Abstract: Integrated circuits include an integrated circuit substrate and a plurality of active regions and isolation regions in the integrated circuit substrate. A plurality of conductive and insulating layers are included on the integrated circuit substrate that define regions of high and low topography on the integrated circuit substrate. An underlying wiring layer is provided on the low topography region, but not on the high topography region. An overlying wiring layer is provided on the low topography region and on the high topography region. An insulating layer is provided between the underlying wiring layer and the overlying wiring layer. Memory integrated circuit, DRAM integrated circuit, MML integrated circuit and MDL integrated circuit embodiments may be provided.