Patents by Inventor Ju Wan NAM

Ju Wan NAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board having embedded electronic device and method of manufacturing the same
    Patent number: 9504169
    Abstract: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: November 22, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Nam Hwang, Ju Wan Nam, Seung Wan Woo, Yee Na Shin
  • PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150014034
    Abstract: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.
    Type: Application
    Filed: October 22, 2013
    Publication date: January 15, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Nam Hwang, Ju Wan Nam, Seung Wan Woo, Yee Na Shin
  • CALIBRATION BLOCK FOR MEASURING WARPAGE, WARPAGE MEASURING APPARATUS USING THE SAME, AND METHOD THEREOF
    Publication number: 20140354797
    Abstract: Disclosed herein are a calibration block for measuring warpage, a warpage measuring apparatus using the same, and a method thereof. The calibration block includes a substrate having one planar surface; and a stepped part forming a step at the center of the other surface of the substrate.
    Type: Application
    Filed: February 17, 2014
    Publication date: December 4, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wan Woo, Ju Wan Nam, Young Nam Hwang, Kyung Ho Lee, Suk Jin Ham
  • METHOD, APPARATUS AND SAMPLE FOR EVALUATING BONDING STRENGTH
    Publication number: 20140174193
    Abstract: There are provided a method, an apparatus and a sample for evaluating bonding strength, the method including setting a micro-region including a bonded interface in an evaculated sample, forming a first groove in a circumferential portion of the micro-region to have a predetermined depth, processing a side of the micro-region to form a second groove connected to the bonded interface, and applying pressure on the micro-region to measure a critical point at which a delamination of the micro-region is generated.
    Type: Application
    Filed: February 21, 2013
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyu Seok KIM, Hee Suk CHUNG, Hyun Jung LEE, Suk-Jin HAM, Ju Wan NAM, Jin Uk CHA, Mi Yang KIM