Patents by Inventor Ju-Seok PARK

Ju-Seok PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CATHODE ACTIVE MATERIAL FOR ALL-SOLID-STATE BATTERY WITH CONTROLLED PARTICLE SIZE AND PREPARATION METHOD THEREOF
    Publication number: 20240120475
    Abstract: The present disclosure relates to a cathode active material for an all-solid-state battery with a controlled particle size and a method for preparing the same. In particular, the cathode active material includes lithium and a transition metal, wherein the cathode active material has a single peak in the range of 1 ?m to 10 ?m as a result of particle size distribution (PSD) analysis.
    Type: Application
    Filed: May 4, 2023
    Publication date: April 11, 2024
    Inventors: Sung Woo NOH, Hong Seok MIN, Sang Heon LEE, Jeong Hyun SEO, Im Sul SEO, Chung Bum LIM, Ju Yeong SEONG, Je Sik PARK
  • Method for preparing polyetherketoneketone and polyetherketoneketone prepared thereby
    Patent number: 11919999
    Abstract: Provided are a method for preparing a polyetherketoneketone and a polyetherketoneketone prepared thereby, wherein, at the time of a polymerization reaction, nitrogen gas is blown into a liquid reaction medium while stirring, thereby quickly removing hydrochloric acid, which is a by-product generated during the reaction, and preventing aggregation of resin particles, thus suppressing the generation of scales.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: March 5, 2024
    Assignee: HANWHA CHEMICAL CORPORATION
    Inventors: Kwang Seok Jeong, Min Sung Kim, Jae Heon Kim, Ju Young Park, Cho Hee Ahn, Byeong Hyeon Lee, Sang Hyun Cho
  • Plate bonding method and plate assembly
    Patent number: 10112255
    Abstract: The present invention relates to a thin plate bonding method or a thin plate assembly, and more particularly, to a thin plate bonding method which includes coating with a coating material after increasing a surface roughness or increasing a surface roughness through coating with a coating material, and then, conducting diffusion bonding, such that excellent bonding strength is achieved even when the diffusion bonding is performed at low temperature and low pressure, thin plate deformation by thermal stress may be prevented, and high air tightness may be obtained since the coating material fills micro-pores.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: October 30, 2018
    Assignee: Korea Institute of Energy Research
    Inventors: Jong-Soo Park, Kyung-Ran Hwang, Dong-Wook Lee, Ju-Seok Park, Chun-Boo Lee, Sung-Wook Lee, Duck-Kyu Oh, Jin-Woo Park, Min-Ho Jin
  • THIN PLATE BONDING METHOD AND THIN PLATE ASSEMBLY
    Publication number: 20170129047
    Abstract: The present invention relates to a thin plate bonding method or a thin plate assembly, and more particularly, to a thin plate bonding method which includes coating with a coating material after increasing a surface roughness or increasing a surface roughness through coating with a coating material, and then, conducting diffusion bonding, such that excellent bonding strength is achieved even when the diffusion bonding is performed at low temperature and low pressure, thin plate deformation by thermal stress may be prevented, and high air tightness may be obtained since the coating material fills micro-pores.
    Type: Application
    Filed: June 17, 2015
    Publication date: May 11, 2017
    Applicant: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Jong-Soo PARK, Kyung-Ran HWANG, Dong-Wook LEE, Ju-Seok PARK, Chun-Boo LEE, Sung-Wook LEE, Duck-Kyu OH, Jin-Woo PARK, Min-Ho JIN