Patents by Inventor Juan A. Maez

Juan A. Maez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic package and method of manufacturing same
    Publication number: 20110108999
    Abstract: A microelectronic package comprises a die (210) having attached thereto a first plurality of electrically conductive pads (211). The microelectronic package further comprises a first layer (220) and a second layer (130). The first layer has a first plurality of electrically conductive vias (121) electrically connected to one of the first plurality of electrically conductive pads. The second layer comprises a second plurality of electrically conductive pads (131) located around a perimeter (135) of the second layer and a plurality of electrically conductive traces (132) electrically connected to one of the first plurality of electrically conductive vias and to one of the second plurality of electrically conductive pads. The microelectronic package also comprises a plurality of wirebonds (240), each one of which is electrically connected to one of the second plurality of electrically conductive pads.
    Type: Application
    Filed: November 6, 2009
    Publication date: May 12, 2011
    Inventors: Ravi K. Nalla, Juan A. Maez, Mathew J. Manusharow