Patents by Inventor Ju-Liang He

Ju-Liang He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Speaker diaphragm and its manufacturing method
    Patent number: 8851228
    Abstract: A speaker diaphragm structure includes a speaker diaphragm and a coating formed on the speaker diaphragm and is composed of at least one dense layer and relatively porous layer alternately arranged with respect to the at least one dense layer.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: October 7, 2014
    Assignee: Feng Chia University
    Inventors: Ju-Liang He, Po-Yu Chen
  • Flexible Electrical Heating Element and Manufacturing Method Thereof
    Publication number: 20140110397
    Abstract: This invention proposes a flexible electrical heating element comprising a substrate, a metal interlayer coating and a far-infrared emissive carbon film. The flexible electrical heating element utilizes a low-cost and environmental friendly vacuum coating technique to deposit the metal interlayer coating and the far-infrared emissive carbon film on the flexible and insulating substrate which can provide uniform heating, and the far-infrared emissive carbon film can emit far-infrared.
    Type: Application
    Filed: April 23, 2013
    Publication date: April 24, 2014
    Applicant: Feng Chia University
    Inventors: Ju-Liang He, Chiao-Chih Hsu, Jen-Tsung Wang, Chun-Ming Chen
  • SPEAKER DIAPHRAGM AND ITS MANUFACTURING METHOD
    Publication number: 20140054104
    Abstract: A speaker diaphragm structure includes a speaker diaphragm and a coating formed on the speaker diaphragm and is composed of at least one dense layer and relatively porous layer alternately arranged with respect to the at least one dense layer.
    Type: Application
    Filed: July 11, 2013
    Publication date: February 27, 2014
    Inventors: Ju-Liang HE, Po-Yu CHEN
  • DIAMOND ABRASIVE GRAIN AND ELECTROPLATED TOOL HAVING THE SAME
    Publication number: 20130291445
    Abstract: A coating method on diamond abrasive grains is used to form a conductive film on diamond abrasive grains. The conductive film has chemical composition gradient giving the diamond abrasive grain an outwardly increasing electrical conductibility as a function of film thickness. The subsequent electroplating layer can therefore more effectively embed the modified diamond abrasive grains, whilst the adhesion/bonding strength between substrate (work piece for electroplating) and the diamond abrasive grains is improved.
    Type: Application
    Filed: May 1, 2012
    Publication date: November 7, 2013
    Applicant: SIGMA INNOVATION TECHNOLOGY INC.
    Inventors: WEN-TUNG CHEN, JU-LIANG HE
  • Method for manufacturing a high-efficiency thermal conductive base board
    Patent number: 7036219
    Abstract: A method for manufacturing a high-efficiency thermal conductive base board for electrical connection with an electronic component includes the steps of: (a) placing a metal substrate in an electrolytic bath; (b) oxidizing the metal substrate in the electrolytic bath to form a metal oxide layer thereon through micro-arc oxidation; (c) forming a plurality of conductive contacts on the metal oxide layer for electrical connection with the electronic component.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: May 2, 2006
    Assignee: Feng Chia University
    Inventor: Ju-Liang He
  • Method for manufacturing a high-efficiency thermal conductive base board
    Publication number: 20050223551
    Abstract: A method for manufacturing a high-efficiency thermal conductive base board for electrical connection with an electronic component includes the steps of: (a) placing a metal substrate in an electrolytic bath; (b) oxidizing the metal substrate in the electrolytic bath to form a metal oxide layer thereon through micro-arc oxidation; (c) forming a plurality of conductive contacts on the metal oxide layer for electrical connection with the electronic component.
    Type: Application
    Filed: April 1, 2004
    Publication date: October 13, 2005
    Inventor: Ju-Liang He
  • High-efficiency thermal conductive base board
    Publication number: 20050221067
    Abstract: A high-efficiency thermal conductive base board for electrical connection with an electronic component includes a metal oxide layer formed on the metal substrate, and a plurality of conductive contacts formed on the metal oxide layer for electrical connection with the electronic component.
    Type: Application
    Filed: April 1, 2004
    Publication date: October 6, 2005
    Inventor: Ju-Liang He
  • Method for packaging electronic devices
    Publication number: 20040234766
    Abstract: An improved method for packaging electronic devices by coating organic light emitting device uniformly with an encapsulation material which includes of nanometer inorganic powder and polymer, to form a moisture permeation resistant layer between the nanometer inorganic powder and the polymer after the solidification of the package layer.
    Type: Application
    Filed: May 5, 2004
    Publication date: November 25, 2004
    Inventors: Yi-Hsuan Liu, Ju-Liang He