Abstract: An adhesive promoter, an organic silicon encapsulant composition, and an organic silicon encapsulant are provided. The adhesive promoter used for the organic silicon encapsulant is formed from a borosiloxane polymer represented by a general formula of: (R1R22SiO1/2)x(R2R3SiO2/2)y(R3SiO3/2)z(SiO4/2)i(BO(3-k)/2)j(OR4)k. R1 is a hydrogen atom or a C2-C6 alkenyl group. R2 and R4 are respectively a C1-C6 alkyl group. R3 is a C6-C12 aromatic group. In the general formula, x, y, z, i, j, and k represent a molar ratio. In the general formula, x, y, z, i, and j are a non-negative number smaller than or equal to 1, and k is a positive number ?3. A sum of x, y, z, and i is 1, and x is larger than 0.

Abstract: An adhesive promoter, an organic silicon encapsulant composition, and an organic silicon encapsulant are provided. The adhesive promoter used for the organic silicon encapsulant is formed from a borosiloxane polymer represented by a general formula of: (R1R22S1/2)x(R2R3SiO2/2)y(R3SiO3/2)z(SiO4/2)i(BO(3-k)/2)j(OR4)k. R1 is a hydrogen atom or a C2-C6 alkenyl group. R2 and R4 are respectively a C1-C6 alkyl group. R3 is a C6-C12 aromatic group. In the general formula, x, y, z, i, j, and k represent a molar ratio. In the general formula, x, y, z, i, and j are a non-negative number smaller than or equal to 1, and k is a positive number ?3. A sum of x, y, z, and i is 1, and x is larger than 0.

Abstract: An LED package structure with multiple color temperatures includes a substrate, a circuit layer disposed on the substrate, a plurality of first LED chips and a plurality of second LED chips disposed on the circuit layer, and a light conversion layer disposed on the substrate and the circuit layer. The light conversion layer has a spiral surface arranged away from the substrate. The light conversion layer includes a first light conversion portion and a second light conversion portion arranged around a lateral side of the first light conversion portion. The color temperature of the first light conversion portion is different from that of the second light conversion portion. The first LED chips are embedded in the first light conversion portion, and the second LED chips are embedded in the second light conversion portion. Thus, the LED package structure provided by the instant disclosure has good production efficiency.

Abstract: An LED package structure with multiple color temperatures includes a substrate, a circuit layer disposed on the substrate, a plurality of first LED chips and a plurality of second LED chips disposed on the circuit layer, and a light conversion layer disposed on the substrate and the circuit layer. The light conversion layer has a spiral surface arranged away from the substrate. The light conversion layer includes a first light conversion portion and a second light conversion portion arranged around a lateral side of the first light conversion portion. The color temperature of the first light conversion portion is different from that of the second light conversion portion. The first LED chips are embedded in the first light conversion portion, and the second LED chips are embedded in the second light conversion portion. Thus, the LED package structure provided by the instant disclosure has good production efficiency.