Abstract: There are disclosed a stacked package formed by stacking semiconductor device packages and a manufacturing method thereof. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package body has the same thickness as that of the lead so as to expose the upper and the lower surfaces of the leads to the package body. Each of the packages is stacked on another package by electrically connecting the exposed upper and lower surfaces of the leads with each other. The manufacturing method has preparing lead frames, attaching an adhesive tape to the lower surface of the lead frame, bonding a semiconductor chip to the adhesive tape in the chip receiving cavity between the leads, connecting the semiconductor chip to the connection terminals, forming a package body, removing the adhesive tape; removing dam bars from the side frame, separating packages from the lead frame, and forming a stacked package by stacking a plurality of the packages.