Abstract: Provided is a display device. A display device includes a display area and a buffer area disposed around the display area, a pixel electrode disposed on a substrate and in the display area, a bank covering an edge of the pixel electrode, light emitting elements disposed on the pixel electrode and extending in a thickness direction of the substrate, and a buffer disposed on the substrate and in the buffer area. The bank and the buffer are disposed on a same layer.

Abstract: Provided is a multilayer adhesive tape having excellent step coverage and reworkability. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which the intermediate adhesive layer includes an intermediate adhesive polymer including: a polymerization unit of an alkyl group-containing (meth)acrylate monomer; a polymerization unit of a carboxyl group-containing monomer; and a polymerization unit of an acrylamide-based monomer.

Abstract: A multilayer adhesive tape in which an interface separation between layers does not occur even at in extremely low temperature atmosphere is provided. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which attaching force among the first outer adhesive layer, the intermediate adhesive layer, and the second outer adhesive layer is maintained after the multilayer adhesive tape is treated in liquefied nitrogen for 15 seconds.

Abstract: A multilayer adhesive tape exhibiting high step coverage and having both high reworkability and excellent punchability is provided. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which a glass transition temperature of the intermediate adhesive layer is ?40° C. or more and 0° C. or less, a glass transition temperature of each of the first outer adhesive layer and the second outer adhesive layer is ?60° C. or more and ?20° C. or less, and a difference in glass transition temperature between each of the first outer adhesive layer and the second outer adhesive layer and the intermediate adhesive layer is 5° C. or more and 25° C. or less.

Abstract: A multilayer adhesive tape in which an interface separation between layers does not occur even at in extremely low temperature atmosphere is provided. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which attaching force among the first outer adhesive layer, the intermediate adhesive layer, and the second outer adhesive layer is maintained after the multilayer adhesive tape is treated in liquefied nitrogen for 15 seconds.

Abstract: Provided is a multilayer adhesive tape having excellent step coverage and reworkability. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which the intermediate adhesive layer includes an intermediate adhesive polymer including: a polymerization unit of an alkyl group-containing (meth)acrylate monomer; a polymerization unit of a carboxyl group-containing monomer; and a polymerization unit of an acrylamide-based monomer.

Abstract: A multilayer adhesive tape exhibiting high step coverage and having both high reworkability and excellent punchability is provided. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which a glass transition temperature of the intermediate adhesive layer is ?40° C. or more and 0° C. or less, a glass transition temperature of each of the first outer adhesive layer and the second outer adhesive layer is ?60° C. or more and ?20° C. or less, and a difference in glass transition temperature between each of the first outer adhesive layer and the second outer adhesive layer and the intermediate adhesive layer is 5° C. or more and 25° C. or less.

Abstract: The present invention relates to an adhesive film for protecting a wafer including an adhesive layer formed on one surface of a substrate film. The present invention relates to an adhesive film for protecting the surface of a semiconductor wafer, wherein the surface film has a tensile strength of 2-10 kg/mm2 and an elongation until breakage of 50-200%, and the gel content of the adhesive layer is greater than or equal to 80%. The adhesive film for protecting the wafer maintains cutting ability and machinability, while preventing the generation of bending and wafer breaking phenomena due to the decrease of the wafer thickness. In addition, the adhesive film may not melt at high temperatures, and the yield while grinding the wafer may be increased.