Patents by Inventor Ju Zeng

Ju Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11029260
    Abstract: A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: June 8, 2021
    Assignees: HONGFUJIN PRECISION ELECTRONICS (CHENGDU) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zi-Qing Xia, Xiao-Lei Liu, Min Chen, Yi-Kun Wang, Fu-Ju Zeng
  • Publication number: 20200292471
    Abstract: A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.
    Type: Application
    Filed: April 30, 2019
    Publication date: September 17, 2020
    Inventors: ZI-QING XIA, XIAO-LEI LIU, MIN CHEN, YI-KUN WANG, FU-JU ZENG
  • Patent number: 7938658
    Abstract: The card edge connector includes: an electrical receptacle formed with an abutting surface; two fasteners pivoted to the electrical receptacle, wherein each of the fasteners is formed with a snap-fitting surface that makes contact with the fastened surface to form a fastening area, the fastening area has a contact point that is closest to a central perpendicular line of the electrical receptacle, and the contact point has a first distance from the central perpendicular line; and wherein each of the fasteners is provided with an abutting portion, and when the abutting portion abuts against the abutting surface correspondingly, an abutting area is formed which has an abutting point that is closest to the central perpendicular line of the electrical receptacle, and the abutting point has a second distance from the central perpendicular line that is less than the first distance.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: May 10, 2011
    Assignee: Lotes Co., Ltd.
    Inventors: Xian Ju Zeng, Yong Fu Wang
  • Patent number: D1047105
    Type: Grant
    Filed: April 8, 2024
    Date of Patent: October 15, 2024
    Inventor: Ju Zeng
  • Patent number: D1072219
    Type: Grant
    Filed: September 9, 2024
    Date of Patent: April 22, 2025
    Inventor: Ju Zeng