Patents by Inventor Juan Carlos Gonzales Perez

Juan Carlos Gonzales Perez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemically enhanced focused ion beam micro-machining of copper
    Publication number: 20040056249
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Application
    Filed: September 26, 2003
    Publication date: March 25, 2004
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Chemically enhanced focused ion beam micro-machining of copper
    Patent number: 6645872
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: November 11, 2003
    Assignee: North Carolina State University
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Chemically enhanced focused ion beam micro-machining of copper
    Publication number: 20030060048
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by,decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Application
    Filed: October 31, 2002
    Publication date: March 27, 2003
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Chemically enhanced focused ion beam micro-machining of copper
    Patent number: 6514866
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: February 4, 2003
    Assignee: North Carolina State University
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Chemically enhanced focused ion beam micro-machining of copper
    Publication number: 20020094694
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Application
    Filed: May 31, 2001
    Publication date: July 18, 2002
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez