Abstract: The present disclosure relates to methods of determining complementarity scores of antigen-binding proteins and proteins associated with cancers and uses thereof for diagnosing and treating cancers and for screening antigens and antigen-binding proteins.

Abstract: The present concepts may automate and optimize deployment to a cloud computing fleet. Artificial intelligence and/or optimization algorithms may be used to find optimal deployment parameters (e.g., deployment order of computers in the fleet) that minimize deployment time and minimize deployment risk. For example, machine-learning prediction models may be used to generate a shortest path graph problem models a deployment planning problem. Then, optimization algorithms may be used to efficiently find approximations of Pareto-optimal solutions to the shortest path graph problem. Depending on the preferred level of time and risk, one of the solutions may be used to run the deployment.

Abstract: A method for separating integrated circuit dies from a wafer includes making at least two cutting passes with a laser along a first die street of an integrated circuit die, the first die street extending along a first axis on the wafer. The method also includes making at least two cutting passes with the laser along a second die street of the integrated circuit die, the second die street extending along a second axis on the wafer that is generally perpendicular to the first axis. In one process, three cutting passes are made with the laser alternatingly along the first and second die streets to separate the integrated die circuit along the first and second axes. In another process, two cutting passes are made with the laser along the first die street in opposite directions, and two cutting passes are then made with the laser along the second die street in opposite directions.

Abstract: A method for separating integrated circuit dies from a wafer includes making at least two cutting passes with a laser along a first die street of an integrated circuit die, the first die street extending along a first axis on the wafer. The method also includes making at least two cutting passes with the laser along a second die street of the integrated circuit die, the second die street extending along a second axis on the wafer that is generally perpendicular to the first axis. In one process, three cutting passes are made with the laser alternatingly along the first and second die streets to separate the integrated die circuit along the first and second axes. In another process, two cutting passes are made with the laser along the first die street in opposite directions, and two cutting passes are then made with the laser along the second die street in opposite directions.

Abstract: The present concepts may automate and optimize deployment to a cloud computing fleet. Artificial intelligence and/or optimization algorithms may be used to find optimal deployment parameters (e.g., deployment order of computers in the fleet) that minimize deployment time and minimize deployment risk. For example, machine-learning prediction models may be used to generate a shortest path graph problem models a deployment planning problem. Then, optimization algorithms may be used to efficiently find approximations of Pareto-optimal solutions to the shortest path graph problem. Depending on the preferred level of time and risk, one of the solutions may be used to run the deployment.

Abstract: The disclosed arterial chambers for hemodialysis may include a cap with a blood inlet port for conveying an intended patient's blood into the arterial chamber, an auxiliary port configured to provide fluid access to the arterial chamber, and a needleless access port configured to couple to a needleless syringe. The needleless access port may be configured for administering a substance to an interior of the arterial chamber from the needleless syringe and/or for withdrawing blood from the interior of the arterial chamber into the needleless syringe. Various tubing sets, hemodialysis systems, and other components, systems, and methods are also disclosed.

Abstract: A user-operated apparatus comprising of a body which holds a Raulerson syringe and contains a trigger mechanism to pull the plunger end of the Raulerson syringe to aspirate contents, all of which can be held and controlled with a single hand, and a mechanism housing a controller board, electrical circuit, and gears that allows for loading the guide wire into the Raulerson syringe.

Abstract: The disclosed arterial chambers for hemodialysis may include a cap with a blood inlet port for conveying an intended patient's blood into the arterial chamber, an auxiliary port configured to provide fluid access to the arterial chamber, and a needleless access port configured to couple to a needleless syringe. The needleless access port may be configured for administering a substance to an interior of the arterial chamber from the needleless syringe and/or for withdrawing blood from the interior of the arterial chamber into the needleless syringe. Various tubing sets, hemodialysis systems, and other components, systems, and methods are also disclosed.

Abstract: The disclosed flexible medical containers may include a substantially transparent bag including a cavity sized and configured to contain a medical substance, at least one port in fluid communication with the cavity, and at least one hanger hole sized and shaped for suspending the flexible medical container from a hanger. The hanger hole may be at least partially surrounded by a colored material to provide visible contrast between the colored material and the hanger hole. In some disclosed examples, the flexible medical containers may include one or more digit holes adjacent to the hanger hole to facilitate lifting and holding the flexible medical containers. Various other flexible medical containers, systems, and methods are also disclosed.

Abstract: A method for separating integrated circuit dies from a wafer includes making at least two cutting passes with a laser along a first die street of an integrated circuit die, the first die street extending along a first axis on the wafer. The method also includes making at least two cutting passes with the laser along a second die street of the integrated circuit die, the second die street extending along a second axis on the wafer that is generally perpendicular to the first axis. In one process, three cutting passes are made with the laser alternatingly along the first and second die streets to separate the integrated die circuit along the first and second axes. In another process, two cutting passes are made with the laser along the first die street in opposite directions, and two cutting passes are then made with the laser along the second die street in opposite directions.