Patents by Inventor Juan Gabriel Cevallos Palomeque

Juan Gabriel Cevallos Palomeque has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11817371
    Abstract: Semiconductor packages including a computing device with a heat source, and related devices and methods, are disclosed herein. For example, the computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: November 14, 2023
    Assignee: Intel Corporation
    Inventors: Brian S. Jarrett, Joseph Andrew Broderick, Juan Gabriel Cevallos Palomeque
  • Publication number: 20200098665
    Abstract: Embodiments may relate a computing device with a heat source. The computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source. Other embodiments may be described or claimed.
    Type: Application
    Filed: September 26, 2018
    Publication date: March 26, 2020
    Applicant: Intel Corporation
    Inventors: Brian S. Jarrett, Joseph Andrew Broderick, Juan Gabriel Cevallos Palomeque