Abstract: Systems and methods of determining bond wire failures are provided. In particular, data indicative of a first resistance of a first bond wire set associated with a first semiconductor device on a power semiconductor module can be obtained. In addition, data indicative of a second resistance of a second bond wire set associated with a second semiconductor device on the power semiconductor module can be obtained. A bond wire failure can then be determined in the first bond wire set or the second bond wire set based at least in part on the data indicative of the first resistance of the first bond wire set and the data indicative of the second resistance of the second bond wire set.

Abstract: Systems and methods of determining bond wire failures are provided. In particular, data indicative of a first resistance of a first bond wire set associated with a first semiconductor device on a power semiconductor module can be obtained. In addition, data indicative of a second resistance of a second bond wire set associated with a second semiconductor device on the power semiconductor module can be obtained. A bond wire failure can then be determined in the first bond wire set or the second bond wire set based at least in part on the data indicative of the first resistance of the first bond wire set and the data indicative of the second resistance of the second bond wire set.