Patents by Inventor Ju-Yeol Lee

Ju-Yeol Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12115886
    Abstract: A pre-active safety seat system applied to the vehicle implements a method for improving a pre-active safety seat speed, which confirms a risk region by matching a recline angle, a slide movement position, and a cushion tilt angle, which are detected from each of a plurality of sensors of a multi-seat sensor in a risk collision situation detected by a vehicle environment sensor of an ADAS, with a seat safety map, and combines and simultaneously controls a plurality of motors of a multi-seat motor configured for a seat target posture of a seat for converting the risk region into a safety region, by a controller, shortening a pre-active safety seat (PSS) required time of a seat target posture in the pre-active safety seat (PSS) operable section before collision of the vehicle from a risk detection.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: October 15, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Hyung-Joo Kim, Haeng-Kyeom Kim, Guk-Mu Park, Tae-Hoon Lee, Seung-Young Lee, Wook Jin, Eung-Man Kim, Dong-Woo Jeong, Ju-Yeol Kong
  • Publication number: 20240200111
    Abstract: Provided is a method for producing branched dextrin, the method comprising steps of: adding heat-resistant alpha-amylase to a starch suspension, heating the mixture at 85° C. to 115° C. to perform a liquefaction reaction, immediately heating the mixture at 125° C. to 145° C. to inactivate the heat-resistant alpha-amylase, and obtaining a liquefied starch solution including liquefied starch having a dextrose equivalent (DE) value of 2 to 10, and adding a branching enzyme to the liquefied starch solution in an amount of 0.6% (w/w) or more based on the dry weight of starch, proceeding with a branching reaction for 20 hour or more to generate branched dextrin, and then obtaining a solution with branched dextrin comprising branched dextrin having a dextrose equivalent (DE) value of 2 to 10 which stably controls the dextrose equivalent (DE) value of branched dextrin, and significantly suppresses the white turbidity that occurs during refrigeration.
    Type: Application
    Filed: October 1, 2021
    Publication date: June 20, 2024
    Applicant: DAESANG CORPORATION
    Inventors: Min Su KIM, Ju Yeol LEE, Han Joong RYU, Kyoung Ok PARK, Hak Jun KIM
  • Patent number: 7833297
    Abstract: Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: November 16, 2010
    Assignee: SKC Co., Ltd.
    Inventors: In-Ha Park, Ju-Yeol Lee, Sung-Min Jun
  • Publication number: 20090320379
    Abstract: There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130° C. or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.
    Type: Application
    Filed: July 20, 2007
    Publication date: December 31, 2009
    Inventors: Sung-Min Jun, Jong-Soo Lim, Seung-Hun Bae, Ju-Yeol Lee, In-Ha Park
  • Publication number: 20090077899
    Abstract: Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad.
    Type: Application
    Filed: July 19, 2006
    Publication date: March 26, 2009
    Inventors: In-Ha Park, Ju-Yeol Lee, Sung-Min Jun
  • Patent number: 7381121
    Abstract: Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine pores, it is possible to prevent permeation of polishing slurry and water and to avoid non uniformity of physical properties. Thereby, it is possible to lengthen the lifetime of the polishing pad.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: June 3, 2008
    Assignee: SKC Co., Ltd.
    Inventors: Eu-Gene Song, Ju-Yeol Lee, Sung-Min Kim, Jae-Seok Kim, Hyun-Woo Lee
  • Publication number: 20070254564
    Abstract: Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine pores, it is possible to prevent premeation of polishing slurry and water and to avoid nonuniformity of physical properties. Thereby, it is possible to lengthen the lifetime of the polishing pad.
    Type: Application
    Filed: February 16, 2005
    Publication date: November 1, 2007
    Applicant: SKC CO., LTD.
    Inventors: Eu-Gene Song, Ju-Yeol Lee, Sung-Min Kim, Jae-Seok Kim, Hyun-Woo Lee