Abstract: A photographing method and apparatus is provided. The photographing apparatus includes a photographing unit; a sensing unit for sensing motion of the photographing apparatus; a display unit for displaying at least one guide image for panorama photographing; a controller for controlling the photographing unit to automatically photograph, if a photographing direction that changes in accordance with motion of the photographing apparatus corresponds to one of the at least one guide image; and a storage unit for storing the photographed image data.

Abstract: A package substrate of a semiconductor package includes second and third pad bonding portions respectively located at both sides of a first pad bonding portion on a substrate body. First to third via landing portions are spaced apart from the first to third pad bonding portions. First and second connection trace portions are disposed side by side. A first guard trace portion is substantially parallel with the first connection trace portion. The second connection trace portion is connected to the first guard trace portion through a first connection plane portion. The first connection plane portion connects the second connection trace portion to the second via landing portion. The third pad bonding portion is connected to the third via landing portion through a second connection plane portion. A semiconductor chip mounted on the package substrate includes first inner chip pads and first outer chip pads bonded to the package substrate.

Abstract: A portable device and a method for providing a User Interface (UI) mode are provided. The portable device includes a display unit, a sensor unit for sensing a user's motion, and a control unit for controlling, if the user's motion is sensed by the sensor unit, the display unit to release a standby mode of the portable device and to output a UI mode screen corresponding to a type of the motion.

Abstract: A semiconductor package according to an aspect of the present disclosure includes a package substrate, a lower chip, an interposer, and an upper chip sequentially stacked on the package substrate, and bonding wires electrically connecting the package substrate and the interposer. The interposer includes lower chip connection pads electrically connected to the lower chip on a lower surface of the interposer, first upper chip connection pads and second upper chip connection pads electrically connected to the upper chip, respectively, on an upper surface of the interposer, wire bonding pads disposed on the upper surface of the interposer and bonded to the bonding wires, first redistribution lines disposed on the upper surface of the interposer and electrically connecting the second upper chip connection pads to the wire bonding pads, and through via electrodes electrically connecting the lower chip connection pads and the first upper chip connection pads.

Abstract: A control device which controls the power of a plurality of apparatuses in a home network, and a method thereof are provided. The control device includes an input unit which receives a power off command, and a control unit which concurrently turns off apparatuses which are currently turned on among the plurality of apparatuses in response to the power off command received by the input unit. Therefore, it is possible for a user to concurrently turn off currently running apparatuses so user convenience can increase.

Abstract: A planar dual die package includes a package substrate and first and second semiconductor dice disposed side by side on a first surface of the package substrate. Outer connectors are disposed on a second surface of the package substrate, and the second surface of the package substrate includes a command/address ball region and a data ball region. Each of the first and second semiconductor dice includes die pads disposed in a command/address pad region corresponding to the command/address ball region and in a data pad region corresponding to the data ball region. Each of the first and second semiconductor dice are disposed on the package substrate so that a first direction from the command/address ball region toward the data ball region coincides with a second direction from the command/address pad region toward the data pad region.

Abstract: A package substrate of a semiconductor package includes second and third pad bonding portions respectively located at both sides of a first pad bonding portion on a substrate body. First to third via landing portions are spaced apart from the first to third pad bonding portions. First and second connection trace portions are disposed side by side. A first guard trace portion is substantially parallel with the first connection trace portion. The second connection trace portion is connected to the first guard trace portion through a first connection plane portion. The first connection plane portion connects the second connection trace portion to the second via landing portion. The third pad bonding portion is connected to the third via landing portion through a second connection plane portion. A semiconductor chip mounted on the package substrate includes first inner chip pads and first outer chip pads bonded to the package substrate.

Abstract: A photographing method and apparatus is provided.

Abstract: A photographing method and apparatus is provided. The photographing apparatus includes a photographing unit; a sensing unit for sensing motion of the photographing apparatus; a display unit for displaying at least one guide image for panorama photographing; a controller for controlling the photographing unit to automatically photograph, if a photographing direction that changes in accordance with motion of the photographing apparatus corresponds to one of the at least one guide image; and a storage unit for storing the photographed image data.

Abstract: Methods and apparatus are provided for obtaining a service is provided. Information about an external device is received at a terminal from the external device. It is determined whether the external device has been registered based on the information about the external device. Service information associated with the external device is provided when at least the external device has been registered.

Abstract: A planar dual die package includes a package substrate and first and second semiconductor dice disposed side by side on a first surface of the package substrate. Outer connectors are disposed on a second surface of the package substrate, and the second surface of the package substrate includes a command/address ball region and a data ball region. Each of the first and second semiconductor dice includes die pads disposed in a command/address pad region corresponding to the command/address ball region and in a data pad region corresponding to the data ball region. Each of the first and second semiconductor dice are disposed on the package substrate so that a first direction from the command/address ball region toward the data ball region coincides with a second direction from the command/address pad region toward the data pad region.

Abstract: A planar dual die package includes a package substrate and first and second semiconductor dice disposed side by side on a first surface of the package substrate. Outer connectors are disposed on a second surface of the package substrate, and the second surface of the package substrate includes a command/address ball region and a data ball region. Each of the first and second semiconductor dice includes die pads disposed in a command/address pad region corresponding to the command/address ball region and in a data pad region corresponding to the data ball region. Each of the first and second semiconductor dice are disposed on the package substrate so that a first direction from the command/address ball region toward the data ball region coincides with a second direction from the command/address pad region toward the data pad region.

Abstract: A semiconductor package may include a first semiconductor chip having first bonding pads on a first active surface. The semiconductor package may include a second semiconductor chip having second bonding pads which are arranged on a second active surface. The first and second semiconductor chips are stacked such that the first and second active surfaces face each other.

Abstract: A portable device and a method for providing a User Interface (UI) mode are provided. The portable device includes a display unit, a sensor unit for sensing a user's motion, and a control unit for controlling, if the user's motion is sensed by the sensor unit, the display unit to release a standby mode of the portable device and to output a UI mode screen corresponding to a type of the motion.

Abstract: A semiconductor package may include a first semiconductor chip having first bonding pads on a first active surface. The semiconductor package may include a second semiconductor chip having second bonding pads which are arranged on a second active surface. The first and second semiconductor chips are stacked such that the first and second active surfaces face each other.

Abstract: A portable device and a method for providing a User Interface (UI) mode are provided. The portable device includes a display unit, a sensor unit for sensing a user's motion, and a control unit for controlling, if the user's motion is sensed by the sensor unit, the display unit to release a standby mode of the portable device and to output a UI mode screen corresponding to a type of the motion.

Abstract: A method for indicating a direction of content transfer intuitively and a device applying the same includes determining directions in which surrounding devices of the device are located, and a direction to which the content on a display of the device is to be moved, and transferring the content to the surrounding device located in the determined direction. Accordingly, it is possible to select a device to receive the content more easily and intuitively, and also input a command to select the device to receive the content and to transfer the content with one single manipulation.

Abstract: A planar dual die package includes a package substrate and first and second semiconductor dice disposed side by side on a first surface of the package substrate. Outer connectors are disposed on a second surface of the package substrate, and the second surface of the package substrate includes a command/address ball region and a data ball region. Each of the first and second semiconductor dice includes die pads disposed in a command/address pad region corresponding to the command/address ball region and in a data pad region corresponding to the data ball region. Each of the first and second semiconductor dice are disposed on the package substrate so that a first direction from the command/address ball region toward the data ball region coincides with a second direction from the command/address pad region toward the data pad region.

Abstract: An apparatus and method of controlling a motion of an object on a touch screen of a device including recognizing pressures at least two positions on the touch screen of the device, and controlling a motion of the object on the touch screen using a difference in pressure between the at least two recognized positions.

Abstract: A method and apparatus for determining an input are provided. The method includes authenticating an external device, when the external device approaches in a predetermined range; determining an area approached by the external device and determining whether the determined area is valid; and outputting a predetermined indication to a predetermined area related to the area approached by the external device.