Patents by Inventor Ju Ik KANG

Ju Ik KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11798845
    Abstract: Method for forming tungsten gap fill on a structure, including high aspect ratio structures includes depositing a tungsten liner in the structure using a physical vapor deposition (PVD) process with high ionization and an ambient gas of argon or krypton. The PVD process is performed at a temperature of approximately 20 degrees Celsius to approximately 300 degrees Celsius. The method further includes treating the structure with a nitridation process and depositing bulk fill tungsten into the structure using a chemical vapor deposition (CVD) process to form a seam suppressed boron free tungsten fill. The CVD process is performed at a temperature of approximately 300 degrees Celsius to approximately 500 degrees Celsius and at a pressure of approximately 5 Torr to approximately 300 Torr.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: October 24, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Xi Cen, Kai Wu, Min Heon, Wei Min Chan, Tom Ho Wing Yu, Peiqi Wang, Ju Ik Kang, Feihu Wang, Nobuyuki Sasaki, Chunming Zhou
  • Publication number: 20220336274
    Abstract: Method for forming tungsten gap fill on a structure, including high aspect ratio structures includes depositing a tungsten liner in the structure using a physical vapor deposition (PVD) process with high ionization and an ambient gas of argon or krypton. The PVD process is performed at a temperature of approximately 20 degrees Celsius to approximately 300 degrees Celsius. The method further includes treating the structure with a nitridation process and depositing bulk fill tungsten into the structure using a chemical vapor deposition (CVD) process to form a seam suppressed boron free tungsten fill. The CVD process is performed at a temperature of approximately 300 degrees Celsius to approximately 500 degrees Celsius and at a pressure of approximately 5 Torr to approximately 300 Torr.
    Type: Application
    Filed: July 5, 2022
    Publication date: October 20, 2022
    Inventors: Xi CEN, Kai WU, Min HEON, Wei Min CHAN, Tom Ho Wing YU, Peiqi WANG, Ju Ik KANG, Feihu WANG, Nobuyuki SASAKI, Chunming ZHOU
  • Publication number: 20220130724
    Abstract: Method for forming tungsten gap fill on a structure, including high aspect ratio structures includes depositing a tungsten liner in the structure using a physical vapor deposition (PVD) process with high ionization and an ambient gas of argon or krypton. The PVD process is performed at a temperature of approximately 20 degrees Celsius to approximately 300 degrees Celsius. The method further includes treating the structure with a nitridation process and depositing bulk fill tungsten into the structure using a chemical vapor deposition (CVD) process to form a seam suppressed boron free tungsten fill. The CVD process is performed at a temperature of approximately 300 degrees Celsius to approximately 500 degrees Celsius and at a pressure of approximately 5 Torr to approximately 300 Torr.
    Type: Application
    Filed: October 28, 2020
    Publication date: April 28, 2022
    Inventors: Xi CEN, Kai WU, Min HEON, Wei Min CHAN, Tom Ho Wing YU, Peiqi WANG, Ju Ik KANG, Feihu WANG, Nobuyuki SASAKI, Chunming ZHOU