Abstract: A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to the wires through the holes, a buffer layer covering the LED chip, and an optical layer that is disposed on the buffer layer and has an optical pattern formed at a portion of the optical layer corresponding to the LED chip.

Abstract: A display device includes an optical module, a receiving container and a display panel. The optical module includes a substrate, point light sources and an optical lens. The point light sources are disposed on the substrate, each of which generates light using power applied thereto through the substrate. The optical lens includes a first lens part having a receiving part receiving each of the point light sources, a second lens part disposed at a peripheral portion of the first lens part and having a different shape from that of the first lens part, and a connecting part connecting the first and second lens parts. The light from each of the point light sources sequentially passes through the first lens part and the second lens part. The receiving container receives the optical module. The display panel displays an image using the light. Thus, optical luminance and optical luminance uniformity of an image display panel are improved.

Abstract: A conductive bump including a plurality of protrusion members (251) and a conductive layer (252) formed on the protrusion members is disposed on a TFT substrate (200). Each of the protrusion members is disposed on an electrode pad (270y, b, 280c, b) in a pad region (292, 293) of the TFT substrate, and the conductive layer is electrically connected to the electrode pad. A non-conductive resin (600) is disposed on the conductive bump, and a driving IC (500) is thermally compressed on the conductive bump. Therefore, the electrical contact characteristic between the driving IC and the electrode pad is improved.

Abstract: A cooling apparatus comprises a casing, a heat sink and a cooling fan. The casing comprises a first opening and a second opening to provide an air path. The heat sink is received in the casing. The heat sink includes a recession part. The cooling fan is disposed in the recession part.

Abstract: A light generating device including a circuit board, and a plurality of light source groups provided on the circuit board, each of the light source groups comprising three main light sources and at least one sub light source emitting light having a peak wavelength that is different from a peak wavelength of each of the main light sources.

Abstract: A light emitting diode includes a lens, a chip base attached to a bottom of the lens, and an LED chip attached in the chip base to be concentric with the lens. The lens includes a bottom, an outer sidewall extending from the bottom, a first outer top surface extending from the outer sidewall, a second outer top surface extending from the first outer top surface and having a substantially conical groove-like shape, an inner sidewall forming a side of a central cavity formed by hollowing a central portion of the bottom, and an inner top surface extending from the inner sidewall and forming a ceiling of the central cavity. The substantially conical groove-like shaped second outer top surface has an angular point formed toward the central cavity, and the inner top surface is convexly formed toward the bottom.

Abstract: A lens for a light emitting diode is formed with a material having a refractive index of n, and the lens includes a base, a first curved circumferential surface extending from the base, a curved center-edge surface extending from the first curved circumferential surface, and a curved centermost surface extending from the curved center-edge surface. The base includes a groove for receiving a light emitting chip therein. In the lens, a distance from a center of the base to a point of the curved center-edge surface is always shorter than the radius of curvature for the point of the curved center-edge surface. The curved centermost surface has a concave shape with respect to the base.

Abstract: A light-generating device includes a driving substrate and a plurality of light source arrays. The driving substrate has a rectangular planar shape. The plurality of light source arrays is formed on the driving substrate. The light source arrays include at least one light emitting diode to generate light in response to power being applied through the substrate, and the light source arrays are spaced apart from each other. Thus, heat generated from the light-generating device is rapidly dissipated from the light-generating device, improving brightness of the light, brightness uniformity of the light and color reproducibility of the light.

Abstract: A power supply includes a light source, a signal converting unit converting an externally supplied AC voltage into a DC voltage, a DC-DC converting unit converting a magnitude of the DC voltage, and a light source protecting unit. The light source protecting unit outputs the DC voltage of a predetermined range as a light source driving voltage to supply a stabilized source driving voltage to the light source and suspending an application of the light source driving voltage to the light source when a magnitude of the light source driving voltage is larger than a predetermined value, based on an externally supplied control signal.

Abstract: A power supply is provided, which includes a DC-DC converter being supplied with an external DC input voltage and a first switching control signal and outputting a duty sensing signal of which a magnitude is varied in accordance with the first switching control signal, the duty sensing signal being indicative of a duty ratio of the first switching control signal, and the DC-DC converter converting the input voltage into a DC output voltage of a predetermined magnitude based on the first switching control signal; and a feedback controlling unit comparing the duty sensing signal with a first reference signal to adjust the duty ratio of the first switching control signal.

Abstract: A backlight for a display device includes a board, a plurality of light emitting diodes (LEDs) mounted on the board, and a light guiding plate that is provided on the LEDs and has light reflecting grooves formed directly on respective LEDs. The light reflecting grooves are formed at an upper surface of the light guiding plate, having a shape of a reversed cone. In this backlight, the light traveling directly upward from the LED is efficiently reflected by total internal reflection and then recycled, resulting in a uniform light distribution of the backlight.

Abstract: A light source for a display device includes a board and light emitting diodes mounted on the board. The light emitting diodes include a white light emitting diode which emits white light and a red light emitting diode which emits red light.

Abstract: A driver chip includes a base body, an input terminal section and a first output terminal section. The base body includes a face having a long side and a short side. The input terminal section is formed at a first edge portion of the face along the long side. The first output terminal section is formed at a second edge portion that is opposite to the first edge portion. The input terminal section and the first output terminal section are disposed within about 9d/10 from a center of the long side toward the short side, wherein ‘d’ represents a distance between the center of the long side and the short side. The input and first output terminals formed on other region than an edge portion of a base body, on which stress is concentrated, enhance a reliability of electric connection between the driver chip and a display panel.

Abstract: In an anisotropic conductive film including conductive particles, and a bump, and a packaging structure of a semiconductor chip having the anisotropic conductive film and the bump, the anisotropic conductive film includes a resin layer and the conductive particles. The anisotropic conductive film electrically connects an electrode of a substrate and the bump of a semiconductor chip. A volume ratio of the conductive particles to the resin layer is about 0.1 to about 0.12. A number of the conductive particles per m3 is about 4 millions to about 7 millions. A standard deviation of heights of the bumps is no more than about 0.25. An interval between each of the bumps and an electrode of the substrate is no more than about 1.3 ?m. Therefore, the size of each of the conductive particles is optimized so that a failure probability of the open circuit is decreased.

Abstract: A driver chip includes a base body, input terminals, first output terminals and dummy terminals. The base body includes a face having first to fourth edge portions. The first and second edge portions are disposed in substantially parallel along a longitudinal side of the face, and the third and fourth edge portions are disposed in substantially parallel along a horizontal side of the face. The input terminals are formed on the first edge portion such that the input terminals are arranged along the longitudinal side. The first output terminals are formed on the second edge portion such that the first output terminals are arranged along the longitudinal side. The dummy terminals are formed such that the dummy terminals are disposed between the input terminals and the first output terminals. A warpage and defects of electrical connection between the driver chip and a display panel of the display apparatus are prevented.

Abstract: A lamp assembly for a liquid crystal display device includes a lamp tube for generating light, and electrodes each having a suitable shape for receiving end portions of the lamp tube. The lamp tube and the electrodes are combined to generate the light by applying electric power to the electrodes. The lamp assembly may include multiple lamp tubes having different brightness from each other, in which the brightness difference between the lamp tubes is compensated by uniformly diffusing the light generated from the lamp tubes.

Abstract: A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being arranged in a plurality of rows along the longitudinal direction of the base body. A plurality of conductive wirings is formed over the top face of the base body that electrically connects the driver circuit to the plurality of conductive bumps.

Abstract: In a drive IC and a display device having the same, the drive IC includes a plurality of bumps disposed on a lower surface of the drive IC and aligned in a plurality of rows along an edge of the drive IC. The bumps aligned in different rows from each other are juxtaposed in a direction perpendicular to a direction in which the bumps are aligned. Accordingly, when the drive IC is mounted on a display panel using an anisotropic conductive film, the anisotropic conductive film may be smoothly flowed through a space defined by the bumps of the drive IC, thereby improving electric properties of the drive IC and display device.

Abstract: Disclosed are a displaying substrate and a liquid crystal display device having the same. A pad portion formed on the displaying substrate has a plurality of via holes for exposing a pad metal layer. A width of the via hole is smaller than a diameter of a conductive particle. Where the width of the via hole is larger than the diameter of the conductive particle, a depth of the via hole is smaller than the diameter of the conductive particle. Thus, a driving failure which may occur in the pad portion is prevented while maintaining a deformation ratio of the conductive particle at about 20˜60%, thereby enhancing a connecting force between the pad portion and a circuit substrate.

Abstract: Disclosed are a displaying substrate and a liquid crystal display device having the same. A pad portion formed on the displaying substrate has a plurality of via holes for exposing a pad metal layer. A width of the via hole is smaller than a diameter of a conductive particle. Where the width of the via hole is larger than the diameter of the conductive particle, a depth of the via hole is smaller than the diameter of the conductive particle. Thus, a driving failure which may occur in the pad portion is prevented while maintaining a deformation ratio of the conductive particle at about 20˜60%, thereby enhancing a connecting force between the pad portion and a circuit substrate.