Patents by Inventor Ju WEI

Ju WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250053211
    Abstract: A system comprises a controller, configured to receive at least one thermal control setting and a system temperature, and to perform a first thermal throttling operation according to at least one thermal control instruction; and an application, coupled to the controller, configured to receive the at least one thermal control setting and the system temperature from the controller, and to generate the at least one thermal control instruction according to the at least one thermal control setting and the system temperature.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 13, 2025
    Applicant: MEDIATEK INC.
    Inventors: Hsien-Hsi Hsieh, Ching-Yeh Chen, Yu-Ming Lin, Hsing-Ju Wei
  • Patent number: 11990889
    Abstract: A bulk acoustic wave resonator and a formation method thereof are provided. The method for forming the bulk acoustic wave resonator includes forming a sacrificial structure on a substrate. A seed layer is formed on the sacrificial structure. A bottom electrode is formed on the seed layer. A piezoelectric layer is formed on the bottom electrode. A top electrode is formed on the piezoelectric layer. The sacrificial structure is removed to form a cavity. The seed layer is etched through the cavity.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: May 21, 2024
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Kuo-Lung Weng, Chia-Ta Chang, Tzu-Sheng Hsieh, Chun-Ju Wei
  • Publication number: 20240047225
    Abstract: A control method of a multi-stage etching process and a processing device using the same are provided. The control method of the multi-stage etching process includes the following step S. A stack information of a plurality of hard mask layers is set. An etching target condition is set. Through a machine learning model, a parameter setting recipe of the hard mask layers is generated under the etching target condition. The machine learning model is trained based on the stack information of the hard mask layers, a plurality of process parameters and a process result.
    Type: Application
    Filed: September 6, 2022
    Publication date: February 8, 2024
    Inventors: Liang Ju WEI, Chung-Yi CHIU, Zhen WU, Hsuan-Hsu CHEN, Chun-Lung CHEN
  • Patent number: 11637538
    Abstract: A bulk acoustic wave filter comprises a substrate, an insulating layer disposed on the substrate and having a first cavity and a second cavity formed therein, a first bulk-acoustic-wave-resonance-structure disposed on the first cavity and a second bulk-acoustic-wave-resonance-structure disposed on the second cavity. The first bulk-acoustic-wave-resonance-structure comprises a first bottom electrode disposed on the first cavity, a first top electrode disposed on the first bottom electrode, a first piezoelectric layer portion sandwiched between the first top electrode and the first bottom electrode, and a first frequency tuning structure disposed between the first cavity and the first bottom electrode. The second bulk-acoustic-wave-resonance-structure comprises a second bottom electrode disposed on the second cavity, a second top electrode disposed on the second bottom electrode, a second piezoelectric layer portion sandwiched between the second top electrode and the second bottom electrode.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 25, 2023
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Chia-Ta Chang, Chun-Ju Wei, Kuo-Lung Weng
  • Patent number: 11502661
    Abstract: A method for fabricating bulk acoustic wave resonator with mass adjustment structure, comprising following steps of: forming a sacrificial structure mesa on a substrate; etching the sacrificial structure mesa such that any two adjacent parts have different heights, a top surface of a highest part of the sacrificial structure mesa is coincident with a mesa top extending plane; forming an insulating layer on the sacrificial structure mesa and the substrate; polishing the insulating layer to form a polished surface; forming a bulk acoustic wave resonance structure including a top electrode, a piezoelectric layer and a bottom electrode on the polished surface; etching the sacrificial structure mesa to form a cavity; the insulating layer between the polished surface and the mesa top extending plane forms a frequency tuning structure, the insulating layer between the mesa top extending plane and the cavity forms a mass adjustment structure.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: November 15, 2022
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Chia-Ta Chang, Chun-Ju Wei, Kuo-Lung Weng
  • Patent number: 11493536
    Abstract: A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: November 8, 2022
    Assignee: MPI CORPORATION
    Inventors: Tzu-Yang Chen, Chin-Yi Lin, Chen-Rui Wu, Sheng-Yu Lin, Ming-Ta Hsu, Chia-Ju Wei
  • Publication number: 20220209741
    Abstract: A bulk acoustic wave resonator and a formation method thereof are provided. The method for forming the bulk acoustic wave resonator includes forming a sacrificial structure on a substrate. A seed layer is formed on the sacrificial structure. A bottom electrode is formed on the seed layer. A piezoelectric layer is formed on the bottom electrode. A top electrode is formed on the piezoelectric layer. The sacrificial structure is removed to form a cavity. The seed layer is etched through the cavity.
    Type: Application
    Filed: December 28, 2020
    Publication date: June 30, 2022
    Inventors: Kuo-Lung WENG, Chia-Ta CHANG, Tzu-Sheng HSIEH, Chun-Ju WEI
  • Patent number: 11249943
    Abstract: Technical solutions are described to implement a scalable write ahead log using a distributed file system. A general aspect includes a method for providing consistency among metadata replicas and content in an enterprise content management cluster. The method includes recording a transaction log entry in response to receiving a content modification request, the transaction log entry including a version identifier set to a first version value. The method also includes updating the transaction log entry to a second version value in response to successfully modifying content and one of a plurality of metadata replicas containing metadata corresponding to the request. The method also includes updating the transaction log entry to a third version value in response to successfully modifying each of the metadata replicas. The present document further describes examples of other aspects such as methods, computer products.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: February 15, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Li Mei Jiao, Yun Jie Qiu, James A. Reimer, Ju Wei Shi, Paul S. Taylor, Chen Wang, Xiao Yang Yang
  • Publication number: 20210373048
    Abstract: A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 2, 2021
    Applicant: MPI Corporation
    Inventors: TZU-YANG CHEN, CHIN-YI LIN, CHEN-RUI WU, SHENG-YU LIN, MING-TA HSU, CHIA-JU WEI
  • Patent number: 11143674
    Abstract: A probe head includes a linear probe which is flattened at least one of tail, body and head portions thereof and thereby defined with first and second width axes, along which each of the tail, body and head portions is defined with first and second widths, and upper and lower die units having upper and lower installation holes respectively, wherein the tail and head portions are inserted respectively, which are offset from each other along the second width axis so that the body portion is curved. The first and second widths of the body portion are respectively larger and smaller than the first and second widths of at least one of the tail and head portions. As a result, the probes of the same probe head are consistent in bending direction and moving behavior and prevented from rotation, drop and escape.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: October 12, 2021
    Assignee: MPI CORPORATION
    Inventors: Tzu Yang Chen, Chia Ju Wei
  • Patent number: 11137675
    Abstract: A method includes clamping a mask on a mask stage, in which the mask includes a multilayered magnetic film; performing a first lithography process by using the mask; moving the mask away from the mask stage; and determining whether a surface condition of a surface layer of the multilayered thin film is acceptable; and peeling the surface layer of the multilayered magnetic film from the multilayered magnetic film when the surface condition of the surface layer is determined as unacceptable.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung Liao, Ju-Wei Liao
  • Publication number: 20210295409
    Abstract: Systems and methods for substitute item selection are presented. The methods include providing for presentation first user interface data comprising item preference information representing a substitution preference of an item, a first user interface generated with the first user interface data being configured to receive a change command from a user, wherein the first user interface comprises a unified substitution preferences user interface available from a plurality of order building stages. The methods also include providing for presentation second user interface data in accordance with receiving the change command, a second user interface generated with the second user interface data being configured to present an item substitution suggestion, and to receive item substitution information. The methods also include receiving the item substitution information via the second user interface and storing the item substitution information in a data store.
    Type: Application
    Filed: March 18, 2020
    Publication date: September 23, 2021
    Inventors: Jason Rudmann, Tony Hon Kit Li, Damien Fitzpatrick, Donald Christopher Woods, Ju-wei Chen, Abbas Pirnia
  • Publication number: 20210281233
    Abstract: A bulk acoustic wave filter comprises a substrate, an insulating layer disposed on the substrate and having a first cavity and a second cavity formed therein, a first bulk-acoustic-wave-resonance-structure disposed on the first cavity and a second bulk-acoustic-wave-resonance-structure disposed on the second cavity. The first bulk-acoustic-wave-resonance-structure comprises a first bottom electrode disposed on the first cavity, a first top electrode disposed on the first bottom electrode, a first piezoelectric layer portion sandwiched between the first top electrode and the first bottom electrode, and a first frequency tuning structure disposed between the first cavity and the first bottom electrode. The second bulk-acoustic-wave-resonance-structure comprises a second bottom electrode disposed on the second cavity, a second top electrode disposed on the second bottom electrode, a second piezoelectric layer portion sandwiched between the second top electrode and the second bottom electrode.
    Type: Application
    Filed: May 26, 2021
    Publication date: September 9, 2021
    Inventors: CHIA-TA CHANG, CHUN-JU WEI, KUO-LUNG WENG
  • Patent number: 11093458
    Abstract: Methods and a system are provided. A method includes automatically detecting, by an attribute structural variation detector, attribute structural variations in record schemas of a database lacking schema enforcement. The automatically detecting step includes encoding, by an encoder, nodes in the record schemas based on respective updated node labels to obtain a plurality of codes. The encoding step comprises, for each of the plurality of codes: recording, by a label frequency counter, a frequency f1 of the record schemas that include a given label; and recording, by a label frequency counter, a frequency fc of the record schemas that use a given one of the plurality of codes to update a label of a next level. An attribute variation is detected and retrieved responsive to the frequency fc?0, and the frequency f1>(two times the frequency fc).
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 17, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Zhao Cao, Ju Wei Shi, Chen Wang, Lanjun Wang, Shuo Zhang
  • Patent number: 11070185
    Abstract: A method for forming cavity of bulk acoustic wave resonator comprising following steps of: forming a sacrificial epitaxial structure mesa on a compound semiconductor substrate; forming an insulating layer on the sacrificial epitaxial structure mesa and the compound semiconductor substrate; polishing the insulating layer by a chemical-mechanical planarization process to form a polished surface; forming a bulk acoustic wave resonance structure on the polished surface, which comprises following steps of: forming a bottom electrode layer on the polished surface; forming a piezoelectric layer on the bottom electrode layer; and forming a top electrode layer on the piezoelectric layer, wherein the bulk acoustic wave resonance structure is located above the sacrificial epitaxial structure mesa; and etching the sacrificial epitaxial structure mesa to form a cavity, wherein the cavity is located under the bulk acoustic wave resonance structure.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: July 20, 2021
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Chia-Ta Chang, Chun-Ju Wei, Kuo-Lung Weng
  • Patent number: 11003621
    Abstract: Technical solutions are described to implement a scalable write ahead log using a distributed file system. A general aspect includes a method for providing consistency among metadata replicas and content in an enterprise content management cluster. The method includes recording a transaction log entry in response to receiving a content modification request, the transaction log entry including a version identifier set to a first version value. The method also includes updating the transaction log entry to a second version value in response to successfully modifying content and one of a plurality of metadata replicas containing metadata corresponding to the request. The method also includes updating the transaction log entry to a third version value in response to successfully modifying each of the metadata replicas. The present document further describes examples of other aspects such as methods, computer products.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: May 11, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Li Mei Jiao, Yun Jie Qiu, James A. Reimer, Ju Wei Shi, Paul S. Taylor, Chen Wang, Xiao Yang Yang
  • Patent number: 10877382
    Abstract: A method for handling a mask is provided in accordance with some embodiments of the present disclosure. The method includes determining whether a particle is present on a contact surface of a mask. The mask is cleaned to remove the particle from the contact surface of the mask if the particle is present on the contact surface. The mask is disposed on a chuck after cleaning the mask, wherein the contact surface of the mask contacts the chuck when the mask is disposed on the chuck. A lithography process is performed using the mask disposed on the chuck.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: December 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ju-Wei Liao, Chi-Hung Liao
  • Patent number: 10831716
    Abstract: Method and apparatus for configuring relevant parameters of MapReduce applications. The method includes: receiving a request for processing a first MapReduce job; obtaining job feature attributes of historical MapReduce jobs; searching out a job feature attribute of a second MapReduce job associated with the first MapReduce job from within the job feature attributes of the historical MapReduce jobs; configuring relevant parameters of the first MapReduce job based on the job feature attribute of the second MapReduce job. According to this method of configuring parameters, network overheads of file transfer can be effectively reduced, the method of configuring parameters of the MapReduce job can be processed locally as much as possible, thereby effectively increasing system resource utilization while reducing the administrator's configuration burden. An apparatus for configuring relevant parameters of MapReduce application is also provided.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: November 10, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jie Liu, Ju Wei Shi, Chen Wang, Yong Zheng, Jia Zou
  • Publication number: 20200292580
    Abstract: A method for manufacturing probes includes forming a recessed portion on a plate such that the plate has a first subsidiary plate, a second subsidiary plate and a third subsidiary plate mutually connected. The first subsidiary plate has a first thickness. The second subsidiary plate corresponds to the recessed portion and has a second thickness. The first thickness is larger than the second thickness. The second subsidiary plate is located between the first subsidiary plate and the third subsidiary plate. The third subsidiary plate has a third thickness. The third thickness is larger than the second thickness. Subsequently, the plate is held and cut by laser to form a plurality of probes. Each of the probes includes a probe tail formed from the first subsidiary plate, a probe body formed from the second subsidiary plate and a probe tip formed form the third subsidiary plate.
    Type: Application
    Filed: December 30, 2019
    Publication date: September 17, 2020
    Inventors: Chia-Ju WEI, Tzu-Yang CHEN
  • Patent number: 10745564
    Abstract: The present disclosure discloses a dye for industrialization of dyeing cotton fiber in supercritical carbon dioxide that can react with cotton fiber, wherein a preparation method therefor comprises the following steps: dissolving a hydroxyl-containing natural dye in an organic solvent, dropwise adding an alcohol compound containing a halogen group into a reaction system in the presence of an acid-binding agent, precipitating the product with another solvent after the reaction is completed, and then filtrating and drying to obtain the compound described. The obtained compound is used for dyeing cotton fiber in supercritical carbon dioxide. The dye provided by the present disclosure is capable of dyeing cotton fiber in supercritical carbon dioxide conditions, and has a better color fastness while dyeing the cotton fiber.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: August 18, 2020
    Assignee: DALIAN POLYTECHNIC UNIVERSITY
    Inventors: Hongjuan Zhao, Laijiu Zheng, Huanda Zheng, Jun Yan, Xiaoqing Xiong, Miao Liu, Ju Wei