Patents by Inventor Ju Woong Park

Ju Woong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154231
    Abstract: A battery pack includes a plurality of battery modules, each battery module including: a cell stack that includes a plurality of battery cells arranged in a first direction; and a side cover disposed on at least one side of the cell stack; and a pack housing structured to accommodate the plurality of battery modules, wherein the side cover includes a body disposed at a side of the cell stack in the first direction; a first extension portion extending from the body in the first direction; and a second extension portion connected to the body and the first extension portion.
    Type: Application
    Filed: October 4, 2023
    Publication date: May 9, 2024
    Inventors: Min Song KANG, Ji Woong KIM, Byeong Jun PAK, Ju Yong PARK, Suk Ho SHIN, Jin Su HAN
  • Publication number: 20240143927
    Abstract: Provided are a method for generating a summary and a system therefor. The method according to some embodiments may include calculating a likelihood loss for a summary model using a first text sample and a first summary sentence corresponding to the first text sample, calculating an unlikelihood loss for the summary model using a second text sample and the first summary sentence, the second text sample being a negative sample generated from the first text sample, and updating the summary model based on the likelihood loss and the unlikelihood loss.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Applicants: SAMSUNG SDS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Sung Roh YOON, Bong Kyu HWANG, Ju Dong KIM, Jae Woong YUN, Hyun Jae LEE, Hyun Jin CHOI, Jong Yoon SONG, Noh II PARK, Seong Ho JOE, Young June GWON
  • Patent number: 11961867
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20240106027
    Abstract: Disclosed is a case for a battery module including a body having an internal space; and an end plate disposed on an end of the body, wherein the body includes a bottom plate on which a coolant flow path through which a coolant flows is formed, and wherein the end plate includes a coolant flow tube through which the coolant flows and a connection portion extending from the coolant flow tube and coupled to the coolant flow path.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 28, 2024
    Inventors: Suk Ho SHIN, Min Song KANG, Ji Woong KIM, Byeong Jun PAK, Ju Yong PARK, Jin Su HAN
  • Patent number: 11648988
    Abstract: The rear structure for vehicles includes: a rear floor; and a pair of oblique members coupled to a lower surface of the rear floor and configured to be symmetrical with each other about a longitudinal centerline of the rear floor, each oblique member of the pair of oblique members extending from a first side and a second side, respectively, of the rear floor to a rear portion of the rear floor.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: May 16, 2023
    Assignees: HYUNDAI MOTOR COMPANY, Kia Corporation
    Inventors: Sung Hun Kim, Ju Woong Park
  • Publication number: 20230088647
    Abstract: A rear structure of a vehicle includes: a rear floor, and a pair of diagonal members coupled to a bottom surface of the rear floor, extending obliquely from both sides of the rear floor to a rear side of the rear floor, and symmetrical with respect to a longitudinal centerline of the rear floor. The rear structure further includes a pair of side extensions coupled to the bottom surface of the rear floor at the both sides of the rear floor, respectively, and extending in a longitudinal direction of the rear floor. The rear structure includes a cross member disposed between the pair of side extensions at a rear bottom surface of the rear floor, and the cross member has both ends each spaced apart from a corresponding side extension.
    Type: Application
    Filed: November 30, 2022
    Publication date: March 23, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Sung Hun Kim, Sung Woo Kim, Ju Woong Park
  • Publication number: 20220204094
    Abstract: The rear structure for vehicles includes: a rear floor; and a pair of oblique members coupled to a lower surface of the rear floor and configured to be symmetrical with each other about a longitudinal centerline of the rear floor, each oblique member of the pair of oblique members extending from a first side and a second side, respectively, of the rear floor to a rear portion of the rear floor.
    Type: Application
    Filed: August 20, 2021
    Publication date: June 30, 2022
    Applicants: HYUNDAI MOTOR COMPANY, Kia Corporation
    Inventors: Sung Hun KIM, Ju Woong PARK
  • Patent number: 7878039
    Abstract: A channel letter bending machine for bending a return of a channel letter from a stock includes a feeding unit disposed along a path of travel of the stock to be bent for feeding the stock, a flanging unit for forming a flange along one edge of the stock, a notching unit for notching the flange of the stock fed by the feeding mechanism along the path of travel, and a bending unit for bending the stock under the control of the computer control system into the desired configuration for the channel letter shape, wherein the notching unit and the flanging unit are disposed upstream of the bending unit and the flanging unit is disposed upstream of the notching unit.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: February 1, 2011
    Assignee: SDS USA, Inc.
    Inventors: Ju Woong Park, Man Sik Cho, Sang Moo Lee, Byoung-Young Song
  • Publication number: 20090013747
    Abstract: A channel letter bending machine for bending a return of a channel letter from a stock includes a feeding unit disposed along a path of travel of the stock to be bent for feeding the stock, a flanging unit for forming a flange along one edge of the stock, a notching unit for notching the flange of the stock fed by the feeding mechanism along the path of travel, and a bending unit for bending the stock under the control of the computer control system into the desired configuration for the channel letter shape, wherein the notching unit and the flanging unit are disposed upstream of the bending unit and the flanging unit is disposed upstream of the notching unit.
    Type: Application
    Filed: September 22, 2008
    Publication date: January 15, 2009
    Inventors: Ju Woong Park, Man Sik Cho, Sang Moo Lee, Byoung-Young Song
  • Patent number: 7441434
    Abstract: A channel letter bending machine for bending a return of a channel letter from a stock includes a feeding unit disposed along a path of travel of the stock to be bent for feeding the stock, a flanging unit for forming a flange along one edge of the stock, a notching unit for notching the flange of the stock fed by the feeding mechanism along the path of travel, and a bending unit for bending the stock under the control of the computer control system into the desired configuration for the channel letter shape, wherein the notching unit and the flanging unit are disposed upstream of the bending unit and the flanging unit is disposed upstream of the notching unit.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: October 28, 2008
    Assignee: SDS USA, Inc.
    Inventors: Ju Woong Park, Man Sik Cho, Sang Moo Lee, Byoung-Young Song