Abstract: Disclosed is a machine having a moving member. The moving member including a cold plate having a plurality of slots through the cold plate. The moving member also including a plurality of ferromagnetic cores coupled to the cold plate, each of the plurality of ferromagnetic cores protruding through a respective one of the plurality of slots, creating gaps between the plurality of ferromagnetic cores. The moving member also including a plurality of armature windings coupled to the cold plate, the plurality of armature windings occupying the gaps between the plurality of ferromagnetic cores.

Abstract: A random access method for a terminal with the processor and the memory to access a low earth orbit satellite network formed by multiple low earth orbit satellites (LE0 SAT) includes: the stage where a Deep Reinforcement Learning (DRL) algorithm is applied for a pre-set time to decide which one between the first and the second actions should be performed at every access cycle, and to perform the random access to the low earth orbit satellite network based on the above decision while learning it; and the stage where, according to the learning result of the DRL algorithm performed for above pre-set time, it decides which of the first and the second actions should be chosen when attempting to access the low earth orbit satellite network at a new access cycle and then to perform the random access to the low earth orbit satellite network according to the above choice.

Abstract: A photoresist supplying system includes a pump that includes a first tube phragm that stores a photoresist and a filter that filters the photoresist, a second tube phragm that stores the photoresist and is disposed outside the pump, where the second tube phragm transfers the photoresist to the first tube phragm, a storage unit that stores the photoresist, where the storage unit provides the photoresist to the second tube phragm, and a tube phragm drive unit that is connected to the first tube phragm. The tube phragm drive unit adjusts an interior volume of the first tube phragm and applies a pressure to a flexible outer wall of the first tube phragm to transfer the photoresist from the first tube phragm to a nozzle installed in the chamber. At least a part of the photoresist stored in the first tube phragm is transferred to the second tube phragm.

Abstract: Disclosed is an apparatus based on wireless optical communication, which may include: a light source outputting light; an optical circulator outputting the light in at least one direction; a collimator converting and outputting the light output through the optical circulator into a parallel beam; an optical regulator reflecting the light converted into the parallel beam, and transferring the reflected light to an external apparatus, and receiving the reflected light from the external apparatus, the reflected light being light output by reversely reflecting the light by the external apparatus; an optical detector converting the reflected light into an electric signal to generate an optical signal; and a controller analyzing the optical signal and acquiring an intensity of the reflected light, and calculating central coordinate information of the external apparatus based on the intensity value of the reflected light.

Abstract: Disclosed are a semiconductor device and a method of fabricating the same. The semiconductor device may include a substrate having a groove therein extending in a first direction, a gate insulating layer in the groove, a first conductive pattern in the groove and on the gate insulating layer, and a word line capping pattern in the groove and on the first conductive pattern. The first conductive pattern may include a first material and may include a first conductive portion adjacent to the word line capping pattern and a second conductive portion adjacent to a bottom end of the groove. A largest dimension of a grain of the first material of the first conductive portion may be equal to or larger than that of the first material of the second conductive portion.

Abstract: A method of fabricating a semiconductor package includes disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer. A bonding tool is disposed on the interposer. The bonding tool includes a first region and a second region outside of the first region. The second region of the bonding tool corresponds to the pad part. The interposer and the substrate are bonded to each other.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: Disclosed is a technology for performing, in an electronic apparatus included in a central station, an uplink- or downlink-related operation by allocating a transmission power intensity based on a transmission and reception capability of a terrestrial terminal.

Abstract: Disclosed is an operation method of an electronic apparatus assigning power based on a position of a terminal, the method including receiving data transmission requests from a first terrestrial terminal and a second terrestrial terminal, wherein the first terrestrial terminal and the second terrestrial terminal use overlapped frequency resources, and assigning a first transmission power intensity to the first terrestrial terminal and assigning a second transmission power intensity to the second terrestrial terminal based on a position of the first terrestrial terminal and a position of the second terrestrial terminal.

Abstract: A moving member of a machine can include a cold plate that serves as a primary structural member for the moving member. The cold plate can have one or more cooling channels formed within the cold plate. A plurality of armature windings can be fixed to the cold plate. One or more field windings can be fixed to the cold plate. A plurality of ferromagnetic cores can be fixed to the cold plate, each ferromagnetic core positioned within a loop of at least one of the plurality of armature windings. Other embodiments are described.

Abstract: Homopolar linear synchronous machines are provided herein that include a mover device. The mover device includes a cold plate with ferromagnetic cores extending through slots in the cold plate. Layers of armature coils are located around the ferromagnetic cores on opposite sides of the cold plate. The mover device further includes at least one field coil.

Abstract: Disclosed herein are a method for establishing a remote work environment for ensuring the security of a user terminal for remote work and an apparatus using the method. The method, performed by the apparatus, includes acquiring media image creation information from a user; creating a certificate for VPN access based on the media image creation information and creating a media image using the media image creation information and the certificate for VPN access; and providing the media image to the user such that the user is able to create a medium for remote work. The user terminal for remote work is booted through the medium for remote work, thereby configuring a runtime environment for remote work in which security is ensured.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: Homopolar linear synchronous machines (200) are provided herein that include a mover device (111). The mover device (111) includes a cold plate with ferromagnetic cores extending through slots in the cold plate. Layers of armature coils are located around the ferromagnetic cores on opposite sides of the cold plate. The mover device (111) further includes at least one field coil.

Abstract: A channel segment for a track of a mover device is provided, the channel segment comprising: opposite ends joined by a body forming a magnetic flux pathway between the opposite ends, the magnetic flux pathway being one or more of C-shaped, U-shaped and horseshoe shaped between the opposite ends, the opposite ends forming respective transverse magnetic flux pathways about perpendicular to the magnetic flux pathway; laminations of ferromagnetic material forming the body, the laminations about parallel to the magnetic flux pathway and about perpendicular to the respective transverse magnetic flux pathways; shear pins through the laminations, the shear pins positioned to reduce eddy currents one or more of in and around the shear pins; and a retention mechanism at the opposite ends, the retention mechanism configured to transversely fasten the laminations together at the opposite ends while remaining insulated from each other.

Abstract: A moving member of a machine can include a cold plate that serves as a primary structural member for the moving member. The cold plate can have one or more cooling channels formed within the cold plate. A plurality of armature windings can be fixed to the cold plate. One or more field windings can be fixed to the cold plate. A plurality of ferromagnetic cores can be fixed to the cold plate, each ferromagnetic core positioned within a loop of at least one of the plurality of armature windings. Other embodiments are described.

Abstract: A storage controller and an operating method of the storage controller are provided. The storage controller includes processing circuitry configured to read sub-stripe data from each of a plurality of non-volatile memory devices connected with a RAID (Redundant Array of Inexpensive Disk), check error information of at least one of the sub-stripe data, and perform a RAID recovery operation in response to the at least one of the sub-stripe data having an uncorrectable error, and a RAID memory which stores calculation results of the RAID recovery operation.

Abstract: An apparatus for folding a battery cell according to an embodiment of the present invention may fold a sealing part of a pouch-type battery cell. The apparatus for folding the battery cell includes a base on which an accommodation part of the battery cell is seated, a guide protruding upward from each of both sides of the base to wrap the accommodation part at both sides, a pressing member configured to press the sealing part so that the sealing part is folded toward an outer surface of the guide, a heating member configured to heat the sealing part when the pressing member presses the sealing part, and a cooling member configured to inject cold air to the folded sealing part.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A semiconductor device and a method of fabricating a semiconductor device, the device including a semiconductor substrate that includes a trench defining an active region; a buried dielectric pattern in the trench; a silicon oxide layer between the buried dielectric pattern and an inner wall of the trench; and a polycrystalline silicon layer between the silicon oxide layer and the inner wall of the trench, wherein the polycrystalline silicon layer has a first surface in contact with the semiconductor substrate and a second surface in contact with the silicon oxide layer, and wherein the second surface includes a plurality of silicon grains that are uniformly distributed.