Abstract: Methods and systems for refilling a container during an endoscopic procedure. An illustrative reservoir may be placed in selective fluid communication with a water bottle. The water bottle may form a fluid tight seal with the reservoir to transfer water from the water bottle to the reservoir.

Abstract: Following this procedure for the production of thermoplastic elastomer mixtures, dynamic vulcanization is performed at temperatures ranging between approximately 125 and 250 deg. C. and preferably between 150 and 200 deg. C., and with the aid of a free radical generating agent, on a mixture made up of: a) 95-60% by weight of one or several thermoplastic block copolymers of a monoalkenylarene and a coupled diene having at least two end blocks of monoalkenylarene polymer A and at least one middle block of a polymer of coupled diene O the content of said block A ranging between approximately 8 and 55% by weight respect to the copolymer, whose flow rate must exceed 0.01 and b) 5-40% by weight of one or several copolymers of ethylene and vinyl acetate, containing approximately between 5 and 50% by weight of vinyl acetate, preferably between 15 and 35% of vinyl acetate and with a flow rate between approximately 0.1 and 50, preferably between 0.1 and 10.

Abstract: A heat dissipating pad or support member for mounting a semiconductor device in an electrical circuit has a metal core with a relatively low coefficient of thermal expansion preferably lower than that of the semiconductor device and has a thermally conducting, corrosion resistant metal coating with relatively greater thermal conductivity than the core. The thermally conducting coating is metallurgically bonded to top, bottom and two lateral surfaces of the core with a selected thickness to cooperate with the core in providing an outer surface portion of the member over the top of the core having an effective coefficient of thermal expansion substantially corresponding to the semiconductor device to reliably mount the semiconductor device thereon.