Patents by Inventor Juan M. Ramos

Juan M. Ramos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Highly configurable and modular high-speed connector system
    Patent number: 11973296
    Abstract: A shielded modular connector system includes a first portion having a first housing and a plurality of first contact modules, the first housing including a first interface surface and a first interface perimeter surrounding the first interface surface, a first plurality of bays to receive the plurality of first contact modules, and a grounding ring. The system further includes a second portion configured to mate with the first portion, and having a second housing and a plurality of second contact modules. The second housing includes a second interface surface and a second interface perimeter surrounding the second interface surface and designed to face the first interface surface, a second plurality of bays configured to receive the plurality of second contact modules, and a backshell located along at least a portion of the second interface perimeter and extending away from the second interface surface.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: April 30, 2024
    Assignee: SMITHS INTERCONNECT AMERICAS, INC.
    Inventors: Robert Milligan, Juan M. Ramos, Richard Johannes
  • HIGHLY CONFIGURABLE AND MODULAR HIGH-SPEED CONNECTOR SYSTEM
    Publication number: 20210175668
    Abstract: A shielded modular connector system includes a first portion having a first housing and a plurality of first contact modules, the first housing including a first interface surface and a first interface perimeter surrounding the first interface surface, a first plurality of bays to receive the plurality of first contact modules, and a grounding ring. The system further includes a second portion configured to mate with the first portion, and having a second housing and a plurality of second contact modules. The second housing includes a second interface surface and a second interface perimeter surrounding the second interface surface and designed to face the first interface surface, a second plurality of bays configured to receive the plurality of second contact modules, and a backshell located along at least a portion of the second interface perimeter and extending away from the second interface surface.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 10, 2021
    Applicant: SMITHS INTERCONNECT AMERICAS, INC.
    Inventors: Robert Milligan, Juan M. Ramos, Richard Johannes