Patents by Inventor Juan Hajdu

Juan Hajdu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the treatment of copper oxide in the preparation of printed circuit boards
    Patent number: 4717439
    Abstract: A composition and process is disclosed for improving the leach resistance of the copper oxide coating on the copper circuitry of printed circuit boards to solutions used in their preparation which comprises contacting the copper oxide of the circuit board with a solution containing an amphoteric element which forms an acidic oxide, such as selenium dioxide.
    Type: Grant
    Filed: October 24, 1985
    Date of Patent: January 5, 1988
    Assignee: Enthone, Incorporated
    Inventors: Juan Hajdu, Martin W. Bayes
  • Solar collector having selective film of improved stability to liquid water condensate
    Patent number: 4074706
    Abstract: Solar collector including a copper or copper alloy base and a selective solar heat energy-absorptive coating or film of improved stability to liquid water on the base. The selective film is characterized by having a solar absorptivity of 0.90 or higher, infrared emissivity no more than 0.20, and a stability such that its selectivity is not significantly reduced after contact with liquid water condensate over a prolonged, cumulative, non-continuous time in excess of 15,000 hours.
    Type: Grant
    Filed: July 30, 1975
    Date of Patent: February 21, 1978
    Assignee: Enthone, Incorporated
    Inventors: Juan Hajdu, Raymond A. Sosnowski
  • Activation of surfaces intended for electroless plating
    Patent number: 3976816
    Abstract: Surfaces intended to be electrolessly metal plated, for instance the surfaces of through holes on through hole printed circuit boards, are treated with a colloidal catalyst metal-free acid liquid solution of a soluble, lower alkanol-modified noble metal-tin chloride complex until the surface is rendered catalytic. The noble metal of the complex is a noble metal which is catalytic to the deposition of the metal destined to be electrolessly plated on the surface.
    Type: Grant
    Filed: January 8, 1975
    Date of Patent: August 24, 1976
    Assignee: Enthone, Incorporated
    Inventors: Earl J. Fadgen, Jr., Juan Hajdu