae Sung Lee, Se Yeon Jung, Byung Yeon Choi, Sung Min Hwang
  • LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20190019929
    Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.
    Type: Application
    Filed: July 13, 2018
    Publication date: January 17, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Chang Man LIM, Ki Seok KIM, Young Shin KIM, June O SONG, Ju Hyeon OH, Chang Hyeong LEE, Tae Sung LEE, Se Yeon JUNG, Byung Yeon CHOI, Sung Min HWANG