Abstract: Two related miniature components are attached to opposite sides of an insulating base member. There are conductive pads and through-holes in the base member. The conductive areas on each component are wire-bonded to adjacent conductive areas on the base member. Some of the latter are coupled to the bottom surface of the assembly but the connections between the two components are made via metallization in the through-holes. Insulating covers seal each side of the assembly and the entire assembly may be reflow soldered to external circuitry.

Abstract: An improved housing assembly for housing miniaturized electrical or electronic apparatus, such as a radio receiver or monitor, is disclosed wherein a single piece housing is provided, open at the top for receiving an associated electrical chassis with self-contained battery compartment and a sound transducer. A control panel attached to the electrical chassis cooperates to overfit the open end of said housing to complete the overall assembly. The assemblage of the housing apparatus requires no screws, fasteners or special tools as the respective component parts effect a snap-fit with one another. A novel interlocking arrangement between chassis assembly and housing disguises the latching interfit therebetween, which nevertheless may be released by the insertion of a simple blade tool at the proper location. Complete shock mounting and protection from dust and dirt is effected by resilient gasket elements in cooperation with the housing and chassis assembly.