Abstract: A laser diode or laser diode bar mounted on a heat sink and having an insulating layer of greater thickness also mounted on the heat sink requires a lead overlying both the insulating layer and the diode to bend downward for making electrical contact. Failures have been found to occur at the bend. The provision of a pattern of slots at the bend alleviates the problem by reducing stress there. The use of such slotted leads is disclosed for diodes or diode bars individually or in a stack arrangement.

Abstract: Diffusion bonding techniques are extended to the simultaneous bonding of an array of multilevel piece parts. The problems of uneven expansion and contraction of different levels of different piece parts in the array are obviated by positioning each level of the array within a frame. The stack of frames is pinned in one corner. The opposite corner of the array has a slot at a 45° angle with respect to the x and y axes of the array. The slot engages a pin and allows the entire array to expand and contract along the slot in a manner to maintain the registration of features between respective levels of each piece part.