Patents by Inventor Ju Hyoung PARK

Ju Hyoung PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210376490
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Application
    Filed: August 11, 2021
    Publication date: December 2, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
  • Publication number: 20210376450
    Abstract: A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.
    Type: Application
    Filed: August 17, 2021
    Publication date: December 2, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki RYOO, Ju Hyoung PARK, Nam Ki KIM, Dae Ki LIM, Won Cheol LEE, Hong In KIM
  • Patent number: 11158928
    Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: October 26, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Myeong Woo Han, Jae Yeong Kim, Young Sik Hur, Sung Yong An, Dae Ki Lim
  • Publication number: 20210313694
    Abstract: A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.
    Type: Application
    Filed: August 25, 2020
    Publication date: October 7, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ki LIM, Young Sik HUR, Kyu Bum HAN, Ju Hyoung PARK, Myeong Woo HAN, Jeong Ki RYOO
  • Patent number: 11128031
    Abstract: A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Ki Ryoo, Ju Hyoung Park, Nam Ki Kim, Dae Ki Lim, Won Cheol Lee, Hong In Kim
  • Patent number: 11121476
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: September 14, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
  • Patent number: 11050154
    Abstract: A chip antenna includes: a body portion; a radiating portion disposed on one surface of the body portion in a width direction; and a ground portion disposed on another surface of the body portion in a width direction, wherein the radiating portion includes a dielectric substance and a conductor, and the dielectric substance and the conductor are respectively disposed in different regions in a thickness direction.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 29, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Ju Hyoung Park
  • Publication number: 20210175609
    Abstract: A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.
    Type: Application
    Filed: March 18, 2020
    Publication date: June 10, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki RYOO, Ju Hyoung PARK, Nam Ki KIM, Dae Ki LIM, Won Cheol LEE, Hong In KIM
  • Publication number: 20210175613
    Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
    Type: Application
    Filed: February 17, 2021
    Publication date: June 10, 2021
    Applicant: Samsung Electro-Mechanics.,Co., Ltd.
    Inventors: Seong Hee CHOI, Sang Jong LEE, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
  • Publication number: 20210151899
    Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.
    Type: Application
    Filed: March 18, 2020
    Publication date: May 20, 2021
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hyoung PARK, Young Sik HUR, Sung Yong AN, Myeong Woo HAN, Kyu Bum HAN, Dae Ki LIM
  • Publication number: 20210151853
    Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
    Type: Application
    Filed: February 27, 2020
    Publication date: May 20, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung PARK, Myeong Woo HAN, Jae Yeong KIM, Young Sik HUR, Sung Yong AN, Dae Ki LIM
  • Publication number: 20210143527
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.
    Type: Application
    Filed: January 19, 2021
    Publication date: May 13, 2021
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Nam CHO, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
  • Patent number: 10985442
    Abstract: An antenna apparatus includes: a ground plane having a through-hole; a feed line disposed below the ground plane; an insulating layer disposed between the feed line and the ground plane; a feed via electrically connected to the feed line, and passing through the through-hole; and a chip patch antenna electrically connected to the feed via. The chip patch antenna includes: a patch antenna pattern electrically connected to the feed via; an upper coupling pattern disposed above the patch antenna pattern; edge coupling patterns surrounding a portion of the patch antenna pattern; upper edge coupling patterns surrounding a portion of the upper coupling pattern; and a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than that of the insulating layer.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: April 20, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki Ryoo, Nam Ki Kim, Eun Young Jung, Hong In Kim, Ju Hyoung Park, Won Cheol Lee, Kyu Bum Han
  • Patent number: 10978785
    Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 13, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Hee Choi, Sang Jong Lee, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
  • Patent number: 10965030
    Abstract: An antenna apparatus includes: a ground layer; a feed line disposed in a position lower than a position of the ground layer; and an antenna structure including a first radiation part connected to one end of the feed line and configured to provide a first electromagnetic plane in a first direction, and a second radiation part connected to the first radiation part, configured to provide a second electromagnetic plane in a second direction, and disposed such that at least a portion of the second radiation part is disposed in a position higher than the position of the ground layer.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: March 30, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myeong Woo Han, Nam Ki Kim, Dae Ki Lim, Ju Hyoung Park, Jeong Ki Ryoo
  • Patent number: 10965004
    Abstract: A chip antenna module includes a substrate having layers; a chip antenna mounted on one surface of the substrate to radiate a radio signal, the chip antenna having a body portion formed of a dielectric substance, and a ground portion and a radiating portion disposed on opposite surfaces of the body portion; and an auxiliary patch disposed below the radiating portion on at least one layer of the substrate.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: March 30, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Myeong Woo Han, Jeong Ki Ryoo, Dae Ki Lim, Nam Ki Kim
  • Publication number: 20210075114
    Abstract: An antenna apparatus includes a feed via, a patch antenna pattern which is electrically connected to a first end of the feed via, a plurality of first conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern, and a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns and configured to surround the patch antenna pattern and the plurality of conductive array patterns.
    Type: Application
    Filed: November 23, 2020
    Publication date: March 11, 2021
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Nam Ki KIM, Ju Hyoung PARK, Jeong Ki RYOO, Myeong Woo HAN, Dae Ki LIM
  • Publication number: 20210066782
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.
    Type: Application
    Filed: January 15, 2020
    Publication date: March 4, 2021
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Nam CHO, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
  • Patent number: 10938091
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: March 2, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Nam Cho, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
  • Publication number: 20210050670
    Abstract: An antenna apparatus includes a ground layer, patch antenna patterns, feed vias, ring-type meta patterns, and coupling-type meta patterns. The ground layer has one or more through-holes. Patch antenna patterns are each disposed above the ground layer. Feed vias are disposed to penetrate through the one or more through-holes, and electrically connect to the patch antenna patterns, respectively. Ring-type meta patterns are arranged between the patch antenna patterns. Coupling-type meta patterns are alternately arranged between the patch antenna patterns in fewer numbers than the ring-type meta patterns in positions more distant from the patch antenna patterns than positions in which the ring-type meta patterns are arranged.
    Type: Application
    Filed: October 28, 2020
    Publication date: February 18, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki KIM, Dae Ki LIM, Jeong Ki RYOO, Ju Hyoung PARK, Jae Min KEUM, Myeong Woo HAN