Patents by Inventor Ju-Wei LIAO

Ju-Wei LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11137675
    Abstract: A method includes clamping a mask on a mask stage, in which the mask includes a multilayered magnetic film; performing a first lithography process by using the mask; moving the mask away from the mask stage; and determining whether a surface condition of a surface layer of the multilayered thin film is acceptable; and peeling the surface layer of the multilayered magnetic film from the multilayered magnetic film when the surface condition of the surface layer is determined as unacceptable.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung Liao, Ju-Wei Liao
  • Patent number: 10877382
    Abstract: A method for handling a mask is provided in accordance with some embodiments of the present disclosure. The method includes determining whether a particle is present on a contact surface of a mask. The mask is cleaned to remove the particle from the contact surface of the mask if the particle is present on the contact surface. The mask is disposed on a chuck after cleaning the mask, wherein the contact surface of the mask contacts the chuck when the mask is disposed on the chuck. A lithography process is performed using the mask disposed on the chuck.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: December 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ju-Wei Liao, Chi-Hung Liao
  • Publication number: 20200057365
    Abstract: A method includes clamping a mask on a mask stage, in which the mask includes a multilayered magnetic film; performing a first lithography process by using the mask; moving the mask away from the mask stage; and determining whether a surface condition of a surface layer of the multilayered thin film is acceptable; and peeling the surface layer of the multilayered magnetic film from the multilayered magnetic film when the surface condition of the surface layer is determined as unacceptable.
    Type: Application
    Filed: December 6, 2018
    Publication date: February 20, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung LIAO, Ju-Wei LIAO
  • Publication number: 20200057385
    Abstract: A method for handling a mask is provided in accordance with some embodiments of the present disclosure. The method includes determining whether a particle is present on a contact surface of a mask. The mask is cleaned to remove the particle from the contact surface of the mask if the particle is present on the contact surface. The mask is disposed on a chuck after cleaning the mask, wherein the contact surface of the mask contacts the chuck when the mask is disposed on the chuck. A lithography process is performed using the mask disposed on the chuck.
    Type: Application
    Filed: December 11, 2018
    Publication date: February 20, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ju-Wei LIAO, Chi-Hung LIAO