Patents by Inventor Ju-Pin HUNG

Ju-Pin HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface modification for handling wafer thinning process
    Patent number: 8647925
    Abstract: A wafer is provided with a through via extending a portion of a substrate, an interconnect structure electrically connecting the through via, and a polyimide layer formed on the interconnect structure. Surface modification of the polyimide layer is the formation of a thin dielectric film on the polyimide layer by coating, plasma treatment, chemical treatment, or deposition methods. The thin dielectric film is adhered strongly to the polyimide layer, which can reduce the adhesion between the wafer surface and an adhesive layer formed in subsequent carrier attaching process.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: February 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Chih Chiou, Shau-Lin Shue, Weng-Jin Wu, Ju-Pin Hung
  • SURFACE MODIFICATION FOR HANDLING WAFER THINNING PROCESS
    Publication number: 20110081749
    Abstract: A wafer is provided with a through via extending a portion of a substrate, an interconnect structure electrically connecting the through via, and a polyimide layer formed on the interconnect structure. Surface modification of the polyimide layer is the formation of a thin dielectric film on the polyimide layer by coating, plasma treatment, chemical treatment, or deposition methods. The thin dielectric film is adhered strongly to the polyimide layer, which can reduce the adhesion between the wafer surface and an adhesive layer formed in subsequent carrier attaching process.
    Type: Application
    Filed: June 3, 2010
    Publication date: April 7, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Chih CHIOU, Shau-Lin SHUE, Weng-Jin WU, Ju-Pin HUNG