Patents by Inventor Ju-hyeong Lee
Ju-hyeong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11957495Abstract: An X-ray imaging apparatus includes an imaging device configured to capture a camera image of a target; a controller configured to stitch a plurality of X-ray images of respective divided regions of the target to generate one X-ray image of the target; and a display configured to display a settings window that provides a GUI for receiving a setting of an X-ray irradiation condition for the respective divided regions, and display the camera image in which positions of the respective divided regions are displayed.Type: GrantFiled: December 15, 2021Date of Patent: April 16, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ho Jun Lee, Ju Hwan Kim, Se Hui Kim, Seung-Hoon Kim, Si Won Park, Phill Gu Jung, Duhgoon Lee, Myung Jin Chung, Do Hyeong Hwang, Sung Jin Park
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Publication number: 20240100629Abstract: The present disclosure discloses a substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam transmitting plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a VCSEL beam having a single wavelength to a lower surface of the flat substrate through the beam transmitting plate; and an temperature measuring module configured to measure the laser beam reflected from the lower surface or an upper surface the flat substrate, thereby measuring the temperature of the flat substrate.Type: ApplicationFiled: December 29, 2021Publication date: March 28, 2024Inventors: Hyoung June Kim, Byung Kuk Kim, Wang Jun Park, Tae Hyeong Kim, Ju Mi Lee, Byeong Gyu Jeong
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Publication number: 20230408246Abstract: An apparatus for measuring a depth of a three-dimensional (3D) object includes a control unit generating the 3D object by adjusting parameters of a 3D pattern. A 3D display unit displays the 3D object with a preset depth. An input unit generates an input signal based on an input received from a user. A rail extends in a front and a rear of the 3D display unit. A moving body is movable on the rail. Movement of the moving body is adjusted based on the input signal. A distance sensor measures a distance to the moving body.Type: ApplicationFiled: March 28, 2023Publication date: December 21, 2023Inventors: Young Sang HA, Ju Hyeong LEE, Sung Jun JOO, Beom Shik KIM, Young Chan KIM
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Patent number: 11702536Abstract: A thermoplastic resin composition includes 100 parts by weight of a base resin including 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (a) containing conjugated diene rubber having a particle diameter of 0.05 ?m to 0.2 ?m, 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (b) containing conjugated diene rubber having a particle diameter of greater than 0.2 ?m and less than or equal to 0.5 ?m, and 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (c); and more than 0.01 parts by weight and less than 2 parts by weight of a compound having a kinematic viscosity (25° C.) greater than 5 cSt and less than 200 cSt. The resin composition has excellent plating characteristics.Type: GrantFiled: September 6, 2019Date of Patent: July 18, 2023Assignee: LG CHEM, LTD.Inventors: Ju Hyeong Lee, Byoung Il Kang, Seo Hwa Kim, Sejin Han, Seongkyun Kim
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Patent number: 11236224Abstract: Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 ?m or more and less than 0.2 ?m; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 ?m; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer.Type: GrantFiled: November 13, 2017Date of Patent: February 1, 2022Assignee: LG CHEM, LTD.Inventors: Ju Hyeong Lee, Byoung Il Kang, Se Jin Han
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Patent number: 11195827Abstract: A semiconductor integrated circuit device may include a pad, a first voltage protection circuit and a second voltage protection circuit. The first voltage protection circuit may be connected with the pad. The second voltage protecting circuit may be connected between the first voltage protection circuit and a ground terminal. The first voltage protection circuit may include a gate positive p-channel metal oxide semiconductor (GPPMOS) transistor. The second voltage protection circuit may include serially connected GPPMOS transistors.Type: GrantFiled: January 25, 2019Date of Patent: December 7, 2021Assignee: SK hynix Inc.Inventors: Chang Hwi Lee, Jin Woo Kim, Hyun Duck Lee, Seung Yeop Lee, Ju Hyeong Lee
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Publication number: 20210211117Abstract: A receiving filter circuit includes: a double mode surface acoustic wave (DMS) filter placed on a piezoelectric substrate and having a first reflector and a plurality of comb-shaped electrodes located adjacent to the first reflector; and a surface acoustic wave (SAW) resonator placed on the piezoelectric substrate in such a manner as to be laid on at least a portion of a transmission path of a surface acoustic wave generated from the DMS filter and having a second reflector located on a position with a distance of zero from the first reflector and a plurality of comb-shaped electrodes located adjacent to the second reflector.Type: ApplicationFiled: January 6, 2021Publication date: July 8, 2021Inventors: Bong Gi KIM, Kensei UEHARA, Ju Hyeong LEE, Takahiro SATO
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Publication number: 20210179839Abstract: Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 ?m or more and less than 0.2 ?m; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 ?m; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer.Type: ApplicationFiled: November 13, 2017Publication date: June 17, 2021Inventors: Ju Hyeong LEE, Byoung Il KANG, Se Jin HAN
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Publication number: 20200325325Abstract: A thermoplastic resin composition includes 100 parts by weight of a base resin including 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (a) containing conjugated diene rubber having a particle diameter of 0.05 ?m to 0.2 ?m, 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (b) containing conjugated diene rubber having a particle diameter of greater than 0.2 ?m and less than or equal to 0.5 ?m, and 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (c); and more than 0.01 parts by weight and less than 2 parts by weight of a compound having a kinematic viscosity (25° C.) greater than 5 cSt and less than 200 cSt. The resin composition has excellent plating characteristics.Type: ApplicationFiled: September 6, 2019Publication date: October 15, 2020Inventors: Ju Hyeong LEE, Byoung Il KANG, Seo Hwa KIM, Sejin HAN, Seongkyun KIM
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Publication number: 20190379204Abstract: A semiconductor integrated circuit device may include a pad, a first voltage protection circuit and a second voltage protection circuit. The first voltage protection circuit may be connected with the pad. The second voltage protecting circuit may be connected between the first voltage protection circuit and a ground terminal. The first voltage protection circuit may include a gate positive p-channel metal oxide semiconductor (GPPMOS) transistor. The second voltage protection circuit may include serially connected GPPMOS transistors.Type: ApplicationFiled: January 25, 2019Publication date: December 12, 2019Applicant: SK hynix Inc.Inventors: Chang Hwi LEE, Jin Woo KIM, Hyun Duck LEE, Seung Yeop LEE, Ju Hyeong LEE
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Patent number: 10189984Abstract: The present invention relates to a thermoplastic resin composition and a molded article manufactured thereofrom. In accordance with the present invention, a thermoplastic resin composition providing higher chemical resistance with respect to a blowing agent while providing the same impact strength, gloss, and vacuum moldability as existing resin compositions when used to produce an inner case of a refrigerator, and a molded article manufactured from the same are provided.Type: GrantFiled: November 30, 2016Date of Patent: January 29, 2019Assignee: LG CHEM, LTD.Inventors: Seo Hwa Kim, Seong Lyong Kim, Tae Hoon Kim, Ju Hyeong Lee
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Patent number: 10160851Abstract: The present invention relates to a styrene-based thermoplastic resin composition with improved flowability and, more specifically, a thermoplastic resin composition, which retains heat resistance and improved flowability by introducing a low-molecular weight styrene-acrylonitrile (SAN) resin into an acrylonitrile-butadiene-styrene (ABS) resin, which has enhanced heat resistance through the addition of a heat-resistant resin, and to a molded article into which the composition is molded. According to the resin composition, there can be obtained: a thermal resin composition, which has an improvement in the flowability of the heat-resistant ABS resin and retains non-deteriorating or favorable heat resistance and impact resistance; and a molded article.Type: GrantFiled: November 26, 2015Date of Patent: December 25, 2018Assignee: LG Chem, Ltd.Inventors: Dae San Jung, Seung Hun Han, Seong Lyong Kim, Hyun Ho Joo, Ju Hyeong Lee, Soo Kyeong Lee
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Patent number: 10095164Abstract: A fixing device is provided which includes a fixing belt rotatably arranged, a fixing roller disposed to face the fixing belt and forming a fixing nip together with an outer surface of the fixing belt a guide unit configured to guide rotation of the fixing belt in the fixing belt; and a pair of support units configured to limit movement of the fixing belt in a width direction at both ends of the guide unit. The fixing device may have a structure of guiding rotation of the fixing belt and a structure of limiting movement thereof in width direction, which are separated from each other.Type: GrantFiled: June 9, 2016Date of Patent: October 9, 2018Assignee: S-PRINTING SOLUTION CO., LTD.Inventors: Sun Hyung Lee, Sang Uk Jeon, Hyun Keun Park, Ju Hyeong Lee
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Publication number: 20180002522Abstract: The present invention relates to a thermoplastic resin composition and a molded article manufactured thereofrom. In accordance with the present invention, a thermoplastic resin composition providing higher chemical resistance with respect to a blowing agent while providing the same impact strength, gloss, and vacuum moldability as existing resin compositions when used to produce an inner case of a refrigerator, and a molded article manufactured from the same are provided.Type: ApplicationFiled: November 30, 2016Publication date: January 4, 2018Inventors: Seo Hwa KIM, Seong Lyong KIM, Tae Hoon KIM, Ju Hyeong LEE
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Publication number: 20170292017Abstract: The present invention relates to a styrene-based thermoplastic resin composition with improved flowability and, more specifically, a thermoplastic resin composition, which retains heat resistance and improved flowability by introducing a low-molecular weight styrene-acrylonitrile (SAN) resin into an acrylonitrile-butadiene-styrene (ABS) resin, which has enhanced heat resistance through the addition of a heat-resistant resin, and to a molded article into which the composition is molded. According to the resin composition, there can be obtained: a thermal resin composition, which has an improvement in the flowability of the heat-resistant ABS resin and retains non-deteriorating or favorable heat resistance and impact resistance; and a molded article.Type: ApplicationFiled: November 26, 2015Publication date: October 12, 2017Inventors: Dae San JUNG, Seung Hun HAN, Seong Lyong KIM, Hyun Ho JOO, Ju Hyeong LEE, Soo Kyeong LEE
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Publication number: 20160363891Abstract: A fixing device is provided which includes a fixing belt rotatably arranged, a fixing roller disposed to face the fixing belt and forming a fixing nip together with an outer surface of the fixing belt a guide unit configured to guide rotation of the fixing belt in the fixing belt; and a pair of support units configured to limit movement of the fixing belt in a width direction at both ends of the guide unit. The fixing device may have a structure of guiding rotation of the fixing belt and a structure of limiting movement thereof in width direction, which are separated from each other.Type: ApplicationFiled: June 9, 2016Publication date: December 15, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Hyung LEE, Sang Uk Jeon, Hyun Keun Park, Ju Hyeong Lee
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Patent number: 9235175Abstract: An image fixing apparatus is provided including a pressing roller, a fixing belt rotatably disposed such that an outer circumferential surface of the fixing belt contacts the pressing roller, and a rotating bush to support rotation of the fixing belt. The fixing belt includes a load support member arranged in an axial direction, a heating layer formed on an outer circumferential surface of the load support member to generate heat, and an electrode layer provided with an first portion axially contacting the heating layer at an axial end of the load support member, the electrode layer transferring electric energy to the heating layer. An inner end of the rotating bush axially extends to an inner side of the electrode layer such that the electrode layer is supported by the rotating bush. The image fixing apparatus may uniformly form a fixing nip and improve durability of the fixing belt.Type: GrantFiled: June 12, 2014Date of Patent: January 12, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Uk Jeon, Sun Hyung Lee, Ju Hyeong Lee
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Patent number: 8958736Abstract: A fixing apparatus includes a heating roller and a nip forming unit facing the heating roller to form a fixing nip. The heating roller includes a resistive heating layer receiving an electric current to generate heat, and a base material supporting the resistive heating layer, wherein a resistance per unit length of the resistive heating layer at opposite sides in a length direction is less than a resistance per unit length of the resistive heating layer at a center portion.Type: GrantFiled: August 30, 2013Date of Patent: February 17, 2015Assignee: SAMSUNG Electronics Co., Ltd.Inventors: Sun-hyung Lee, Ju-hyeong Lee, Sang-uk Jeon
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Publication number: 20140376978Abstract: An image fixing apparatus is provided including a pressing roller, a fixing belt rotatably disposed such that an outer circumferential surface of the fixing belt contacts the pressing roller, and a rotating bush to support rotation of the fixing belt. The fixing belt includes a load support member arranged in an axial direction, a heating layer formed on an outer circumferential surface of the load support member to generate heat, and an electrode layer provided with an first portion axially contacting the heating layer at an axial end of the load support member, the electrode layer transferring electric energy to the heating layer. An inner end of the rotating bush axially extends to an inner side of the electrode layer such that the electrode layer is supported by the rotating bush. The image fixing apparatus may uniformly form a fixing nip and improve durability of the fixing belt.Type: ApplicationFiled: June 12, 2014Publication date: December 25, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Uk JEON, Sun Hyung Lee, Ju Hyeong Lee
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Publication number: 20140294471Abstract: A fixing apparatus includes a heating roller and a nip forming unit facing the heating roller to form a fixing nip. The heating roller includes a resistive heating layer receiving an electric current to generate heat, and a base material supporting the resistive heating layer, wherein a resistance per unit length of the resistive heating layer at opposite sides in a length direction is less than a resistance per unit length of the resistive heating layer at a center portion.Type: ApplicationFiled: August 30, 2013Publication date: October 2, 2014Applicant: SAMSUNG Electronics Co., Ltd.Inventors: Sun-hyung LEE, Ju-hyeong LEE, Sang-uk JEON