Abstract: Provided are an electrode capable of preventing separation of a short-circuit prevention layer since the short-circuit prevention layer, which is made of a heat-resistant polymer fiber, can be attached with high binding force when formed on the surface of the electrode, in the case that an active material layer includes a predetermined amount of polyvinylidene fluoride (PVdF) as a binder; a secondary battery using the same; and a method of manufacturing the electrode. The electrode includes: an electrode current collector; an active material layer formed on the electrode current collector; and a short-circuit prevention layer formed on the active material layer, wherein the short-circuit prevention layer includes a porous polymer fiber web having a plurality of pores through accumulation of ultrafine fibers of a heat-resistant polymer material, and the active material layer includes PVdF as a binder.

Abstract: The present invention is a structure for fixing a roof module of a vehicle, which is improved to insert and fix a polymer panel for a joining between a vehicle body structure as a steel structure and a component made of a material other than steel. The present invention provides a structure for fixing a roof module of a vehicle, comprising: a roof rail of a vehicle; a roof panel made of a material different from that of the roof rail, which is fixed at the roof rail; a polymer member coupled between the roof rail and the roof panel; and a joint member which joins the roof rail, the roof panel, and the polymer member.

Abstract: A quantum dot sheet having a fibrous-web structure, including a quantum dot layer having a three-dimensional network structure formed by an aggregate of nanofibers. The nanofibers include quantum dots.

Abstract: A medical diagnostic apparatus having a height-adjustable table for animals according to an embodiment of the present invention includes: a table where an animal is placed; a support stand supporting the table such that the table vertically moves and adjusting height of the table to move the table close to a floor; an X-ray detector disposed under the table and coupled to the support stand to move with the table; and an imaging stand spaced from the table, connected to the support stand, and having an X-ray tube for radiating X-rays to the X-ray detector.

Abstract: An electric machine includes a rotor, a first and second stator, a first and second plurality of permanent magnets, a first and second winding, a third and fourth winding. The first stator and the second stator are mounted axially relative to the rotor. A first permanent magnet and a second permanent magnet of the first plurality of permanent magnets have opposite polarities. A first permanent magnet and a second permanent magnet of the second plurality of permanent magnets have opposite polarities. The first winding, the second winding, the third winding, and the fourth winding are connected in series. An absolute value of an angle offset between the first winding and the third winding and between closest poles of the first plurality of poles and the second plurality of poles is 180 electrical degrees.

Abstract: A memory card system may include a flexible integrated circuit device package, an upper flexible case, a lower flexible case, a wiring structure, an anisotropic conductive film, etc. The flexible integrated circuit device package may include a material capable of being bent or folded and a flexible integrated circuit device having a connection pad for an electrical connection. The upper flexible case may include a material capable of being bent or folded and may cover the integrated circuit device package. The lower flexible case may include a material capable of being bent or folded and the flexible integrated circuit device package may be fixed to the lower flexible case.

Abstract: An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.

Abstract: An electric machine includes a rotor, a first and second stator, a first and second plurality of permanent magnets, a first and second winding, a third and fourth winding. The first stator and the second stator are mounted axially relative to the rotor. A first permanent magnet and a second permanent magnet of the first plurality of permanent magnets have opposite polarities. A first permanent magnet and a second permanent magnet of the second plurality of permanent magnets have opposite polarities. The first winding, the second winding, the third winding, and the fourth winding are connected in series. An absolute value of an angle offset between the first winding and the third winding and between closest poles of the first plurality of poles and the second plurality of poles is 180 electrical degrees.

Abstract: A method for manufacturing an electronic component having a flexible structure includes the steps of: forming an integrated circuit element package having a foldable and expandable flexible structure, the integrated circuit element package including a first substrate having a foldable and expandable, flexible structure and having a structure on which a heat transfer part capable of transferring heat is patterned, an integrated circuit element having a foldable and expandable, flexible structure and having a first pad of which one surface is electrically connectable, and an adhesive film having a foldable and expandable, flexible structure, which is disposed between the substrate and the integrated circuit element so that the substrate and the integrated circuit element can be adhered to each other; forming a second substrate having a foldable and expandable, flexible structure and having a second pad of which one surface is electrically connectable; and performing a thermo-compression process so as to adhere

Abstract: An electronic component may include an integrated circuit device package and a second substrate. The integrated circuit device package may include a first substrate being bent or spread, a heat transfer member disposed in the first substrate, an integrated circuit device being bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate. The second substrate may be bent or spread. The second substrate may include a second pad. The integrated circuit device package may be combined with the second substrate by a thermo compression bonding process in which the heat transfer member may transfer a heat to the second substrate through the first substrate and the first pad may make contact with the second pad.

Abstract: A non-volatile memory device may include a semiconductor substrate and an isolation layer on the semiconductor substrate wherein the isolation layer defines an active region of the semiconductor substrate. A tunnel insulation layer may be provided on the active region of the semiconductor substrate, and a charge storage pattern may be provided on the tunnel insulation layer. An interface layer pattern may be provided on the charge storage pattern, and a blocking insulation pattern may be provided on the interface layer pattern. Moreover, the block insulation pattern may include a high-k dielectric material, and the interface layer pattern and the blocking insulation pattern may include different materials. A control gate electrode may be provided on the blocking insulating layer so that the blocking insulation pattern is between the interface layer pattern and the control gate electrode. Related methods are also discussed.

Abstract: A nonvolatile memory device includes: a plurality of cell strings disposed on a substrate, wherein at least one of the plurality of cell strings comprises a plurality of cell transistors and at least one ground select transistor stacked in a direction substantially perpendicular to the substrate, and the substrate and a channel region of the plurality of cell strings have a same conductivity type; a substrate bias circuit configured to provide an erase voltage to the substrate in an erase operation; and a ground select line voltage generator configured to provide a ground select line saturation voltage to the at least one ground select transistor in the erase operation.

Abstract: A jelly-roll type battery unit, a winding method thereof and a lithium secondary battery comprising the battery unit include a first electrode plate having a first electrode current collector with a first electrode tab and a first electrode active material layer coated on at least one surface of the first electrode current collector, a second electrode plate having a second electrode current collector with a second electrode tab and a second electrode active material layer coated on at least one surface of the second electrode current collector, and a separator that is interposed between the first electrode plate and the second electrode plate, wherein the electrode tab is incorporated into the electrode current collector in an area of either the first or the second electrode plate where the corresponding electrode active material layer is not coated.

Abstract: The present invention is a structure for fixing a roof module of a vehicle, which is improved to insert and fix a polymer panel for a joining between a vehicle body structure as a steel structure and a component made of a material other than steel. The present invention provides a structure for fixing a roof module of a vehicle, comprising: a roof rail of a vehicle; a roof panel made of a material different from that of the roof rail, which is fixed at the roof rail; a polymer member coupled between the roof rail and the roof panel; and a joint member which joins the roof rail, the roof panel, and the polymer member.

Abstract: A memory card system may include a flexible integrated circuit device package, an upper flexible case, a lower flexible case, a wiring structure, an anisotropic conductive film, etc. The flexible integrated circuit device package may include a material capable of being bent or folded and a flexible integrated circuit device having a connection pad for an electrical connection. The upper flexible case may include a material capable of being bent or folded and may cover the integrated circuit device package. The lower flexible case may include a material capable of being bent or folded and the flexible integrated circuit device package may be fixed to the lower flexible case.

Abstract: A nonvolatile memory device comprises a channel pattern, a first interlayer dielectric film and a second interlayer dielectric film spaced apart from each other and stacked over each other, a gate pattern disposed between the first interlayer dielectric film and the second interlayer dielectric film, a trap layer disposed between the gate pattern and the channel pattern and a charge spreading inhibition layer disposed between the channel pattern and the first interlayer dielectric film and between the channel pattern and the second interlayer dielectric film. The charge spreading inhibition layer may include charges inside or on its surface. The charge spreading inhibition layer includes at least one of a metal oxide film or a metal nitride film or a metal oxynitride film having a greater dielectric constant than a silicon oxide film.

Abstract: An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.

Abstract: A vertical memory device includes a channel and gate electrodes. The channel extends in a vertical direction with respect to a top surface of a substrate. The gate electrodes are disposed on an outer sidewall of the channel. The gate electrodes includes a ground selection line (GSL), a word line, a string selection line (SSL) and a first dummy word line sequentially stacked from the top surface of the substrate in the vertical direction to be spaced apart from each other. The channel includes an impurity region at a portion adjacent to the SSL.

Abstract: A nonvolatile memory device includes: a plurality of cell strings disposed on a substrate, wherein at least one of the plurality of cell strings comprises a plurality of cell transistors and at least one ground select transistor stacked in a direction substantially perpendicular to the substrate, and the substrate and a channel region of the plurality of cell strings have a same conductivity type; a substrate bias circuit configured to provide an erase voltage to the substrate in an erase operation; and a ground select line voltage generator configured to provide a ground select line saturation voltage to the at least one ground select transistor in the erase operation.

Abstract: Disclosed herein are a method for searching for a tag with a communication error and an electronic shelf label system server. The electronic shelf label system server communicating with a plurality of gateways which are installed in a store includes: a gateway identification unit identifying the gateway, which receives a tag signal generated from a tag with a communication error, among the plurality of gateways; a signal attenuation factor measurement unit measuring a signal attenuation factor of the tag signal which is received by the identified gateway; an antenna characteristics measurement unit measuring antenna characteristics of the identified gateway; and a tag position estimation unit determining a spaced distance between the identified gateway and the tag with a communication error and estimating a position of the tag with a communication error based on a position coordinate of the identified gateway and the spaced distance.