Abstract: Embodiments disclosed herein include multi-die packages with interconnects between the dies. In an embodiment, an electronic package comprises a package substrate, and a first die over the package substrate. In an embodiment, the first die comprises a first IO bump map, where bumps of the first IO bump map have a first pitch. In an embodiment, the electronic package further comprises a second die over the package substrate. In an embodiment, the second die comprises a second IO bump map, where bumps of the second IO bump map have a second pitch that is different than the first pitch. In an embodiment, the electronic package further comprises interconnects between the first IO bump map and the second IO bump map.

Abstract: Examples of methods are described herein. In some examples, a method includes determining a first portion within a build volume. In some examples, the method includes packing first objects in the first portion. In some examples, the method includes packing using a genetic procedure. In some examples, the method includes packing, using the genetic procedure, second objects in the build volume.

Abstract: Provided herein are compounds, such as compounds of Formula (I), Formula (I-A), Formula (I-B), or pharmaceutically acceptable salts of any one there, useful for modulating KRAS GD12 and/or other G12 mutants.

Abstract: Systems and methods of predicting temperature during a build of a three-dimensional (3D) part include determining a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file, and adjusting a process parameter of the build based on the determined temperature.

Abstract: According to examples, a processor may identify locations on a digital 3D model of an object corresponding to positions at which features are to be added to the object. For each of a plurality of locations of the identified locations, the processor may identify displacements of each of a plurality of patch points around the location from the surface of the digital 3D model. The processor may also create a map of the digital 3D model that encodes the identified displacements of the patch points around the locations, in which a 3D fabrication system is to fabricate the object to include the plurality of features based on the digital 3D model and the created map.

Abstract: Methods, apparatuses, systems, computer readable media, and a computer product for detecting a gas leak of a gas tank. In a method, at least one inside temperature is determined for the gas tank based on a plurality of outside temperatures that are collected outside the gas tank, the at least one inside temperature being estimated for at least one inside position within the gas tank during an operation of the gas tank. A gas pressure within the gas tank under a standard temperature is obtained based on the at least one inside temperature. The gas leak of the gas tank is detected based on the gas pressure.

Abstract: Embodiments herein may relate to a die for use in a multi-die package. The die may include clock circuitry that is able to identify a phase of a data signal to be transmitted and a phase of a clock signal to be transmitted on a die-to-die (D2D) link. The clock circuitry may further be configured adjust the phase of the clock signal such that the phase of the clock signal is approximately 90 degrees from the phase of the data signal such that the clock signal and the data signal are received by a receiver die of the D2D link with a 90 degree phase difference. Other embodiments may be described and claimed.

Abstract: Embodiments disclosed herein include multi-die packages with interconnects between the dies. In an embodiment, an electronic package comprises a package substrate, and a first die over the package substrate. In an embodiment, the first die comprises a first IO bump map, where bumps of the first IO bump map have a first pitch. In an embodiment, the electronic package further comprises a second die over the package substrate. In an embodiment, the second die comprises a second IO bump map, where bumps of the second IO bump map have a second pitch that is different than the first pitch. In an embodiment, the electronic package further comprises interconnects between the first IO bump map and the second IO bump map.

Abstract: A cavity resonator tuning diaphragm comprising a plurality of inner corrugations, the plurality of inner corrugations having a first depth. An outer corrugation located between the plurality of inner corrugations and a perimeter of the diaphragm is also included, the outer corrugation having a second depth greater than the first depth. The addition of the outer deep corrugation provides increased thermal stability and reduced required actuation voltage.

Abstract: A shell, a method of preparing the shell and an electronic product comprising the shell are provided. The shell may comprise: a metal shell body, a plastic part made of a resin, and an oxide layer formed between the metal body and the plastic part, joining the plastic part to the metal shell body, wherein the oxide layer contains corrosion pores having an average diameter of about 200 nm to about 2000 nm in the surface contacting the plastic part, and nanopores having a diameter of about 10 to 100 nm in the surface contacting the metal shell body, and a part of the resin is filled in the corrosion pore and corrosion pore.

Abstract: A cavity resonator tuning diaphragm comprising a plurality of inner corrugations, the plurality of inner corrugations having a first depth. An outer corrugation located between the plurality of inner corrugations and a perimeter of the diaphragm is also included, the outer corrugation having a second depth greater than the first depth. The addition of the outer deep corrugation provides increased thermal stability and reduced required actuation voltage.

Abstract: A cavity resonator tuning diaphragm comprising a plurality of inner corrugations, the plurality of inner corrugations having a first depth. An outer corrugation located between the plurality of inner corrugations and a perimeter of the diaphragm is also included, the outer corrugation having a second depth greater than the first depth. The addition of the outer deep corrugation provides increased thermal stability and reduced required actuation voltage.

Abstract: A shell, a method of preparing the shell and an electronic product comprising the shell are provided. The shell may comprise: a metal shell body, a plastic part made of a resin, and an oxide layer formed between the metal body and the plastic part, joining the plastic part to the metal shell body, wherein the oxide layer contains corrosion pores having an average diameter of about 200 nm to about 2000 nm in the surface contacting the plastic part, and nanopores having a diameter of about 10 to 100 nm in the surface contacting the metal shell body, and a part of the resin is filled in the corrosion pore and corrosion pore.

Abstract: An aluminum alloy, an aluminum alloy resin composite, a method of preparing aluminum alloy, and a method of preparing aluminum alloy-resin composite are provided. The aluminum alloy may comprise: an aluminum alloy substrate; and an oxide layer formed on the surface of the aluminum alloy substrate. The oxide layer comprises an outer surface and an inner surface. The outer surface contains corrosion pores having an average diameter of about 200 nm to about 2000 nm; and the inner surface contains nanopores having an average diameter of about 10 nm to about 100 nm.