Abstract: A light source having light emitting modules coupled to a flexible circuit carrier. The flexible circuit carrier includes a sheet of flexible material having electrically conducting traces connecting a circuit mounting area and a connector region. The light emitting modules are electrically connected to the circuit mounting area. In one embodiment, the light emitting modules are arranged in a linear array. The light source preferably includes a light pipe having a planar layer of transparent material, the light emitting modules being bonded to an edge of the planar layer. The light pipe is preferably attached to a printed circuit board and the connection region of the flexible circuit carrier is attached to the printed circuit board. The flexible circuit carrier can move heat from the light emitting modules to the printed circuit board as well as providing electrical connections.

Abstract: A light emitting device package and method for making the package utilizes a first leadframe having a first surface and a second leadframe having a second surface that are relatively positioned such that the second surface is at a higher level than the first surface. The light emitting device package includes a light source, e.g., a light emitting diode die, which is mounted on the first surface of the first leadframe and electrically connected to the second surface of the second leadframe.

Abstract: In one embodiment, a light-emitting apparatus includes a plurality of adjacent, overlapping light-guide plates formed of substantially transparent material, and a plurality of light sources. Each of the light-guide plates has i) first and second ends, ii) one or more substantially transparent surfaces through which light is emitted, and iii) one or more reflective surfaces to redirect light within the light-guide plate. Where first and second light-guide plates are adjacent, the first end of the first light-guide plate A) underhangs the second end of the second light-guide plate, and B) is positioned opposite a primary light-emitting side of the apparatus. The plurality of light sources are optically coupled to the first ends of the light-guide plates so as to illuminate the interiors of the light-guide plates.

Abstract: In one embodiment, a light-emitting apparatus includes a substrate having i) a plurality of overlapping panels that form acute angles with respect to an imaginary surface that bisects the overlapping panels, and ii) a plurality of recesses formed between overlapping portions of the overlapping panels. The recesses are open to the first side of the substrate, and the first side of the substrate has a reflective surface. A plurality of light sources is positioned to emanate light from the recesses.

Abstract: A device includes a header, a cap having an unsealed aperture attached to the header, and a laser device disposed on the header configured so as to emit through the unsealed aperture. A passivation layer at least partially encapsulates the VCSEL chip.

Abstract: A light emitting device includes a PCB substrate, an LED die that is attached to the PCB substrate, and a silicone-based encapsulation structure that encapsulates the LED die between the silicone-based encapsulation structure and the PCB substrate. The silicone-based material that is used to form the encapsulation structure exhibits low moisture absorption and a low elastic modulus relative to epoxy-based materials.