Abstract: A binder solution for an all-solid-state battery, an electrode slurry for an all-solid-state battery including the same and a method of manufacturing an all-solid-state battery using the same, and more particularly to a binder solution for an all-solid-state battery, in which a polymer binder configured such that a non-polar functional group is bonded to the end of a polar functional group is used, whereby the polar functional group is provided by a deprotection mechanism of the polymer binder through a thermal treatment, thus increasing adhesion between electrode materials to thereby improve battery capacity and enabling a wet process to thereby reduce manufacturing costs, an electrode slurry for an all-solid-state battery including the same and a method of manufacturing an all-solid-state battery using the same.

Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.

Abstract: Disclosed is a method of removing lead materials from an anode for manufacturing copper foil to regenerate the anode. The method includes cleaning solution preparation, anode cleaning and anode washing. The cleaning solution preparation includes preparing a cleaning solution containing an aqueous solution of EDTA and citric acid. The cleaning solution used to perform the anode cleaning has a pH of 7 to 9 and a temperature of 20 to 50° C. The anode cleaning includes cleaning the anode by immersing the anode including the lead materials attached to the surface thereof in the cleaning solution to perform EDTA-Pb chelation. As a result, the transfer of the lead materials from the anode to the cleaning solution means substantial removal of the lead materials from the anode. The anode, from which the lead materials have been removed, is washed using a high-pressure washer.

Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.

Abstract: The present disclosure relates to a contact point monitoring device for a vacuum circuit breaker, and a correction method performed through same, wherein deviations due to temperature in a sensor for monitoring the amount of wear at a contact point may be compensated for. According to the present disclosure, the amount of wear at the contact point may be accurately detected by correcting a characteristic value of a photosensor according to operation temperature, by taking into consideration the temperature characteristics of the photosensor.

Abstract: A cathode for a lithium secondary battery includes a cathode current collector, and a cathode active material layer satisfying a specific formula formed on the cathode current collector. The cathode active material layer includes lithium metal oxide particles that have a single particle shape, and a single crystalline structure or a poly-crystalline structure including two or more single crystals. A lithium secondary battery including the cathode, and a method of preparing a cathode active material are also provided.

Abstract: Provided is a wafer exposure apparatus used in a semiconductor device manufacturing process, the exposure apparatus including: a reflective mirror for reflecting light provided from a light source; an optical path changer for changing a path of the light provided from the reflective mirror; first mirrors installed at both sides of the optical path changer to change the path of the light; second mirrors installed at both sides of a material to change the path of the light; and third mirrors installed at both sides of a mask to enter the light reflected by the first mirrors to the mask and to enter the light passed through the mask into the second mirrors, whereby it is possible to continuously expose one surface, both surfaces or a specific surface of a wafer in a state that the wafer is once aligned.

Abstract: Provided is a wafer exposure apparatus used in a semiconductor device manufacturing process, the exposure apparatus including: a reflective mirror for reflecting light provided from a light source; an optical path changer for changing a path of the light provided from the reflective mirror; first mirrors installed at both sides of the optical path changer to change the path of the light; second mirrors installed at both sides of a material to change the path of the light; and third mirrors installed at both sides of a mask to enter the light reflected by the first mirrors to the mask and to enter the light passed through the mask into the second mirrors, whereby it is possible to continuously expose one surface, both surfaces or a specific surface of a wafer in a state that the wafer is once aligned.