Abstract: A manufacturing method of electronic packaging includes the steps of preparing a metallic plate having an array of cover portions, soldering the metallic plate to a circuit board having encapsulated areas corresponding to the cover portions and employing a cutting process to obtain multiple electronic packages.

Abstract: A MEMS microphone module includes a first circuit board and a second circuit board attached to the first circuit board. A MEMS chip and an ASIC chip are respectively received in one of two concavities of the first circuit board. A first ground layer of the first circuit board and a second ground layer of the second circuit board are electrically coupled to each other to define a ground shielding structure. By this way, an EMI shielding can be applied by the ground shielding structure to the MEMS chip and the ASIC chip.

Abstract: A microelectromechanical microphone comprises a shell body, a microelectromechanical microphone chip and an integrated circuit. The shell body having a cavity and an opening, sound from outside enters into the cavity from the opening. The microelectromechanical microphone chip and the integrated circuit are disposed on a circuit layout inside the cavity. A filter is integrated with the microelectromechanical microphone chip at an appropriate location. Sound entered from the opening into the cavity is received by the microelectromechanical microphone chip, then the sound or audio signals are converted to electrical signals through the filter and the integrated circuit, to be transmitted to external electronic devices.

Abstract: A method for manufacturing a film bulk acoustic wave filter, wherein a single-layer high-acoustic-impedance reflection layer is applied for the film bulk acoustic wave, for example, a diamond film with single-layer high-acoustic-impedance or a BCB film with single-layer low-acoustic-impedance is used as a reflection layer under the film bulk acoustic wave device in order to replace the cavity-reflective construction or the multi-layer reflection construction that are presently used; thus, there is no need for etching the cavity, the steadiness of the device and the yield of the device can be improved, and the FOM (figure of merit) of the film acoustic wave device is also improved; further, as there is no backside etching and front-side etching proceeded, the size of die is reduced greatly, so it is advantageous to mass production.

Abstract: A manufacturing method for a high quality film bulk acoustic wave device, wherein a lower electrode protecting layer is partially defined or not applied, thus the quality factor of the bulk acoustic wave device is improved.

Abstract: A bulk acoustic wave filter device and its package. The filter devices greatly decreases the manufacturing process complexity by the coplanar electrode layout, and it omits the process steps of forming via hole of connectors, such that it is convenient to the coplanar high frequency on-wafer measurement and trimming. Furthermore, by using the wafer level chip scale package (WLCSP) technique, which to integrate the series resonator and the shunt resonator can be integrated, the spaces of filter can be saved and the cost of package can be down.