Abstract: Hangers and hanging systems for hanging a fluid reservoir relative to an endoscope cart. An illustrative hanger may comprise a generally planar base plate and an arched member extending from an upper surface of the base plate. The arched member may include a first generally “U” shaped region and a second generally “U” shaped region. At least one arm may extend from the arched member, the at least one arm configured to receive a tubing. The second generally “U” shaped region may be configured to receive a portion of a fluid reservoir.

Abstract: Devices, systems, and methods for a suction valve assembly for a medical device. The suction valve assembly includes a valve body, a sliding shaft, and a shaft seal. The valve body has central channel extending vertically between a vent opening in the top and a working opening in the bottom and a side channel extending from the central channel to the side surface. A plurality of vertical recesses in the central channel extend from the top of the valve body, having bottoms above the side channel. The shaft seal is attached to the exterior surface of the sliding shaft and moves to seat against the recess bottoms to obstruct air flow between the side channel and the vent opening.

Abstract: Devices, systems, and methods for a suction valve assembly for a medical device. The suction valve assembly includes a cylindrical valve body, a valve cap, a sliding shaft, and a lower seal. The valve body has a vent opening at the top, a working opening in at bottom, and a suction source opening in the side surface. The valve cap, sliding shaft, and lower seal move vertically relative to the valve body between an upper position, where the lower seal is seated against the valve body and obstructs the working opening, and a lower position, wherein the lower seal is below the working opening and allows suction through the suction source opening.

Abstract: A biopsy cap may be operatively connected to a port of a medical device. The biopsy cap seals a working channel that is configured to allow the passing of different diameter devices. During endoscopy procedures, the tip of many devices, such as guidewires and catheters, may be wetted before use to avoid excessive dragging forces when inserting such devices through the working channel of the endoscope. A cap system comprising a cap for a port of a first medical device; and a wetting device configured to couple to a portion of the cap and wet a second medical device passing through the cap system.

Abstract: A valve assembly with improved sealing. The valve assembly may be configured for use as a suction valve assembly. The valve assembly includes a valve well, and a valve shaft movable with respect to the valve well to shift the valve assembly between off and on configurations. A cylindrical sealing member is circumferentially positioned about the valve shaft to seal around a transverse port extending transversely through the valve shaft and in fluid communication, via a channel within the valve shaft, with an axial port at an end of the valve shaft. The cylindrical seal member seals the transverse port of the valve shaft (and a transverse valve well port in fluid communication therewith) from fluid communication with the axial port of the valve shaft (and an axial valve well port in fluid communication therewith) when the valve shaft assembly is within the valve well.

Abstract: Methods and systems for refilling a container during an endoscopic procedure. An illustrative reservoir may be placed in selective fluid communication with a water bottle. The water bottle may form a fluid tight seal with the reservoir to transfer water from the water bottle to the reservoir.

Abstract: A heat dissipating pad or support member for mounting a semiconductor device in an electrical circuit has a metal core with a relatively low coefficient of thermal expansion preferably lower than that of the semiconductor device and has a thermally conducting, corrosion resistant metal coating with relatively greater thermal conductivity than the core. The thermally conducting coating is metallurgically bonded to top, bottom and two lateral surfaces of the core with a selected thickness to cooperate with the core in providing an outer surface portion of the member over the top of the core having an effective coefficient of thermal expansion substantially corresponding to the semiconductor device to reliably mount the semiconductor device thereon.