Patents by Inventor Ju Hyung Yoon
Ju Hyung Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10418514Abstract: Exemplary embodiments of the present invention disclose a light emitting diode including an n-type contact layer doped with silicon, a p-type contact layer, an active region disposed between the n-type contact layer and the p-type contact layer, a superlattice layer disposed between the n-type contact layer and the active region, the superlattice layer including a plurality of layers, an undoped intermediate layer disposed between the superlattice layer and the n-type contact layer, and an electron reinforcing layer disposed between the undoped intermediate layer and the superlattice layer. Only a final layer of the superlattice layer closest to the active region is doped with silicon, and the silicon doping concentration of the final layer is higher than that of the n-type contact layer.Type: GrantFiled: July 6, 2017Date of Patent: September 17, 2019Assignee: SEOUL VIOSYS CO., LTD.Inventors: Kwang Joong Kim, Chang Suk Han, Kyung Hee Ye, Seung Kyu Choi, Ki Bum Nam, Nam Yoon Kim, Kyung Hae Kim, Ju Hyung Yoon
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Publication number: 20170309775Abstract: Exemplary embodiments of the present invention disclose a light emitting diode including an n-type contact layer doped with silicon, a p-type contact layer, an active region disposed between the n-type contact layer and the p-type contact layer, a superlattice layer disposed between the n-type contact layer and the active region, the superlattice layer including a plurality of layers, an undoped intermediate layer disposed between the superlattice layer and the n-type contact layer, and an electron reinforcing layer disposed between the undoped intermediate layer and the superlattice layer. Only a final layer of the superlattice layer closest to the active region is doped with silicon, and the silicon doping concentration of the final layer is higher than that of the n-type contact layer.Type: ApplicationFiled: July 6, 2017Publication date: October 26, 2017Inventors: Kwang Joong Kim, Chang Suk Han, Kyung Hee Ye, Seung Kyu Choi, Ki Bum Nam, Nam Yoon Kim, Kyung Hae Kim, Ju Hyung Yoon
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Patent number: 9716210Abstract: Exemplary embodiments of the present invention disclose a light emitting diode including an n-type contact layer doped with silicon, a p-type contact layer, an active region disposed between the n-type contact layer and the p-type contact layer, a superlattice layer disposed between the n-type contact layer and the active region, the superlattice layer including a plurality of layers, an undoped intermediate layer disposed between the superlattice layer and the n-type contact layer, and an electron reinforcing layer disposed between the undoped intermediate layer and the superlattice layer. Only a final layer of the super lattice layer closest to the active region is doped with silicon, and the silicon doping concentration of the final layer is higher than that of the n-type contact layer.Type: GrantFiled: April 17, 2015Date of Patent: July 25, 2017Assignee: Seoul Viosys Co., Ltd.Inventors: Kwang Joong Kim, Chang Suk Han, Kyung Hee Ye, Seung Kyu Choi, Ki Bum Nam, Nam Yoon Kim, Kyung Hae Kim, Ju Hyung Yoon
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Patent number: 9136427Abstract: Exemplary embodiments of the present invention disclose a light emitting diode including an n-type contact layer doped with silicon, a p-type contact layer, an active region disposed between the n-type contact layer and the p-type contact layer, a superlattice layer disposed between the n-type contact layer and the active region, the superlattice layer including a plurality of layers, an undoped intermediate layer disposed between the superlattice layer and the n-type contact layer, and an electron reinforcing layer disposed between the undoped intermediate layer and the superlattice layer. Only a final layer of the superlattice layer closest to the active region is doped with silicon, and the silicon doping concentration of the final layer is higher than that of the n-type contact layer.Type: GrantFiled: December 13, 2012Date of Patent: September 15, 2015Assignee: Seoul Viosys Co., Ltd.Inventors: Kwang Joong Kim, Chang Suk Han, Kyung Hee Ye, Seung Kyu Choi, Ki Bum Nam, Nam Yoon Kim, Kyung Hae Kim, Ju Hyung Yoon
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Publication number: 20150221822Abstract: Exemplary embodiments of the present invention disclose a light emitting diode including an n-type contact layer doped with silicon, a p-type contact layer, an active region disposed between the n-type contact layer and the p-type contact layer, a superlattice layer disposed between the n-type contact layer and the active region, the superlattice layer including a plurality of layers, an undoped intermediate layer disposed between the superlattice layer and the n-type contact layer, and an electron reinforcing layer disposed between the undoped intermediate layer and the superlattice layer. Only a final layer of the super lattice layer closest to the active region is doped with silicon, and the silicon doping concentration of the final layer is higher than that of the n-type contact layer.Type: ApplicationFiled: April 17, 2015Publication date: August 6, 2015Inventors: Kwang Joong Kim, Chang Suk Han, Kyung Hee Ye, Seung Kyu Choi, Ki Bum Nam, Nam Yoon Kim, Kyung Hae Kim, Ju Hyung Yoon
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Patent number: 8470626Abstract: Exemplary embodiments of the present invention relate to a method of fabricating a light emitting diode (LED). According to an exemplary embodiment of the present invention, the method includes growing a first GaN-based semiconductor layer on a substrate at a first temperature by supplying a chamber with a nitride source gas and a first metal source gas, stopping the supply of the first metal source gas and maintaining the first temperature for a first time period after stopping the supply of the first metal source gas, decreasing the temperature of the substrate to the a second temperature after the first time period elapses, growing an active layer of the first GaN-based semiconductor layer at the second temperature by supplying the chamber with a second metal source gas.Type: GrantFiled: June 1, 2011Date of Patent: June 25, 2013Assignee: Seoul Opto Device Co., Ltd.Inventors: Kwang Joong Kim, Chang Suk Han, Seung Kyu Choi, Ki Bum Nam, Nam Yoon Kim, Kyung Hae Kim, Ju Hyung Yoon
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Patent number: 8357924Abstract: Exemplary embodiments of the present invention disclose a light emitting diode including an n-type contact layer doped with silicon, a p-type contact layer, an active region disposed between the n-type contact layer and the p-type contact layer, a superlattice layer disposed between the n-type contact layer and the active region, the superlattice layer including a plurality of layers, an undoped intermediate layer disposed between the superlattice layer and the n-type contact layer, and an electron reinforcing layer disposed between the undoped intermediate layer and the superlattice layer. Only a final layer of the superlattice layer closest to the active region is doped with silicon, and the silicon doping concentration of the final layer is higher than that of the n-type contact layer.Type: GrantFiled: January 3, 2011Date of Patent: January 22, 2013Assignee: Seoul Opto Device Co., Ltd.Inventors: Kwang Joong Kim, Chang Suk Han, Kyung Hee Ye, Seung Kyu Choi, Ki Bum Nam, Nam Yoon Kim, Kyung Hae Kim, Ju Hyung Yoon
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Publication number: 20120142134Abstract: Exemplary embodiments of the present invention relate to a method of fabricating a light emitting diode (LED). According to an exemplary embodiment of the present invention, the method includes growing a first GaN-based semiconductor layer on a substrate at a first temperature by supplying a chamber with a nitride source gas and a first metal source gas, stopping the supply of the first metal source gas and maintaining the first temperature for a first time period after stopping the supply of the first metal source gas, decreasing the temperature of the substrate to the a second temperature after the first time period elapses, growing an active layer of the first GaN-based semiconductor layer at the second temperature by supplying the chamber with a second metal source gas.Type: ApplicationFiled: June 1, 2011Publication date: June 7, 2012Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Kwang Joong KIM, Chang Suk HAN, Seung Kyu CHOI, Ki Bum NAM, Nam Yoon KIM, Kyung Hae KIM, Ju Hyung YOON
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Publication number: 20120037881Abstract: Exemplary embodiments of the present invention disclose a light emitting diode including an n-type contact layer doped with silicon, a p-type contact layer, an active region disposed between the n-type contact layer and the p-type contact layer, a superlattice layer disposed between the n-type contact layer and the active region, the superlattice layer including a plurality of layers, an undoped intermediate layer disposed between the superlattice layer and the n-type contact layer, and an electron reinforcing layer disposed between the undoped intermediate layer and the superlattice layer. Only a final layer of the superlattice layer closest to the active region is doped with silicon, and the silicon doping concentration of the final layer is higher than that of the n-type contact layer.Type: ApplicationFiled: January 3, 2011Publication date: February 16, 2012Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Kwang Joong KIM, Chang Suk HAN, Kyung Hee YE, Seung Kyu CHOI, Ki Bum NAM, Nam Yoon KIM, Kyung Hae KIM, Ju Hyung YOON