Patents by Inventor Ju Yong SIM

Ju Yong SIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
    Publication number: 20240132441
    Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
    Type: Application
    Filed: July 29, 2022
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Nak Eun KO, Ju Yong SIM
  • LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
    Publication number: 20240133039
    Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
    Type: Application
    Filed: July 29, 2022
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Nak Eun KO, Ju Yong SIM
  • METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME
    Publication number: 20240015885
    Abstract: The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.
    Type: Application
    Filed: December 10, 2021
    Publication date: January 11, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Myong Hwan PARK, Nak Eun KO, Ju Yong SIM